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17 records (took 0.02 seconds)

    1.
    发明专利
    未知

    公开(公告)号：DE602004023457D1

    公开(公告)日：2009-11-19

    申请号：DE602004023457

    申请日：2004-06-29

    Applicant: ST MICROELECTRONICS SA ,  COMMISSARIAT ENERGIE ATOMIQUE

    Inventor： ROBERT PHILIPPE ,  ANCEY PASCAL ,  CARUYER GREGORY

    IPC: H03H3/04 ,  H03H9/17

    Abstract: The resonator has a piezoelectric layer (3) placed between two electrodes (1, 2). An electrical heating resistor (9) is placed in thermal contact with the electrode (1). The temporary heating of the electrode (1) permits to partially evaporate a material constituting the electrode (1) to make the electrode (1) thinner for adjusting resonance frequency. An independent claim is also included for a method of producing a thin film bulk acoustic resonator or a solidly mounted resonator.

    2.
    发明专利
    未知

    公开(公告)号：FR2857785A1

    公开(公告)日：2005-01-21

    申请号：FR0308715

    申请日：2003-07-17

    Applicant: COMMISSARIAT ENERGIE ATOMIQUE ,  ST MICROELECTRONICS SA

    Inventor： ROBERT PHILIPPE ,  ANCEY PASCAL ,  CARUYER GREGORY

    IPC: H03H3/04 ,  H03H9/17 ,  H01L41/047

    Abstract: The resonator has a piezoelectric layer (3) placed between two electrodes (1, 2). An electrical heating resistor (9) is placed in thermal contact with the electrode (1). The temporary heating of the electrode (1) permits to partially evaporate a material constituting the electrode (1) to make the electrode (1) thinner for adjusting resonance frequency. An independent claim is also included for a method of producing a thin film bulk acoustic resonator or a solidly mounted resonator.

    3.
    发明专利
    未知

    公开(公告)号：FR2857785B1

    公开(公告)日：2005-10-21

    申请号：FR0308715

    申请日：2003-07-17

    Applicant: COMMISSARIAT ENERGIE ATOMIQUE ,  ST MICROELECTRONICS SA

    Inventor： ROBERT PHILIPPE ,  ANCEY PASCAL ,  CARUYER GREGORY

    IPC: H03H3/04 ,  H03H9/17 ,  H01L41/047

    Abstract: The resonator has a piezoelectric layer (3) placed between two electrodes (1, 2). An electrical heating resistor (9) is placed in thermal contact with the electrode (1). The temporary heating of the electrode (1) permits to partially evaporate a material constituting the electrode (1) to make the electrode (1) thinner for adjusting resonance frequency. An independent claim is also included for a method of producing a thin film bulk acoustic resonator or a solidly mounted resonator.

    6.
    发明专利
    未知

    公开(公告)号：FR2853473B1

    公开(公告)日：2005-07-01

    申请号：FR0304039

    申请日：2003-04-01

    Applicant: ST MICROELECTRONICS SA

    Inventor： BOUCHE GUILLAUME ,  SMEARS NICK ,  ANCEY PASCAL ,  CARUYER GREGORY

    IPC: H01L27/20 ,  H03H9/15 ,  H03H9/58

    Abstract: The electronic component has two resonators (3, 4) that are disposed on an upper surface of a silicon substrate. Each resonator has a lower electrode in contact with the upper surface, a piezoelectric active component disposed on the lower electrode and an upper electrode disposed on the active component. The respective lower electrodes are made of aluminum and molybdenum, to obtain frequencies at different resonance. Independent claims are also included for the following (a) an integrated circuit including the electronic component (b) a hybrid circuit including the electronic component (c) a filter comprising a electronic component (d) a process of fabrication of the electronic component.

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