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公开(公告)号:EP4519763A1
公开(公告)日:2025-03-12
申请号:EP23727180.4
申请日:2023-04-25
Applicant: QUALCOMM INCORPORATED
Inventor: BALASUBRAMANIAN, Sundar Rajan , SUDARSANAN, Srijesh , HOFFMAN, Marc , MATHEW, Deepak , SWEENEY, Gerald , LEE, James , JAIN, Mansi
IPC: G06F9/30
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2.
公开(公告)号:EP4515455A1
公开(公告)日:2025-03-05
申请号:EP23717696.1
申请日:2023-03-20
Applicant: QUALCOMM INCORPORATED
Inventor: SUDARSANAN, Srijesh , MATHEW, Deepak , HOFFMAN, Marc , BALASUBRAMANIAN, Sundar Rajan , JAIN, Mansi , LEE, James , SWEENEY, Gerald
IPC: G06N3/048 , G06N3/0499 , G06N3/063
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公开(公告)号:EP4515378A1
公开(公告)日:2025-03-05
申请号:EP23718419.7
申请日:2023-03-20
Applicant: QUALCOMM INCORPORATED
Inventor: SUDARSANAN, Srijesh , MATHEW, Deepak , HOFFMAN, Marc , BALASUBRAMANIAN, Sundar Rajan , JAIN, Mansi , LEE, James , SWEENEY, Gerald
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