公开(公告)号：IT201700000518A1

公开(公告)日：2018-07-03

申请号：IT201700000518

申请日：2017-01-03

Applicant: ST MICROELECTRONICS SRL

Inventor： MAGNI PIERANGELO

IPC: H01L23/367 ,  H01L23/538

公开(公告)号：IT201900014829A1

公开(公告)日：2021-02-16

申请号：IT201900014829

申请日：2019-08-16

Applicant: ST MICROELECTRONICS SRL

Inventor： ZIGLIOLI FEDERICO GIOVANNI ,  PINTUS ALBERTO ,  DERAI MICHELE ,  MAGNI PIERANGELO

IPC: H01L20060101

公开(公告)号：IT201700055942A1

公开(公告)日：2018-11-23

申请号：IT201700055942

申请日：2017-05-23

Applicant: ST MICROELECTRONICS SRL

Inventor： ZIGLIOLI FEDERICO GIOVANNI ,  MAGNI PIERANGELO

公开(公告)号：DE602006018206D1

公开(公告)日：2010-12-23

申请号：DE602006018206

申请日：2006-06-23

Applicant: ST MICROELECTRONICS SRL

Inventor： MAGNI PIERANGELO ,  BRIOSCHI ROBERTO

IPC: B01L3/00

公开(公告)号：DE69635518T2

公开(公告)日：2006-08-17

申请号：DE69635518

申请日：1996-09-30

Applicant: ST MICROELECTRONICS SRL

Inventor： MAGNI PIERANGELO

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/495

公开(公告)号：DE69635518D1

公开(公告)日：2006-01-05

申请号：DE69635518

申请日：1996-09-30

Applicant: ST MICROELECTRONICS SRL

Inventor： MAGNI PIERANGELO

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/495

公开(公告)号：DE69330249D1

公开(公告)日：2001-06-28

申请号：DE69330249

申请日：1993-10-29

Applicant: ST MICROELECTRONICS SRL

Inventor： CELLAI MARINO ,  MAGNI PIERANGELO

IPC: H01L23/34 ,  H01L21/56 ,  H01L23/433

Abstract: A chip package of the type incorporating in a body shell of synthetic plastic material (2) at least one integrated electronic circuit and semiconductor chip (3) mounted on a chip support frame (4) and a heat dissipating device (5) in contact with said chip (3) provides that the heat dissipating device (5) have at least two structurally independent heat dissipating elements (15,16) in mutual contact. The two heat dissipating elements (15,16) are located on opposite sides of said support frame (4) and arranged symmetrically in relation to said frame (4). In addition, said heat dissipating elements (15,16) are interconnected in a separable manner by self-centring spacing posts (12,13).