公开(公告)号：FR2819940B1

公开(公告)日：2003-10-17

申请号：FR0100816

申请日：2001-01-22

Applicant: ST MICROELECTRONICS SA

Inventor： PRIOR CHRISTOPHE

IPC: H01L20060101 ,  H01L21/00 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203

Abstract: Method of fabricating an optical semiconductor package and optical semiconductor package containing an integrated circuit chip having on a front face an optical sensor and electrical connection regions distributed around this sensor, in which a transparent patch ( 6 ) lies in front of the front face of the chip without covering the electrical connection regions of this chip, plates ( 2, 7 ) defining between them a cavity ( 10 ) in which the said chip and the said patch are stacked and which have annular assembly faces ( 2 a , 7 a), electrical connection pads ( 15 ) are placed between the said electrical connection regions and one face ( 12 ) of the said cavity, electrical connection tracks ( 14 ) are carried by a plate ( 7 ) and lie on the said face ( 12 ) of the cavity in order to be in contact with the said pads, an adhesive layer ( 18 ) flying between the said assembly faces ( 2 a , 7 a), the said tracks ( 14 ) protruding in order to pass between the assembly faces of the said plates with a view to external connections and the plate located at the side of the said patch comprising an aperture located opposite the optical sensor.

公开(公告)号：FR2836281A1

公开(公告)日：2003-08-22

申请号：FR0202171

申请日：2002-02-20

Applicant: ST MICROELECTRONICS SA

Inventor： DIOT JEAN LUC ,  PRIOR CHRISTOPHE ,  TEYSSEYRE JEROME ,  MOSCICKI JEAN PIERRE

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: The flat grid is made of electrically conducting material and presents the front and the rear faces through which the main perforation (3) is made so to form the radially elongated legs (7) in a zone between a central platform (4) and a peripheral part (5). Certain legs (6) have the exterior and the interior extremities linking the peripheral part and the platform at 45 deg. angles, and other legs (7) have the exterior extremities linked to the peripheral part and the interior extremities at a distance from the platform. The grid (1) is designed so that it can be placed between two parts of a mould for injecting an encapsulation material demarcating at least one cavity where an integrated circuit chip is placed, and the rear face of the grid is in contact with the support surface of the mould. The platform (4) has at least one hollow-out on its rear face in the form of two grooves (9,10), and other grooves (12) link the hollow-out to the perforations (3). The platform (4) also has on its rear face the cavities (11) opening up in the perforation (3), and the linking grooves (12) are opening up into the cavities. The peripheral part (5) has at least one gas-escape perforation (16) extended at a distance from the main perforation (3), and a groove links the cavity to the perforation. The peripheral part (5) has also an elongated injection opening (13) skirting a peripheral part of the perforation, and a cavity in the form of a slit links the injection opening to the perforation. The body of semiconductor case is claimed and comprises the grid with central platform and elongated legs for electrical connections distributed around the platform, the means for encapsulating the integrated circuit chip fastened on the front face of the platform, and the means for electrical connections linking the chip and the legs. The encapsulation material extends from the rear face of the grid between the legs, and between the legs and the platform, and it forms on the front face of the grid a projecting ring traversed by the legs and to a distance of the interior and the exterior extremities.

公开(公告)号：FR2809228A1

公开(公告)日：2001-11-23

申请号：FR0006513

申请日：2000-05-22

Applicant: ST MICROELECTRONICS SA

Inventor： PRIOR CHRISTOPHE ,  ABELA JONATHAN

IPC: H01L21/56 ,  H01L23/31 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/0236

Abstract: An injection mold has a cavity for an integrated circuit to be encapsulated. An insert is fitted into the cavity and has a front surface parallel to a face of the circuit. The encapsulated circuit has a relatively smoother zone in the region of this front surface. An Independent claim is included for the following: (a) Transparent encapsulation is for an integrated circuit has an external surface with a relatively smoother zone. The smoother surface is parallel to an optical sensor in the circuit. Preferred Features: The cavity wall has an annular shoulder set into it for retaining the insert. The insert extends through the wall of the mold and into the cavity to form a recess in the molded material. One part of the mold has buttons for ejecting the encapsulated circuit.

公开(公告)号：FR2820240B1

公开(公告)日：2004-07-16

申请号：FR0101096

申请日：2001-01-26

Applicant: ST MICROELECTRONICS SA

Inventor： PRIOR CHRISTOPHE ,  HERARD LAURENT

IPC: H01L21/56 ,  H01L23/04 ,  H01L21/58

Abstract: A substrate, in particular, a multilayer substrate, includes a mounting and electrical-connection support, and a face for mounting at least one integrated circuit chip (IC chip). The substrate and the mounted IC chip are placed in an injection mold. The injection mold has two parts that surround the periphery of the substrate. One part of the injection mold defines a cavity for molding an encapsulation material thereby encapsulating the IC chip, and includes a face for bearing on the mounting face. At least one recess is provided in one part of the injection mold. The recess defines, above the mounting face, a slot for providing a vent for venting gases. The mounting face includes a region on which a metal outer layer is placed. The metal outer layer extends along the recess and on the bearing face on both sides of the recess.

公开(公告)号：FR2836281B1

公开(公告)日：2004-07-09

申请号：FR0202171

申请日：2002-02-20

Applicant: ST MICROELECTRONICS SA

Inventor： DIOT JEAN LUC ,  PRIOR CHRISTOPHE ,  TEYSSEYRE JEROME ,  MOSCICKI JEAN PIERRE

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/495

Abstract: The flat grid is made of electrically conducting material and presents the front and the rear faces through which the main perforation (3) is made so to form the radially elongated legs (7) in a zone between a central platform (4) and a peripheral part (5). Certain legs (6) have the exterior and the interior extremities linking the peripheral part and the platform at 45 deg. angles, and other legs (7) have the exterior extremities linked to the peripheral part and the interior extremities at a distance from the platform. The grid (1) is designed so that it can be placed between two parts of a mould for injecting an encapsulation material demarcating at least one cavity where an integrated circuit chip is placed, and the rear face of the grid is in contact with the support surface of the mould. The platform (4) has at least one hollow-out on its rear face in the form of two grooves (9,10), and other grooves (12) link the hollow-out to the perforations (3). The platform (4) also has on its rear face the cavities (11) opening up in the perforation (3), and the linking grooves (12) are opening up into the cavities. The peripheral part (5) has at least one gas-escape perforation (16) extended at a distance from the main perforation (3), and a groove links the cavity to the perforation. The peripheral part (5) has also an elongated injection opening (13) skirting a peripheral part of the perforation, and a cavity in the form of a slit links the injection opening to the perforation. The body of semiconductor case is claimed and comprises the grid with central platform and elongated legs for electrical connections distributed around the platform, the means for encapsulating the integrated circuit chip fastened on the front face of the platform, and the means for electrical connections linking the chip and the legs. The encapsulation material extends from the rear face of the grid between the legs, and between the legs and the platform, and it forms on the front face of the grid a projecting ring traversed by the legs and to a distance of the interior and the exterior extremities.

公开(公告)号：FR2809228B1

公开(公告)日：2003-10-17

申请号：FR0006513

申请日：2000-05-22

Applicant: ST MICROELECTRONICS SA

Inventor： PRIOR CHRISTOPHE ,  ABELA JONATHAN

IPC: H01L21/56 ,  H01L23/31 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/0236

公开(公告)号：FR2832252A1

公开(公告)日：2003-05-16

申请号：FR0114739

申请日：2001-11-14

Applicant: ST MICROELECTRONICS SA

Inventor： PRIOR CHRISTOPHE

IPC: H01L27/146 ,  H01L31/0203 ,  H01L23/16 ,  H01L23/10 ,  H01L23/32

Abstract: The semiconductor casing (1) comprises the support and electrical connection means in the form of a plate (2) with a cavity (4), a semiconductor component (8) whose front face (9) carries a sensor (10) and whose rear face (11) is supported at the bottom (5) of the cavity (4), and the positioning and locking means which include a ring insert (14) of elastic or thermo-plastic material such as silicone inserted in the space (12) between the semiconductor component and the wall of the cavity. The cavity wall (7) is counter-inclined, and the ring insert (14) is self-locked by wedging in the space (12). The encapsulation means include a ring wall (18) supported on the plate (2) and a transparent plate (20) mounted at a distance from the semiconductor component (8). In the second embodiment, the positioning and locking means include four corner inserts for holding the semiconductor component in the position with lower parts engaged in holes made in the bottom of the cavity and lateral parts supported on the front face of the support plate. The inserts are bonded to the support plate by an adhesive layer between the lateral parts of inserts and the front face of the support plate.

公开(公告)号：FR2820240A1

公开(公告)日：2002-08-02

申请号：FR0101096

申请日：2001-01-26

Applicant: ST MICROELECTRONICS SA

Inventor： PRIOR CHRISTOPHE ,  HERARD LAURENT

IPC: H01L21/56 ,  H01L23/04 ,  H01L21/58

Abstract: The invention concerns a substrate, in particular a multilayer substrate constituting a mounting and electrical connection support, having a mounting surface (2) for at least an integrated circuit chip (3) and capable of being placed, equipped with said chip, in an injection mould (8) having two parts enclosing between them the periphery of the substrate and one of which defines a cavity for moulding (15) a coating material to encapsulate said chip and has a support surface on said mounting surface wherein is provided at least a recess (16) defining, above said mounting surface, a slot (17) constituting a gas vent. Said mounting surface (2) has a zone whereon is provided an outer metal layer (6) arranged so as to extend along said recess (16) and on said support surface (12) on either side of said recess.

公开(公告)号：FR2819634A1

公开(公告)日：2002-07-19

申请号：FR0100473

申请日：2001-01-15

Applicant: ST MICROELECTRONICS SA

Inventor： PRIOR CHRISTOPHE

IPC: H01L21/56 ,  H01L31/0203 ,  H01L23/10

Abstract: The invention concerns a semiconductor package and its production method, wherein a semiconductor component (5) is fixed on a front surface of mounting and electrical connection means (2) and comprising a sensor (8), an insert (11) being supported on the front surface of said optical component, around said sensor and comprising an open passage (14) extending in front of said sensor, and encapsulating means (26) comprising a coating material which encloses said semiconductor component and the mounting and electrical connecting means, said passage comprising a cap (17).