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公开(公告)号:AT445259T
公开(公告)日:2009-10-15
申请号:AT04354025
申请日:2004-06-29
Applicant: COMMISSARIAT ENERGIE ATOMIQUE , ST MICROELECTRONICS SA
Inventor: ROBERT PHILIPPE , ANCEY PASCAL , CARUYER GREGORY
Abstract: The resonator has a piezoelectric layer (3) placed between two electrodes (1, 2). An electrical heating resistor (9) is placed in thermal contact with the electrode (1). The temporary heating of the electrode (1) permits to partially evaporate a material constituting the electrode (1) to make the electrode (1) thinner for adjusting resonance frequency. An independent claim is also included for a method of producing a thin film bulk acoustic resonator or a solidly mounted resonator.
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公开(公告)号:FR2929774A1
公开(公告)日:2009-10-09
申请号:FR0852316
申请日:2008-04-07
Applicant: ST MICROELECTRONICS SA , CENTRE NAT RECH SCIENT
Inventor: CARUYER GREGORY , SEGUENI KARIM , ANCEY PASCAL , DUBUS BERTRAND
Abstract: L'invention concerne un dispositif de résonance micro électromécanique (MEMS) comprenant :un substrat,une électrode d'entrée (EE), reliée à une source de courant alternatif de fréquence d'entrée (fi),une électrode de sortie (ES),au moins une structure d'ancrage, liée au substrat, etune structure vibratile, reliée à une structure d'ancrage par au moins une jonction, possédant une fréquence propre (fp) de résonance acoustique, et dont la vibration sous l'effet de l'électrode d'entrée (EE) lorsqu'elle est alimentée génère sur l'électrode de sortie (ES) un courant alternatif dont la fréquence de sortie est égale à la fréquence propre (fp),caractérisé en ce que la structure vibratile et/ou la structure d'ancrage comprennent une structure périodique, ladite structure périodique comprenant au moins des première (M1) et deuxième (M2) zones différentes l'une de l'autre, correspondant respectivement à des première et deuxième propriétés de propagation acoustique.
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公开(公告)号:DE602004015526D1
公开(公告)日:2008-09-18
申请号:DE602004015526
申请日:2004-04-01
Applicant: ST MICROELECTRONICS SA
Inventor: BOUCHE GUILLAUME , ANCEY PASCAL , CARUYER GREGORY
IPC: B81B3/00 , H01H61/06 , H03H3/00 , H03H3/02 , H03H3/10 , H03H9/00 , H03H9/02 , H03H9/17 , H03H9/46 , H03H9/54
Abstract: The tunable micro resonator (1) has a piezoelectric layer (3) sandwiched between two metallic electrodes (4,5). The resonator is mounted on a suspension beam which is formed as a bimetallic material which has controllable deformability. The beam can have heating inserts (22,23) and one or more inserted blocks (20,21) formed of a material with a different thermal expansion characteristic than the beam.
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公开(公告)号:DE60306196T2
公开(公告)日:2007-04-19
申请号:DE60306196
申请日:2003-11-27
Applicant: ST MICROELECTRONICS SA
Inventor: BOUCHE GUILLAUME , CARUYER GREGORY , ANCEY PASCAL
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公开(公告)号:FR2863789B1
公开(公告)日:2006-09-29
申请号:FR0314567
申请日:2003-12-12
Applicant: ST MICROELECTRONICS SA
Inventor: BOUCHE GUILLAUME , CARUYER GREGORY , ANCEY PASCAL
Abstract: An acoustic resonator device (1) comprises an active element (6) and a support. The support includes a membrane (5) and the active element provided with at least one piezoelectric layer (10) is surmounted by a multi-layer assembly (12) provided with at least three layers (13, 14, 15) of which at least one has a strong acoustic impedance and at least one a low acoustic impedance.
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公开(公告)号:FR2853473A1
公开(公告)日:2004-10-08
申请号:FR0304039
申请日:2003-04-01
Applicant: ST MICROELECTRONICS SA
Inventor: BOUCHE GUILLAUME , SMEARS NICK , ANCEY PASCAL , CARUYER GREGORY
Abstract: The electronic component has two resonators (3, 4) that are disposed on an upper surface of a silicon substrate. Each resonator has a lower electrode in contact with the upper surface, a piezoelectric active component disposed on the lower electrode and an upper electrode disposed on the active component. The respective lower electrodes are made of aluminum and molybdenum, to obtain frequencies at different resonance. Independent claims are also included for the following (a) an integrated circuit including the electronic component (b) a hybrid circuit including the electronic component (c) a filter comprising a electronic component (d) a process of fabrication of the electronic component.
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公开(公告)号:AU2003294093A1
公开(公告)日:2004-06-23
申请号:AU2003294093
申请日:2003-11-27
Applicant: ST MICROELECTRONICS SA
Inventor: BOUCHE GUILLAUME , CARUYER GREGORY , ANCEY PASCAL
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