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公开(公告)号：EP3364165A3
公开(公告)日：2018-12-26
申请号：EP18152565.0
申请日：2018-01-19
Applicant: Rosemount Aerospace Inc.
Inventor： GOLLY, Timothy Thomas , POTASEK, David P. , HUYNH, Cuong Tho
Abstract: A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
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公开(公告)号：EP3321655A1
公开(公告)日：2018-05-16
申请号：EP17201370.8
申请日：2017-11-13
Applicant: Rosemount Aerospace Inc.
Inventor： POTASEK, David P. , HOULIHAN, Sean
IPC: G01L9/00
CPC classification number: B81B3/0086 , B81B3/0081 , B81B2201/0264 , B81B2207/07 , B81C1/00269 , B81C2201/013 , B81C2201/014 , G01L9/0047 , G01L9/0073
Abstract: A configuration for a capacitive pressure sensor uses a silicon on insulator wafer to create an electrically isolated sensing node across a gap from a pressure sensing wafer. The electrical isolation, small area of the gap, and silicon material throughout the capacitive pressure sensor allow for minimal parasitic capacitance and avoid problems associated with thermal mismatch.
Abstract translation: 用于电容式压力传感器的配置使用绝缘体上硅晶片来跨压力感测晶片的间隙形成电隔离感测节点。 整个电容式压力传感器的电气隔离，间隙的小面积和硅材料允许最小的寄生电容并避免与热失配相关的问题。
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公开(公告)号：EP3205998A1
公开(公告)日：2017-08-16
申请号：EP17155350.6
申请日：2017-02-09
Applicant: Rosemount Aerospace Inc.
Inventor： POTASEK, David P. , LITTLE, Charles , ZHANG, Weibin
CPC classification number: G01L19/0645 , G01L9/0052 , G01L9/0072 , G01L19/0618 , G01L19/146 , G01L19/147
Abstract: A pressure sensor comprising a housing (62, 64), a diaphragm wafer (68), and an isolator (66) configured to absorb lateral stress. The diaphragm wafer (68) includes a fully exposed diaphragm (69), a fluid contact surface, a sensing element (74), and a support portion, where the support portion and the contact surface define a cavity. The isolator (66) extends laterally from the support portion to the housing (62, 64). The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm (69) can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.
Abstract translation: 一种压力传感器，包括壳体（62,64），隔膜晶片（68）和构造成吸收侧向应力的隔离器（66）。 隔膜晶片（68）包括完全暴露的隔膜（69），流体接触表面，感测元件（74）和支撑部分，其中支撑部分和接触表面限定了空腔。 隔离器（66）从支撑部分横向延伸到壳体（62,64）。 压力传感器很容易排空，消除了微粒的积聚，膜片（69）可以直接引线键合到印刷电路板上，从而不需要大量的电气馈通。
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14.发明公开PRESSURE SENSOR PACKAGE WITH STRESS ISOLATION FEATURES 有权DRUCKSENSORGEHÄUSEMIT BELASTUNGSISOLIERUNGSMERKMALEN
公开(公告)号：EP3095756A1
公开(公告)日：2016-11-23
申请号：EP16170089.3
申请日：2016-05-18
Applicant: Rosemount Aerospace Inc.
Inventor： POTASEK, David P. , STUELKE, Robert
IPC: B81B7/00
CPC classification number: B81B7/0058 , B81B7/0048 , B81B2207/015 , H01L2224/48247
Abstract: A sensor package (100) includes a manifold (102) and a MEMS die (104). The manifold (102) includes a cylindrical body (106), a flange (110), and a mounting surface (120). The cylindrical body (106) defines a first passage (112) that extends longitudinally along a central axis from a first exterior end (114) to an interior end (116) of the cylindrical body (106). The flange (110) extends from the cylindrical body (106) and has an outer periphery that is configured to support a print circuit board (126). The mounting surface (120) is disposed at the interior end (116) of the first passage (112). The surface area of the mounting surface (120) is less than the surface area of a MEMS die (104) configured to mate with the mounting surface (120).
Abstract translation: 传感器封装（100）包括歧管（102）和MEMS管芯（104）。 歧管（102）包括圆柱体（106），凸缘（110）和安装表面（120）。 圆柱体（106）限定第一通道（112），其沿着中心轴线从第一外端（114）纵向延伸到圆柱形本体（106）的内端（116）。 凸缘（110）从圆柱体（106）延伸并且具有被配置为支撑印刷电路板（126）的外周边。 安装表面（120）设置在第一通道（112）的内端（116）处。 安装表面（120）的表面积小于构造成与安装表面（120）配合的MEMS管芯（104）的表面积。
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公开(公告)号：EP4194832A3
公开(公告)日：2023-09-27
申请号：EP22208879.1
申请日：2022-11-22
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： POTASEK, David P. , STUELKE, Robert
Abstract: A pressure sensor includes a Wheatstone bridge circuit including a first resistor (R1), a second resistor (R2), a third resistor (R3), and a fourth resistor (R4) having matching output characteristics. The pressure sensor further includes a first trim resistor (RG, RS) in series with the Wheatstone bridge circuit, wherein the first trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge. The pressure sensor additionally includes a second trim resistor (RZ, RV) in parallel or a parallel loop with the Wheatstone bridge circuit, wherein the second trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge.
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Patent Agency Ranking
公开(公告)号：EP4194832A2
公开(公告)日：2023-06-14
申请号：EP22208879.1
申请日：2022-11-22
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： POTASEK, David P. , STUELKE, Robert
Abstract: A pressure sensor includes a Wheatstone bridge circuit including a first resistor (R1), a second resistor (R2), a third resistor (R3), and a fourth resistor (R4) having matching output characteristics. The pressure sensor further includes a first trim resistor (RG, RS) in series with the Wheatstone bridge circuit, wherein the first trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge. The pressure sensor additionally includes a second trim resistor (RZ, RV) in parallel or a parallel loop with the Wheatstone bridge circuit, wherein the second trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge.
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公开(公告)号：EP3770111A1
公开(公告)日：2021-01-27
申请号：EP19212914.6
申请日：2019-12-02
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： DOSEV, Dosi , POTASEK, David P. , CHILDRESS, Marcus Allen
IPC: B81B3/00
Abstract: A MEMS device includes a first layer (36), a second layer (38) connected to the first layer, a first mooring portion (40), a second mooring portion (42), and a MEMS device body (44). The MEMS device body is connected to the first mooring portion and the second mooring portion. The MEMS device body further includes a first cantilever (78) attached to the first mooring portion, a second cantilever (82) attached to the second mooring portion, and a spring (80). The spring is in operable communication with the first cantilever and the second cantilever.
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公开(公告)号：EP3742610A1
公开(公告)日：2020-11-25
申请号：EP19210062.6
申请日：2019-11-19
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： POTASEK, David P.
Abstract: Provided are embodiments for a resistor array. The resistor array includes a plurality of resistor elements, where the plurality of resistor elements includes a redundancy region for a most significant bit of an expected value. The resistor array also includes one or more switches coupled to the plurality of resistor elements, and a first terminal and a second terminal coupled to the plurality of resistor elements. Also provided are embodiments for trimming the resistor array where the resistor array includes a redundancy region for a most significant bit for an expected value.
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公开(公告)号：EP3321655B1
公开(公告)日：2019-10-09
申请号：EP17201370.8
申请日：2017-11-13
Applicant: Rosemount Aerospace Inc.
Inventor： POTASEK, David P. , HOULIHAN, Sean
IPC: G01L9/00
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公开(公告)号：EP3315935A3
公开(公告)日：2018-09-12
申请号：EP17198026.1
申请日：2017-10-24
Applicant: Rosemount Aerospace Inc.
Inventor： POTASEK, David P.
CPC classification number: B81C3/001 , B81B3/0021 , B81B2201/0264 , B81B2207/012 , B81B2207/07 , B81C2201/013 , B81C2201/019 , B81C2203/0172 , G01L9/0042 , G01L19/148
Abstract: A MEMS device with electronics integration places integrated circuit components on a topping wafer (120A) of a sensing die to conserve space, minimize errors and reduce cost of the device as a whole. The topping wafer is bonded to a sensing wafer (118) and secured in a housing (138).
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