Integrated circuit including acoustic resonator
    1.
    发明专利
    Integrated circuit including acoustic resonator 审中-公开
    集成电路,包括声学谐振器

    公开(公告)号:JP2007074727A

    公开(公告)日:2007-03-22

    申请号:JP2006239571

    申请日:2006-09-04

    CPC classification number: H03H9/172 H03H3/02 H03H9/0547

    Abstract: PROBLEM TO BE SOLVED: To provide an acoustic resonator which is connected to a support of an integrated circuit, of which an architecture has minimum coarseness, and which can be made into thin film formation step of adjusting a resonant frequency. SOLUTION: The integrated circuit includes at least one interconnection level and an acoustic resonator provided with a support comprising at least one bilayer assembly comprising a layer of high acoustic impedance material and a layer of low acoustic impedance material, and an active element. The support further has a protruding element arranged on a metallization level of the interconnection level, thereby making it possible to produce an electrical contact between the interconnection level and the active element of the acoustic resonator. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种连接到集成电路的支撑件的声谐振器,其结构具有最小的粗糙度,并且可以制成调整谐振频率的薄膜形成步骤。 解决方案:集成电路包括至少一个互连级别和声学谐振器,该谐振器设置有包括至少一个双层组件的支撑件,该组合件包括高声阻抗材料层和低声阻抗材料层以及有源元件。 支撑件还具有布置在互连电平的金属化水平上的突出元件,从而使得可以在互连电平和声谐振器的有源元件之间产生电接触。 版权所有(C)2007,JPO&INPIT

    7.
    发明专利
    未知

    公开(公告)号:FR2854726B1

    公开(公告)日:2005-08-26

    申请号:FR0305649

    申请日:2003-05-09

    Abstract: A multiposition microswitch that includes a cavity, a mobile portion made of a deformable material extending above the cavity, at least three conductive tracks extending on the cavity bottom, and a contact pad on the lower surface of the mobile part. The mobile part is capable of deforming, under the action of a stressing mechanism, from an idle position where the contact pad is distant from the conductive tracks to an on position from among several distinct on positions. The contact pad electrically connects, in each distinct on position, at least two of the at least three conductive tracks, at least one of the conductive tracks connected to the contact pad in each distinct on position being different from the conductive tracks connected to the contact pad in the other distinct on positions.

    8.
    发明专利
    未知

    公开(公告)号:FR2848339B1

    公开(公告)日:2005-08-26

    申请号:FR0215370

    申请日:2002-12-05

    Abstract: The adhesion of a first element (1), of which at least a part of the surface is coated with silicon, on a second element (2), of which at least a part of the surface is coated with nickel, incorporates an adhesion stage effected by NiSi welding at greater than 250degreesC, the rugosity between the two parts of the surface of the two elements being less than 1 micron. An Independent claim is also included for an integrated circuit incorporating two elements joined by NiSi welding.

    10.
    发明专利
    未知

    公开(公告)号:FR2853473B1

    公开(公告)日:2005-07-01

    申请号:FR0304039

    申请日:2003-04-01

    Abstract: The electronic component has two resonators (3, 4) that are disposed on an upper surface of a silicon substrate. Each resonator has a lower electrode in contact with the upper surface, a piezoelectric active component disposed on the lower electrode and an upper electrode disposed on the active component. The respective lower electrodes are made of aluminum and molybdenum, to obtain frequencies at different resonance. Independent claims are also included for the following (a) an integrated circuit including the electronic component (b) a hybrid circuit including the electronic component (c) a filter comprising a electronic component (d) a process of fabrication of the electronic component.

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