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公开(公告)号：US20180044168A1
公开(公告)日：2018-02-15
申请号：US15452424
申请日：2017-03-07
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Alessandro Tocchio , Lorenzo Corso
CPC classification number: B81B7/007 , B81B2201/0235 , B81B2201/0264 , B81B2207/092 , B81B2207/096 , B81C1/00246 , B81C2201/0132 , B81C2203/0118 , B81C2203/0136 , B81C2203/0771 , B81C2203/0792
Abstract: A process for manufacturing an integrated semiconductor device, envisages: forming a MEMS structure; forming an ASIC electronic circuit; and electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.
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12.发明授权Method for manufacturing a die assembly having a small thickness and die assembly relating thereto 有权具有小厚度的模具组件的制造方法和与其相关的模具组件公开(公告)号：US09327964B2
公开(公告)日：2016-05-03
申请号：US14524661
申请日：2014-10-27
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Marco Ferrera , Matteo Garavaglia , Lorenzo Corso
CPC classification number: B81B7/0074 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/097 , B81C1/00238 , B81C1/00325 , B81C2203/0118 , B81C2203/0792
Abstract: A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.
Abstract translation: 一种用于制造模具组件的方法，包括以下步骤：将半导体材料的第一晶片接合到第二晶片，所述第二晶片包括具有各自的初始厚度的相应的半导体本体，并形成集成的电子电路; 随后减小第二晶片的半导体本体的初始厚度; 并且随后将所述第二晶片接合到第三晶片，所述第三晶片形成微机电感测结构。
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13.发明申请METHOD FOR MANUFACTURING A DIE ASSEMBLY HAVING A SMALL THICKNESS AND DIE ASSEMBLY RELATING THERETO 有权用于制造具有小厚度的模具组件的方法和与其相关的模具组件公开(公告)号：US20150115378A1
公开(公告)日：2015-04-30
申请号：US14524661
申请日：2014-10-27
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio Allegato , Marco Ferrera , Matteo Garavaglia , Lorenzo Corso
CPC classification number: B81B7/0074 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/097 , B81C1/00238 , B81C1/00325 , B81C2203/0118 , B81C2203/0792
Abstract: A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.
Abstract translation: 一种用于制造模具组件的方法，包括以下步骤：将半导体材料的第一晶片接合到第二晶片，所述第二晶片包括具有各自的初始厚度的相应的半导体本体，并形成集成的电子电路; 随后减小第二晶片的半导体本体的初始厚度; 并且随后将所述第二晶片接合到第三晶片，所述第三晶片形成微机电感测结构。
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公开(公告)号：US12297099B2
公开(公告)日：2025-05-13
申请号：US17744312
申请日：2022-05-13
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Federico Vercesi , Luca Seghizzi , Laura Oggioni , Lorenzo Corso
Abstract: A process for manufacturing a combined microelectromechanical device includes forming, in a die of semiconductor material, at least a first and a second microelectromechanical structure, performing a first bonding phase to bond a cap to the die via a bonding region or adhesive to define at least a first and a second cavity at the first and, respectively, second microelectromechanical structures, the cavities being at a controlled pressure, forming an access channel through the cap in fluidic communication with the first cavity to control the pressure value inside the first cavity in a distinct manner with respect to a respective pressure value inside the second cavity, and performing a second bonding phase, after which the bonding region deforms to hermetically close the first cavity with respect to the access channel.
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Patent Agency Ranking
公开(公告)号：US11667519B2
公开(公告)日：2023-06-06
申请号：US17164546
申请日：2021-02-01
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Alessandro Tocchio , Lorenzo Corso
CPC classification number: B81B7/007 , B81C1/00246 , B81B2201/0235 , B81B2201/0264 , B81B2207/092 , B81B2207/096 , B81C2201/0132 , B81C2203/0118 , B81C2203/0136 , B81C2203/0771 , B81C2203/0792
Abstract: An integrated semiconductor device includes: a MEMS structure; an ASIC electronic circuit; and conductive interconnection structures electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.
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16.发明授权公开(公告)号：US11277112B2
公开(公告)日：2022-03-15
申请号：US16991820
申请日：2020-08-12
Applicant: STMicroelectronics S.r.l.
Inventor： Gabriele Gattere , Lorenzo Corso , Alessandro Tocchio , Carlo Valzasina
Abstract: A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.
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公开(公告)号：US11274036B2
公开(公告)日：2022-03-15
申请号：US16815883
申请日：2020-03-11
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio Allegato , Barbara Simoni , Carlo Valzasina , Lorenzo Corso
Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
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18.发明申请公开(公告)号：US20200373904A1
公开(公告)日：2020-11-26
申请号：US16991820
申请日：2020-08-12
Applicant: STMicroelectronics S.r.l.
Inventor： Gabriele Gattere , Lorenzo Corso , Alessandro Tocchio , Carlo Valzasina
Abstract: A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.
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公开(公告)号：US10202275B2
公开(公告)日：2019-02-12
申请号：US15452424
申请日：2017-03-07
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Alessandro Tocchio , Lorenzo Corso
Abstract: A process for manufacturing an integrated semiconductor device, envisages: forming a MEMS structure; forming an ASIC electronic circuit; and electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.
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