Abstract:
Disclosed is an optoelectronic semiconductor chip (1) comprising a radiation-permeable surface (3), a metallic contact coating (2a) that is applied to the radiation-permeable surface (3), and a first series of reflecting layers (2b) which is applied to the surface of the metallic contact coating (2a) facing away from the radiation-permeable surface (3). Also disclosed is an optoelectronic component comprising such a chip.
Abstract:
The invention relates to a light source, particularly a projection light source for a projection system, comprising a multitude of semiconductor chips and at least two, preferably three different electromagnetic radiation-emitting types of chips with different emission spectra. Each semiconductor chip has a chip extraction surface via which the radiation is extracted. The light source also a multitude of primary optics elements, and a primary optics element is assigned to each semiconductor chip. Each primary optics element has a light input and a light output and reduces the divergence of at least one portion of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips are arranged with the primary optics elements in at least two interspaced groups so that the groups emit separate cones of light when the semiconductor chips are in operation. The separate cones of lights of the groups are superimposed by means of secondary optics to form a combined cone of light.
Abstract:
The invention relates to a chip assembly for an optoelectronic component, comprising at least one semiconductor chip (1) emitting electromagnetic radiation and a connecting assembly, said connecting assembly (2) having a plurality of planes (3, 4) that are electrically insulated from each other.
Abstract:
Disclosed is a light emitting module (20) comprising at least two light sources (1) which are applied to a common support (7). At least one of the light sources (1) encompasses at least two light emitting diode chips (2). An optical member (3) of an optical element (5) is mounted downstream from each light source (1) of the module. Said optical members (3) are suitable for guiding electromagnetic radiation to a light discharging area (4) of the optical element (5). Also disclosed is an optical projection apparatus comprising such a light emitting module.
Abstract:
The invention relates to an optoelectronic component that emits electromagnetic radiation. Said component comprises a housing body with a cavity that is configured as a trench, a plurality of semiconductor chips being arranged in a line in the cavity. Two neighbouring semiconductor chips are spaced at a distance from one another, which is less than or equal to one and a half lateral edge lengths of the semiconductor chip and greater than or equal to 0 µm. The invention also relates to an illumination module comprising a component of this type.
Abstract:
The invention relates to a method for producing a ceramic housing (1), in which a ceramic base body (4) is first produced from a ceramic base (2) and lateral sections (3). A metal frame (7) is subsequently mounted onto the ceramic base body (4) and a window (11) is soldered to a lateral opening (6). After the insertion of a photoactive semiconductor chip into the ceramic base body (4), the ceramic housing (1) is sealed with a metal cover (12).
Abstract:
Es wird ein Messsystem (1) angegeben, das eine Sendereinheit (10) mit zumindest einer individuell betreibbaren Leuchtdioden-Leuchteinheit (12) mit einer Leuchtfläche (106) aufweist, die eine charakteristische Längenausdehnung (107) von kleiner oder gleich 100 µm und/oder eine Fläche von kleiner oder gleich 104 µm2 aufweist, wobei die Leuchtdioden-Leuchteinheit (12) dazu eingerichtet ist, im Betrieb zumindest einen Lichtpuls als Sendersignal (11) abzustrahlen, und die eine Empfängereinheit (20) mit zumindest einer Detektoreinheit (22) zum Empfang eines Rücksignals (21) aufweist, das zumindest einen Teil des von einem externen Objekt zurückgestrahlten Sendersignals (11) aufweist. Weiterhin werden eine Verwendung zumindest einer individuell betreibbaren Leuchtdioden-Leuchteinheit als Sendereinheit in einem Messsystem, ein Verfahren zum Betrieb eines Messsystems und eine Beleuchtungsquelle mit einem Messsystem angegeben.
Abstract:
Es wird ein optoelektronischer Halbleiterchip (4) angegeben mit: – einem Halbleiterkörper (1), der im Betrieb elektromagnetische Strahlung von einer Vorderseite (2) aussendet, und – einer separat gefertigten Streuschicht (5) auf der Vorderseite (2) des Halbleiterkörpers (1), die dazu vorgesehen ist, die Strahlung des Halbleiterkörpers (1) zu streuen. Es wird weiterhin ein optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip angegeben.
Abstract:
The source has a luminescence conversion element (420) arranged at a distance from a primary radiation source (410) i.e. white light source. The conversion element converts the wavelength of a part of primary radiation into secondary radiation along a main beam direction using a luminescence material. A reflector element (490a) e.g. dichroic mirror, is arranged and guided in an optical path of the primary radiation source and guides the primary radiation on the material or deflects the secondary radiation delivered from the material in a direction of the primary radiation source. The luminescence material is selected from a group consisting of mono-crystal material and ceramic material. An independent claim is also included for a light source arrangement with a semiconductor light source.