公开(公告)号：DE69225896D1

公开(公告)日：1998-07-16

申请号：DE69225896

申请日：1992-12-15

Applicant: ST MICROELECTRONICS SRL ,  SGS THOMSON MICROELECTRONICS

Inventor： COGNETTI CARLO ,  HUNDT MICHAEL J

IPC: H01L23/367 ,  H01L23/373 ,  H05K1/02 ,  H05K3/30 ,  H05K3/40

Abstract: A dam (14) is provided on a surface of a circuit board (10) to which an integrated circuit device (20) is to be mounted. The dam (14) defines a region (16) between the integrated circuit package (20) and the circuit board (10), and a material (24) is injected into this region (16) after the device (20) has been mounted on the circuit board (10). This material (24) preferably is a good thermal conductor, assisting in the removal of heat from the device (20). The injected material (24) also preferably acts as an adhesive, more firmly bonding the device (20) the circuit board (10).

公开(公告)号：ITMI20001145D0

公开(公告)日：2000-05-23

申请号：ITMI20001145

申请日：2000-05-23

Applicant: ST MICROELECTRONICS SRL

Inventor： COGNETTI CARLO ,  CIGADA ANDREA ,  TIZIANI ROBERTO

IPC: H01L23/495

公开(公告)号：IT1317559B1

公开(公告)日：2003-07-09

申请号：ITMI20001145

申请日：2000-05-23

Applicant: ST MICROELECTRONICS SRL

Inventor： TIZIANI ROBERTO ,  COGNETTI CARLO ,  CIGADA ANDREA

IPC: H01L23/495

公开(公告)号：ITMI20001145A1

公开(公告)日：2001-11-23

申请号：ITMI20001145

申请日：2000-05-23

Applicant: ST MICROELECTRONICS SRL

Inventor： COGNETTI CARLO ,  CIGADA ANDREA ,  TIZIANI ROBERTO

IPC: H01L23/495

公开(公告)号：DE69225896T2

公开(公告)日：1998-10-15

申请号：DE69225896

申请日：1992-12-15

Applicant: ST MICROELECTRONICS SRL ,  SGS THOMSON MICROELECTRONICS

Inventor： COGNETTI CARLO ,  HUNDT MICHAEL J

IPC: H01L23/367 ,  H01L23/373 ,  H05K1/02 ,  H05K3/30 ,  H05K3/40

Abstract: A dam (14) is provided on a surface of a circuit board (10) to which an integrated circuit device (20) is to be mounted. The dam (14) defines a region (16) between the integrated circuit package (20) and the circuit board (10), and a material (24) is injected into this region (16) after the device (20) has been mounted on the circuit board (10). This material (24) preferably is a good thermal conductor, assisting in the removal of heat from the device (20). The injected material (24) also preferably acts as an adhesive, more firmly bonding the device (20) the circuit board (10).