NETWORK OF ELECTRONIC DEVICES ASSEMBLED ON A FLEXIBLE SUPPORT AND COMMUNICATION METHOD
    11.
    发明申请
    NETWORK OF ELECTRONIC DEVICES ASSEMBLED ON A FLEXIBLE SUPPORT AND COMMUNICATION METHOD 审中-公开
    电子设备网络组装在灵活的支持和通信方法上

    公开(公告)号:WO2013178529A2

    公开(公告)日:2013-12-05

    申请号:PCT/EP2013/060635

    申请日:2013-05-23

    Inventor: PAGANI, Alberto

    Abstract: The network (100) of electronic devices is formed on a flexible substrate (15; 101) by a plurality of electronic devices (1; 104) assembled on the flexible substrate. The electronic devices have an embedded antenna for mutual coupling (4; 111) of a wireless type. Each electronic device (1; 104) is formed by a chip or a complex system integrating a transceiver circuit (3) connected to the embedded antenna (4; 11) and a functional part (12; 112) connected to the transceiver circuit and including at least one element chosen in the group comprising: a sensor, an actuator, an interface, an electrode, a memory, a control unit, a power-supply unit, a converter, an adapter, a digital circuit, an analog circuit, an RF circuit, a microelectromechanical system, an electrode, a well, a cell, a container for liquids. The flexible support may be a substrate (15) of plastic material that incorporates the electronic devices or a garment having smart buttons that house the electronic devices.

    Abstract translation: 电子设备的网络(100)通过组装在柔性基板上的多个电子设备(1; 104)形成在柔性基板(15; 101)上。 电子设备具有用于无线类型的互连(4; 111)的嵌入式天线。 每个电子设备(1; 104)由集成连接到嵌入式天线(4; 11)的收发器电路(3)和连接到收发器电路的功能部件(12; 112)的芯片或复合系统形成,并且包括 在组中选择的至少一个元件包括:传感器,致动器,接口,电极,存储器,控制单元,电源单元,转换器,适配器,数字电路,模拟电路, RF电路,微机电系统,电极,阱,电池,液体容器。 柔性支撑件可以是包含电子装置的塑料材料的基底(15)或具有容纳电子装置的智能按钮的衣服。

    RETINAL PROSTHESIS
    12.
    发明申请
    RETINAL PROSTHESIS 审中-公开
    RETINAL PROSTHISIS

    公开(公告)号:WO2012090188A1

    公开(公告)日:2012-07-05

    申请号:PCT/IB2011/056033

    申请日:2011-12-30

    Inventor: PAGANI, Alberto

    Abstract: A retinal prosthesis including an electronic stimulation unit (40) housed inside an eye and including: a plurality of electrodes (62); an electronic control circuit (92, 102), which is electrically connected to the electrodes and supplies to the electrodes electrical stimulation signals designed to stimulate a portion of a retina of the eye; and a local antenna (114) connected to the electronic control circuit. The retinal prosthesis further includes an electromagnetic expansion (35) housed inside the eye and formed by a first expansion antenna (44) and a second expansion antenna (46) electrically connected together, the first expansion antenna being magnetically or electromagnetically coupled to an external antenna (38), the second expansion antenna being magnetically or electromagnetically coupled to the local antenna, the electromagnetic expansion moreover receiving an electromagnetic supply signal transmitted by the external antenna and generating a corresponding replica signal.

    Abstract translation: 一种视网膜假体,包括容纳在眼睛内的电子刺激单元(40),包括:多个电极(62); 电子控制电路(92,102),其电连接到电极并向电极提供设计成刺激眼睛的视网膜的一部分的电刺激信号; 以及连接到电子控制电路的本地天线(114)。 视网膜假体还包括容纳在眼睛内并由电连接在一起的第一扩展天线(44)和第二扩展天线(46)形成的电磁膨胀(35),第一扩展天线被磁性或电磁耦合到外部天线 (38),所述第二扩展天线与所述本地天线进行磁或电磁耦合,所述电磁膨胀还接收由所述外部天线发送的电磁供给信号并产生对应的复制信号。

    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PARAMETERS WITHIN A SOLID STRUCTURE AND MONITORING SYSTEM USING SUCH A DEVICE
    13.
    发明申请
    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PARAMETERS WITHIN A SOLID STRUCTURE AND MONITORING SYSTEM USING SUCH A DEVICE 审中-公开
    用于在固体结构中监测参数的集成电子设备和使用这种设备的监视系统

    公开(公告)号:WO2012084295A1

    公开(公告)日:2012-06-28

    申请号:PCT/EP2011/068359

    申请日:2011-10-20

    CPC classification number: G01N27/00 G01L1/26 G01M5/0083

    Abstract: Device (100) for detecting and monitoring local parameters within a solid structure (300). The device comprises an integrated detection module (1) made on a single chip, having an integrated functional circuitry portion (16) comprising at least one integrated sensor (10) and an integrated antenna (11), and electromagnetic means (2) for transmitting/receiving signals and energy exchange. The integrated functional circuitry portion (16) comprises a functional surface (18) facing towards the outside of the chip. A passivation layer (15) is arranged to completely cover at least the functional surface (18), so that the integrated detection module (1) is entirely hermetically sealed and galvanically insulated from the surrounding environment. The integrated antenna (11), the electromagnetic means (2) and the remote antenna (221) are operatively connected wirelessly through magnetic or electromagnetic coupling.

    Abstract translation: 用于检测和监测固体结构(300)内的局部参数的装置(100)。 该装置包括在单个芯片上制成的集成检测模块(1),其具有包括至少一个集成传感器(10)和集成天线(11)的集成功能电路部分(16),以及电磁装置(2) /接收信号和能量交换。 集成功能电路部分(16)包括面向芯片外部的功能表面(18)。 钝化层(15)布置成完全覆盖至少功能表面(18),使得集成检测模块(1)完全被气密密封并与周围环境电隔离。 集成天线(11),电磁装置(2)和远程天线(221)通过磁或电磁耦合无线地可操作地连接。

    CONNECTION STRUCTURE FOR AN INTEGRATED CIRCUIT WITH CAPACITIVE FUNCTION
    14.
    发明申请
    CONNECTION STRUCTURE FOR AN INTEGRATED CIRCUIT WITH CAPACITIVE FUNCTION 审中-公开
    具有电容功能的集成电路的连接结构

    公开(公告)号:WO2012084207A1

    公开(公告)日:2012-06-28

    申请号:PCT/EP2011/006449

    申请日:2011-12-20

    Inventor: PAGANI, Alberto

    Abstract: The present invention in a single structure combines a pad comprising a connection terminal suitable for connecting the circuit elements integrated in a chip to circuits outside of the chip itself and at least one condenser. By combining a connection pad and a condenser in a single structure it is possible to reduce the overall area of the chip that otherwise in common integrated circuits would be greater due to the presence of the condenser itself. In this way, the costs and size of the chip can be reduced.

    Abstract translation: 本发明的单一结构组合了包括适于将集成在芯片中的电路元件连接到芯片本身外部的电路的连接端子和至少一个冷凝器的焊盘。 通过在单一结构中组合连接焊盘和冷凝器,可以减少芯片的总面积,否则由于冷凝器本身的存在,否则常见的集成电路将会更大。 以这种方式,可以降低芯片的成本和尺寸。

    SYSTEM AND METHOD FOR ELECTRICAL TESTING OF THROUGH SILICON VIAS (TSVs)
    15.
    发明申请
    SYSTEM AND METHOD FOR ELECTRICAL TESTING OF THROUGH SILICON VIAS (TSVs) 审中-公开
    通过硅(VIV)进行电气测试的系统和方法

    公开(公告)号:WO2011101393A1

    公开(公告)日:2011-08-25

    申请号:PCT/EP2011/052319

    申请日:2011-02-16

    Inventor: PAGANI, Alberto

    Abstract: A testing system for carrying out electrical testing of at least a through via (10) extending, at least in part, through a substrate (3) of a body (2) of semiconductor material and having a first end (10b) buried within the substrate (3) and not accessible from the outside of the body (2). The testing system has an electrical test circuit (22) integrated in the body (2) and electrically coupled to the through via (10) and to electrical-connection elements (8) carried by the body (2) for electrical connection towards the outside; the electrical test circuit (22) has a buried microelectronic structure (28) integrated in the substrate (3) so as to be electrically coupled to the first end (10b) of the through via (10), thereby closing an electrical path within the substrate (3) and enabling detection of at least one electrical parameter of the through via (10) through the electrical-connection means (8).

    Abstract translation: 至少一个至少部分通过半导体材料的主体(2)的基板(3)延伸的通孔(10)进行电气测试的测试系统,并且具有埋在该半导体材料的第一端(10b)内的第一端 基板(3)并且不能从主体(2)的外部接近。 测试系统具有集成在主体(2)中并电耦合到通孔(10)的电测试电路(22)和由主体(2)承载的电连接元件(8),用于电连接到外部 ; 电测试电路(22)具有集成在基板(3)中的埋入微电子结构(28),以便电连接到通孔(10)的第一端(10b),从而封闭通孔 基板(3),并且能够通过电连接装置(8)检测通孔(10)的至少一个电参数。

    IMPROVED PROBE CARD FOR TESTING INTEGRATED CIRCUITS
    16.
    发明申请
    IMPROVED PROBE CARD FOR TESTING INTEGRATED CIRCUITS 审中-公开
    用于测试集成电路的改进的探针卡

    公开(公告)号:WO2009080760A1

    公开(公告)日:2009-07-02

    申请号:PCT/EP2008/068047

    申请日:2008-12-19

    Inventor: PAGANI, Alberto

    Abstract: A probe card (105') adapted for testing at least one integrated circuit integrated on corresponding at least one die (145) of a semiconductor material wafer, the probe card including a board (125') adapted for the coupling to a tester apparatus, and a plurality of probes (225) coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units (135'), each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test (145), the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested.

    Abstract translation: 一种探针卡(105'),适用于测试集成在半导体材料晶片的相应的至少一个管芯(145)上的至少一个集成电路,所述探针卡包括适于耦合到测试仪器的板(125'), 以及耦合到所述板的多个探针(225),其中所述探针卡包括多个可更换的基本单元(135'),每个所述探针卡包括至少一个所述探针,用于接触集成电路的外部可接近的端子 所述多个可更换基本单元被布置成对应于包含要测试的集成电路的半导体材料晶片上的至少一个管芯的布置。

    RETINAL PROSTHESIS
    17.
    发明授权
    RETINAL PROSTHESIS 有权
    视网膜移植

    公开(公告)号:EP2658490B1

    公开(公告)日:2015-02-11

    申请号:EP11817247.7

    申请日:2011-12-30

    Inventor: PAGANI, Alberto

    Abstract: A retinal prosthesis including an electronic stimulation unit housed inside an eye and including: a plurality of electrodes that contact a portion of a retina of the eye; an electronic control circuit, which is electrically connected to the electrodes and supplies to the electrodes electrical stimulation signals designed to stimulate the portion of retina; and a local antenna connected to the electronic control circuit. The retinal prosthesis further includes an electromagnetic expansion housed inside the eye and formed by a first expansion antenna and a second expansion antenna electrically connected together, the first expansion antenna being magnetically or electromagnetically coupled to an external antenna, the second expansion antenna being magnetically or electromagnetically couple to the local antenna, the electromagnetic expansion moreover receiving an electromagnetic supply signal transmitted by the external antenna and generating a corresponding replica signal.

    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PARAMETERS WITHIN A SOLID STRUCTURE AND MONITORING SYSTEM USING SUCH A DEVICE
    19.
    发明公开
    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PARAMETERS WITHIN A SOLID STRUCTURE AND MONITORING SYSTEM USING SUCH A DEVICE 有权
    用于监测PARAMENETERN集成电子设备以坚固的结构和监控系统使用这种VORRICHUNG

    公开(公告)号:EP2656057A1

    公开(公告)日:2013-10-30

    申请号:EP11771170.5

    申请日:2011-10-20

    CPC classification number: G01N27/00 G01L1/26 G01M5/0083

    Abstract: Device (100) for detecting and monitoring local parameters within a solid structure (300). The device comprises an integrated detection module (1) made on a single chip, having an integrated functional circuitry portion (16) comprising at least one integrated sensor (10) and an integrated antenna (11), and electromagnetic means (2) for transmitting/receiving signals and energy exchange. The integrated functional circuitry portion (16) comprises a functional surface (18) facing towards the outside of the chip. A passivation layer (15) is arranged to completely cover at least the functional surface (18), so that the integrated detection module (1) is entirely hermetically sealed and galvanically insulated from the surrounding environment. The integrated antenna (11), the electromagnetic means (2) and the remote antenna (221) are operatively connected wirelessly through magnetic or electromagnetic coupling.

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