Abstract:
A removable storage device is described comprising at least one substrate (1) whereon a plurality of components (2, 3) are arranged. Advantageously, the removable storage device (10) comprises a casing (4) of the package type suitable to completely cover these components (2, 3) and to form, together with the substrate (1), an external coating of the removable storage device (10). Moreover, a method is described for assembling at least one removable storage device (10) thus realised.
Abstract:
The invention is a process for manufacturing a non-volatile memory cell having at least one gate region (10), the process comprising the steps of:
depositing a first dielectric layer onto a semiconductor substrate; depositing a first semiconductor layer (1) onto the first dielectric layer to form a floating gate region of the memory cell; and defining said floating gate region of the memory cell in the first semiconductor layer (1).
Advantageously in the invention, the manufacturing process further includes the step of:
depositing a second dielectric layer (5) onto the first conductive layer (1), the dielectric layer (5) having a higher dielectric constant than 10.
Also disclosed is a memory cell, which is integrated in a semiconductor substrate and has a gate region (10) that comprises a dielectric layer (5) formed over a first conductive layer (1) and having a higher dielectric constant than 10.