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公开(公告)号：IT1320556B1
公开(公告)日：2003-12-10
申请号：ITTO20000739
申请日：2000-07-26
Inventor： CIGADA ANDREA , SHECHTER PIERRE YVES , KRITHIVASAN SIVAKUMA
IPC: B08B7/00
Abstract: A process for cleaning an integrated circuit package surface, comprising the steps of introducing the integrated circuit inside a plasma chamber; and of exposing the integrated circuit to a physical plasma obtained starting from a gas consisting of pure argon or any other noble gas having, in the plasma state, the behavior of a halogen, for example helium. The argon pla sma is obtained using the following energization parameters: energization time, 12-13 seconds; energization power, 140-160 W; plasma chamber pressure, 190-210 millitorr; and energization frequency, between 1 kHz and 100 GHz.
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公开(公告)号：ITTO20000739A1
公开(公告)日：2002-01-28
申请号：ITTO20000739
申请日：2000-07-26
Inventor： CIGADA ANDREA , SHECHTER PIERRE YVES , KRITHIVASAN SIVAKUMA
IPC: B08B7/00
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公开(公告)号：ITTO20000499A1
公开(公告)日：2001-11-30
申请号：ITTO20000499
申请日：2000-05-30
Inventor： CIGADA ANDREA , KRITHIVASAN SIVAKUMA , SHECHTER PIERRE YVES
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公开(公告)号：ITMI20001145D0
公开(公告)日：2000-05-23
申请号：ITMI20001145
申请日：2000-05-23
Applicant: ST MICROELECTRONICS SRL
Inventor： COGNETTI CARLO , CIGADA ANDREA , TIZIANI ROBERTO
IPC: H01L23/495
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