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    METHOD FOR FORMING PROTECTIVE PACKAGE AND MOLD FOR FORMING PROTECTIVE PACKAGE
    1.
    发明专利
    METHOD FOR FORMING PROTECTIVE PACKAGE AND MOLD FOR FORMING PROTECTIVE PACKAGE 审中-公开

    公开(公告)号：JP2002261108A

    公开(公告)日：2002-09-13

    申请号：JP2001401896

    申请日：2001-12-28

    Applicant: ST MICROELECTRONICS SRL

    Inventor： MAGNI PIERANGELO ,  CIGADA ANDREA

    IPC: G01L19/14 ,  H01L21/56 ,  H01L23/02

    Abstract: PROBLEM TO BE SOLVED: To provide a protective package for an electronic device where yield is improved without damaging an electronic device stored therein. SOLUTION: A method for forming the protective package comprises a step of using a mold 10, the mold comprising a half mold 15 that has a lug directing toward the inside of the mold, the lug being capable of elastic deformation and comprising one end having an element 17 that comes into contact with at least a part of an electronic circuit 13 by pressurizing contact, and a step of injecting resin into the mold so that the protective package has a hole part aligned with at least the part of the electronic circuit.

    6.
    发明专利
    未知

    公开(公告)号：ITTO20000739D0

    公开(公告)日：2000-07-26

    申请号：ITTO20000739

    申请日：2000-07-26

    Applicant: ST MICROELECTRONICS SRL ,  ST MICROELECTRONICS PTE LTD ,  STMICROELECTRONICS SDN BHD

    Inventor： CIGADA ANDREA ,  SHECHTER PIERRE YVES ,  KRITHIVASAN SIVAKUMA

    IPC: B08B7/00

    Abstract: A process for cleaning an integrated circuit package surface, comprising the steps of introducing the integrated circuit inside a plasma chamber; and of exposing the integrated circuit to a physical plasma obtained starting from a gas consisting of pure argon or any other noble gas having, in the plasma state, the behavior of a halogen, for example helium. The argon pla sma is obtained using the following energization parameters: energization time, 12-13 seconds; energization power, 140-160 W; plasma chamber pressure, 190-210 millitorr; and energization frequency, between 1 kHz and 100 GHz.

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