-
公开(公告)号：EP4519763A1
公开(公告)日：2025-03-12
申请号：EP23727180.4
申请日：2023-04-25
Applicant: QUALCOMM INCORPORATED
Inventor： BALASUBRAMANIAN, Sundar Rajan , SUDARSANAN, Srijesh , HOFFMAN, Marc , MATHEW, Deepak , SWEENEY, Gerald , LEE, James , JAIN, Mansi
IPC: G06F9/30
-
公开(公告)号：EP4405831A1
公开(公告)日：2024-07-31
申请号：EP22772756.7
申请日：2022-08-24
Applicant: QUALCOMM INCORPORATED
Inventor： LAHOTI, Saurabh , HOFFMAN, Marc , SUDARSANAN, Srijesh , DONG, Hongfeng
CPC classification number: G06F17/144 , G06F9/30036 , G06F9/30014
-
Search Results
12
records
(took 0.02 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
