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公开(公告)号：EP3249372B1
公开(公告)日：2019-08-28
申请号：EP17172484.2
申请日：2017-05-23
Applicant: Rosemount Aerospace Inc.
Inventor： GOLDEN, Jim , STUELKE, Robert
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2.发明公开PRESSURE SENSOR PACKAGE WITH STRESS ISOLATION FEATURES 有权DRUCKSENSORGEHÄUSEMIT BELASTUNGSISOLIERUNGSMERKMALEN
公开(公告)号：EP3095756A1
公开(公告)日：2016-11-23
申请号：EP16170089.3
申请日：2016-05-18
Applicant: Rosemount Aerospace Inc.
Inventor： POTASEK, David P. , STUELKE, Robert
IPC: B81B7/00
CPC classification number: B81B7/0058 , B81B7/0048 , B81B2207/015 , H01L2224/48247
Abstract: A sensor package (100) includes a manifold (102) and a MEMS die (104). The manifold (102) includes a cylindrical body (106), a flange (110), and a mounting surface (120). The cylindrical body (106) defines a first passage (112) that extends longitudinally along a central axis from a first exterior end (114) to an interior end (116) of the cylindrical body (106). The flange (110) extends from the cylindrical body (106) and has an outer periphery that is configured to support a print circuit board (126). The mounting surface (120) is disposed at the interior end (116) of the first passage (112). The surface area of the mounting surface (120) is less than the surface area of a MEMS die (104) configured to mate with the mounting surface (120).
Abstract translation: 传感器封装（100）包括歧管（102）和MEMS管芯（104）。 歧管（102）包括圆柱体（106），凸缘（110）和安装表面（120）。 圆柱体（106）限定第一通道（112），其沿着中心轴线从第一外端（114）纵向延伸到圆柱形本体（106）的内端（116）。 凸缘（110）从圆柱体（106）延伸并且具有被配置为支撑印刷电路板（126）的外周边。 安装表面（120）设置在第一通道（112）的内端（116）处。 安装表面（120）的表面积小于构造成与安装表面（120）配合的MEMS管芯（104）的表面积。
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Patent Agency Ranking
公开(公告)号：EP3736553A1
公开(公告)日：2020-11-11
申请号：EP19210205.1
申请日：2019-11-19
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： GOLDEN, Jim , POTASEK, David P. , STUELKE, Robert
Abstract: A pressure sensor assembly is formed by: forming an inlet channel (108) by brazing a transition portion (114) to a pressure port (116) with a high temperature brazing processes, wherein the transition portion and the pressure port are both hollow tubular members and are formed of different materials, the pressure port including a base (202) and a projection (204) extending therefrom; after the inlet channel is formed, joining a header (122) and a sensor (104) to the pressure port with a soldering process that is at a lower temperature than the high temperature brazing process, wherein the header is joined to the base of the pressure port and the sensor is joined to the projection of the pressure port and is in fluid communication with a fluid to be measured through the pressure port; and welding a cover (120) to the header.
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公开(公告)号：EP3249372A1
公开(公告)日：2017-11-29
申请号：EP17172484.2
申请日：2017-05-23
Applicant: Rosemount Aerospace Inc.
Inventor： GOLDEN, Jim , STUELKE, Robert
IPC: G01L19/14
CPC classification number: B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81C1/00309 , B81C2203/019 , G01L9/0042 , G01L13/025 , G01L19/04 , G01L19/147
Abstract: A differential pressure sensor may include a body with a first end, second end and wall wherein the first and second ends comprise isolator diaphragms connected to first and second process fluid inlets. A MEMS pressure sensor (32) including a pressure sensing diaphragm (D) with first and second sides may be mounted on a hollow pedestal (25) adhesively attached to an annular bottom (46) of a cylindrical cavity (44) wherein the first side of the sensor is coupled to the first isolator diaphragm (36) by a first fill fluid and the second side of the sensor is coupled to the second isolator diaphragm (38) through the interior of the hollow pedestal by a second fill fluid volume wherein the first and second fill fluid volumes are separated by an adhesive seal (48) between the bottom of the cylindrical cavity and the bottom of the hollow pedestal wherein the cylindrical cavity comprises a first cylindrical wall (51) with a first diameter in contact with the annular bottom, a frustroconical portion (52) in contact with the first cylindrical wall and in contact with a second cylindrical wall (54) with a second diameter larger than the first diameter such that the increased distance between the pedestal and the cylindrical wall prevents adhesive moving up the space between the pedestal and cavity wall from the bottom of the cavity when the pressure sensor and hollow pedestal are mounted in the cavity. The sensor further includes sensor elements (20) on the MEMS diaphragm that provide an indication of pressure differences between the first and second process fluids.
Abstract translation: 差压传感器可包括具有第一端，第二端和壁的主体，其中第一和第二端包括连接到第一和第二过程流体入口的隔离膜片。 包括具有第一侧和第二侧的压力感测隔膜（D）的MEMS压力传感器（32）可以安装在粘附到圆柱形空腔（44）的环形底部（46）的中空基座（25）上，其中第一侧 传感器的第一侧通过第一填充流体联接到第一隔离器膜片（36），并且传感器的第二侧通过第二填充流体容器通过中空基座的内部联接到第二隔离器膜片（38），其中 第一和第二填充流体体积通过圆柱形腔体的底部和中空基座的底部之间的粘合密封件（48）分开，其中圆柱形腔体包括具有第一直径的第一圆柱形壁（51） 底部，与第一圆柱形壁接触并与具有大于第一直径的第二直径的第二圆柱形壁（54）接触的截头圆锥形部分（52），使得 当压力传感器和空心基座安装在空腔中时，基座和圆柱形壁防止粘合剂从空腔的底部向上移动基座和空腔壁之间的空间。 传感器还包括MEMS隔膜上的传感器元件（20），其提供第一和第二过程流体之间的压力差的指示。
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公开(公告)号：EP4194832A3
公开(公告)日：2023-09-27
申请号：EP22208879.1
申请日：2022-11-22
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： POTASEK, David P. , STUELKE, Robert
Abstract: A pressure sensor includes a Wheatstone bridge circuit including a first resistor (R1), a second resistor (R2), a third resistor (R3), and a fourth resistor (R4) having matching output characteristics. The pressure sensor further includes a first trim resistor (RG, RS) in series with the Wheatstone bridge circuit, wherein the first trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge. The pressure sensor additionally includes a second trim resistor (RZ, RV) in parallel or a parallel loop with the Wheatstone bridge circuit, wherein the second trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge.
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公开(公告)号：EP4194832A2
公开(公告)日：2023-06-14
申请号：EP22208879.1
申请日：2022-11-22
Applicant: ROSEMOUNT AEROSPACE INC.
Inventor： POTASEK, David P. , STUELKE, Robert
Abstract: A pressure sensor includes a Wheatstone bridge circuit including a first resistor (R1), a second resistor (R2), a third resistor (R3), and a fourth resistor (R4) having matching output characteristics. The pressure sensor further includes a first trim resistor (RG, RS) in series with the Wheatstone bridge circuit, wherein the first trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge. The pressure sensor additionally includes a second trim resistor (RZ, RV) in parallel or a parallel loop with the Wheatstone bridge circuit, wherein the second trim resistor has output characteristics matching the output characteristics of the first resistor, the second resistor, the third resistor, and the fourth resistor of the Wheatstone bridge.
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公开(公告)号：EP3095756B1
公开(公告)日：2018-04-11
申请号：EP16170089.3
申请日：2016-05-18
Applicant: Rosemount Aerospace Inc.
Inventor： POTASEK, David P. , STUELKE, Robert
IPC: B81B7/00
CPC classification number: B81B7/0058 , B81B7/0048 , B81B2207/015 , H01L2224/48247
Abstract: A sensor package (100) includes a manifold (102) and a MEMS die (104). The manifold (102) includes a cylindrical body (106), a flange (110), and a mounting surface (120). The cylindrical body (106) defines a first passage (112) that extends longitudinally along a central axis from a first exterior end (114) to an interior end (116) of the cylindrical body (106). The flange (110) extends from the cylindrical body (106) and has an outer periphery that is configured to support a print circuit board (126). The mounting surface (120) is disposed at the interior end (116) of the first passage (112). The surface area of the mounting surface (120) is less than the surface area of a MEMS die (104) configured to mate with the mounting surface (120).
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