公开(公告)号：WO2014202464A1

公开(公告)日：2014-12-24

申请号：PCT/EP2014/062268

申请日：2014-06-12

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： STOLL, Ion ,  SCHUMANN, Michael ,  PLÖTZ, Ludwig

IPC: H01L33/50 ,  H01L25/075 ,  C09K11/77 ,  F21K99/00 ,  H05B33/08 ,  H01L33/58

CPC classification number: H01L25/0753 ,  C09K11/7774 ,  C09K11/7792 ,  F21K9/64 ,  H01L33/504 ,  H01L33/58 ,  H01L2924/0002 ,  H05B33/0857 ,  H05B33/14 ,  H01L2924/00

Abstract: Die Erfindung betrifft eine Anordnung zur Erzeugung von Mischlicht, welche drei im blauen Spektralbereich emittierende Halbleiterchips von drei Bauelementen aufweist. In den Lichtwegen der einzelnen Halbleiterchips sind unterschiedliche Konversionselemente angeordnet, welche dazu eingerichtet sind, Primärstrahlung in Sekundärstrahlung zu konvertieren. Die aus den jeweiligen Bauelementen (10, 20, 30) austretende Summenstrahlung (S1, S2, S3) weist einen entsprechenden Farbort auf der Schwarzkörper-Kurve des CIE-Farbdiagramms 1931 auf oder liegt innerhalb eines Farbvierecks des CIE Farbdiagramms.

Abstract translation: 本发明涉及一种用于具有三个混合发光三种成分的蓝色光谱的半导体芯片产生的布置。 在各个半导体芯片不同的转换元件被布置，其适合于将初级辐射转换为次级辐射的光路。 从各装置（10，20，30）的新兴总和辐射（S1，S2，S3）对或CIE颜色图表的颜色四边形内的CIE色度图1931的黑体曲线上的对应的色点。

公开(公告)号：WO2011003788A1

公开(公告)日：2011-01-13

申请号：PCT/EP2010/059288

申请日：2010-06-30

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  HÖHN, Klaus ,  SCHUMANN, Michael ,  SOSSENHEIMER, Dirk

Inventor： HÖHN, Klaus ,  SCHUMANN, Michael ,  SOSSENHEIMER, Dirk

IPC: G02B5/20 ,  G02B5/22 ,  C08K13/02 ,  C08L83/04 ,  H01L31/0232

CPC classification number: G02B5/208 ,  C09D183/04 ,  G02B5/223 ,  H01L31/02162 ,  H01L31/0232 ,  H01L31/103 ,  C08L83/00

Abstract: Zusammensetzung zur Herstellung eines Filtermaterials für Strahlung, umfassend einem Silikon, und zumindest einen Farbstoff, der im Silikon dispergiert ist, wobei die Zusammensetzung für Strahlung der Wellenlänge zwischen 400 nm und 700 nm eine relative Transmission von kleiner 20% aufweist, und für Strahlung der Wellenlänge zwischen 850 nm und 1025 nm eine relative Transmission von über 50% aufweist.

Abstract translation: 一种用于制作过滤材料对于辐射包含有机硅组合物，和至少一种染料，其分散在硅氧烷，其中，用于400纳米和700纳米，小于20％的相对透射之间的波长的辐射的组合物，和用于波长的辐射 850纳米和1025纳米之间具有超过50％的相对传输。

公开(公告)号：EP2452215B1

公开(公告)日：2017-08-09

申请号：EP10726980.5

申请日：2010-06-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： HÖHN, Klaus ,  SCHUMANN, Michael ,  SOSSENHEIMER, Dirk

IPC: C09D183/04 ,  G02B5/20 ,  G02B5/22 ,  C08K13/02 ,  C08L83/04 ,  H01L31/0232

CPC classification number: G02B5/208 ,  C09D183/04 ,  G02B5/223 ,  H01L31/02162 ,  H01L31/0232 ,  H01L31/103 ,  C08L83/00

公开(公告)号：EP2452215A1

公开(公告)日：2012-05-16

申请号：EP10726980.5

申请日：2010-06-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： HÖHN, Klaus ,  SCHUMANN, Michael ,  SOSSENHEIMER, Dirk

IPC: G02B5/20 ,  G02B5/22 ,  C08K13/02 ,  C08L83/04 ,  H01L31/0232

CPC classification number: G02B5/208 ,  C09D183/04 ,  G02B5/223 ,  H01L31/02162 ,  H01L31/0232 ,  H01L31/103 ,  C08L83/00

Abstract: The invention relates to a composition for producing a filter material for radiation, comprising a silicone, and at least one colorant dispersed in the silicone, wherein the composition comprises a relative transmission for radiation of the wavelengths between 400 nm and 700 nm of less than 20%, and a relative transmission for radiation of the wavelengths between 850 nm and 1025 nm of greater than 50%.

Abstract translation: 组合物用于生产过滤材料对于辐射包括硅树脂和分散在该有机硅的至少一种染料，worin所述组合物具有小于20％为400至700nm的波长的辐射的相对传输，并且具有相对的传输 对于850纳米波长为1025纳米的辐射大于50％。

公开(公告)号：EP2005111A1

公开(公告)日：2008-12-24

申请号：EP07722188.5

申请日：2007-04-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： MÖLLMER, Frank ,  SINGER, Frank ,  SCHUMANN, Michael ,  HAUSHALTER, Martin ,  HÖFER, Thomas ,  RÜTH, Christine ,  STRÜWING, Stefan

IPC: G01C9/10 ,  G01P13/00

CPC classification number: G01C9/10 ,  G01C2009/066 ,  G01C2009/107

Abstract: The invention relates to a tilt sensor (1) having at least one body (3) which can be moved along a predefined path (24), and to an optoelectronic unit for determining the position of the body (3), wherein the tilt sensor (1) is surface-mountable. Furthermore, the invention relates to a tilt sensor arrangement (17).

公开(公告)号：EP2345076A1

公开(公告)日：2011-07-20

申请号：EP09796598.2

申请日：2009-10-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： KUHLMANN, Werner ,  SCHUMANN, Michael ,  HOEFER, Thomas

IPC: H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The invention specifies a surface-mountable apparatus (100) which has a mounting face (101), an upper face (102) which is situated opposite the mounting face (101), an electrically insulating support plate (1), an electrical component (2) and a housing (3). The support plate (1) closes off the apparatus (100) with respect to the mounting face (101). The support plate (1) also has an attachment face (103) which is situated opposite the mounting face (101). In order to make electrical contact with the component (2), the support plate (1) has conductor tracks (4) which are arranged on the attachment face (103), contact areas (5) which are arranged on the mounting face (101), and apertures (6), in each case one contact area (5) being electrically conductively connected to a conductor track (4) by means of an aperture (6). The component (2) is enclosed by the housing (3), with at least one aperture (6) being arranged beneath the component (2). The housing (3) and the support plate (1) are arranged flush with one another when the support plate (1) is viewed from above. Furthermore, the housing (3) closes off the apparatus (100) with respect to the upper face (102).

公开(公告)号：EP2345076B1

公开(公告)日：2018-08-01

申请号：EP09796598.2

申请日：2009-10-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： KUHLMANN, Werner ,  SCHUMANN, Michael ,  HOEFER, Thomas

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49827 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

公开(公告)号：EP2636287A1

公开(公告)日：2013-09-11

申请号：EP11778799.4

申请日：2011-10-21

Applicant: Heraeus Materials Technology GmbH & Co. KG ,  OSRAM Opto Semiconductors GmbH

Inventor： KLEIN, Andreas ,  DITZEL, Eckhard ,  KRUEGER, Frank ,  SCHUMANN, Michael

IPC: H05K1/18 ,  H05K3/40 ,  H01L33/60 ,  H01L33/62 ,  H01L23/498

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/36 ,  H01L24/32 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/29339 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/00 ,  H05K3/4084 ,  H05K2201/0355 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0278 ,  H05K2203/049 ,  H05K2203/063 ,  H05K2203/1484 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator.

Abstract translation: 提供层压体和用于制造层压体的方法用于使至少一个电子部件接触。 在至少一个接触区域中彼此电接触的第一和第二金属层之间层压绝缘层。 在第一金属层中产生至少一个压花和/或凸起的接触区域中的至少一个凹部。 两个金属层之间的距离减小，使得压花/凸起的尺寸足以用于将导电方式插入并连接到压花/凸起中的电子部件。 电子部件相对于其圆周以至少部分地相对于电子部件的高度（H）整体地被压花/凸起吸收。 层压板可用作电路板，传感器，LED灯，手机部件，控制或调节器。