公开(公告)号：US20150175410A1

公开(公告)日：2015-06-25

申请号：US14133290

申请日：2013-12-18

Applicant: STMicroelectronics S.r.l.

Inventor： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

IPC: B81C1/00

CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。

公开(公告)号：US10527512B2

公开(公告)日：2020-01-07

申请号：US15783894

申请日：2017-10-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani ,  Bruno Murari ,  Marco Ferrera ,  Domenico Giusti ,  Daniele Caltabiano

IPC: G01L9/00 ,  G01L9/06 ,  G01L15/00

Abstract: A pressure sensor with double measuring scale includes: a flexible body designed to undergo deflection as a function of a the pressure; piezoresistive transducers for detecting the deflection; a first focusing region designed to concentrate, during a first operating condition, a first value of the pressure in a first portion of the flexible body so as to generate a deflection of the first portion of the flexible body; and a second focusing region designed to concentrate, during a second operating condition, a second value of said pressure in a second portion of the flexible body so as to generate a deflection of the second portion of the flexible body. The piezoresistive transducers correlate the deflection of the first portion of the flexible body to the first pressure value and the deflection of the second portion of the flexible body to the second pressure value.

公开(公告)号：US09184138B2

公开(公告)日：2015-11-10

申请号：US13719103

申请日：2012-12-18

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics S.r.l.

Inventor： Angelo Antonio Merassi ,  Marco Ferrera ,  Marco Mantovani ,  Paolo Ferrari ,  Benedetto Vigna

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/16 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L23/16 ,  H01L23/3107 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.

Abstract translation: 半导体集成器件具有：具有前表面的半导体材料体的主体和配置在前表面的有源区域; 以及具有在主体的背面承载模具的支撑元件和覆盖模具的包覆材料的包装。 机体包括机械解耦区域，机械解耦有源区域与由包装引起的机械应力; 机械解耦区域是主体内的沟槽布置，其从主体的外框架释放活动区域，设计成吸收由包装引起的机械应力。

公开(公告)号：US09061248B1

公开(公告)日：2015-06-23

申请号：US14133290

申请日：2013-12-18

Applicant: STMicroelectronics S.r.l.

Inventor： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

IPC: H01L21/00 ,  B01D67/00 ,  B01D71/02 ,  B01L3/00 ,  F04B19/00

CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面的部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。

公开(公告)号：US11810604B2

公开(公告)日：2023-11-07

申请号：US17949712

申请日：2022-09-21

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Domenico Giusti ,  Marco Ferrera

IPC: G11B5/60 ,  G11B5/48 ,  G11B5/73 ,  H10N30/03 ,  H10N30/20

CPC classification number: G11B5/6058 ,  G11B5/483 ,  G11B5/73919 ,  H10N30/03 ,  H10N30/2047

Abstract: Various embodiments of the present disclosure provide a read/write device for a hard-disk memory system. The read/write device includes a fixed structure; a membrane region including a first and a second membrane, which are constrained to the fixed structure, and a central portion, interposed between the first and second membranes; a first and a second piezoelectric actuator, mechanically coupled, respectively, to the first and second membranes; and a read/write head, which is fixed to the central portion of the membrane region. The first and second piezoelectric actuators can be controlled so as to cause corresponding deformations of the first and second membranes, said deformations of the first and second membranes causing corresponding movements of the read/write head with respect to the fixed structure.

公开(公告)号：US11498335B2

公开(公告)日：2022-11-15

申请号：US17107683

申请日：2020-11-30

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Domenico Giusti ,  Marco Ferrera ,  Carlo Luigi Prelini ,  Mauro Cattaneo ,  Andrea Nomellini

IPC: B41J2/16 ,  B81C1/00 ,  B41J2/14

Abstract: A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.

公开(公告)号：US11427463B2

公开(公告)日：2022-08-30

申请号：US16165828

申请日：2018-10-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario Paci ,  Marco Ferrera ,  Andrea Picco

IPC: B81B3/00 ,  H01L41/09 ,  H01L41/22 ,  B81C1/00 ,  H01L41/31 ,  G02B3/14 ,  G02B26/08 ,  H01L25/16 ,  H01L41/187

Abstract: A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.

公开(公告)号：US11383971B2

公开(公告)日：2022-07-12

申请号：US16518865

申请日：2019-07-22

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabio Quaglia ,  Marco Ferrera ,  Marco Del Sarto

IPC: B81B7/00 ,  B81C1/00 ,  H01L29/66

Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.

公开(公告)号：US10974508B2

公开(公告)日：2021-04-13

申请号：US16392007

申请日：2019-04-23

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Domenico Giusti ,  Marco Ferrera ,  Carlo Luigi Prelini

IPC: B41J2/14 ,  B41J2/16

Abstract: A fluid ejection device, comprising: a chamber; a membrane, with a first side and a second side opposite to one another, where the first side faces the chamber; an actuator, of a piezoelectric type, which extends on the second side of the membrane and is operatively coupled to the membrane for causing, in use, a vibration of the membrane; a passivation layer, which extends only alongside, or partially on, the actuator; and a protection layer, which extends on the actuator at least in surface portions of the latter that are free from the passivation layer, and has a Young's modulus lower than the Young's modulus of the passivation layer.

公开(公告)号：US09327964B2

公开(公告)日：2016-05-03

申请号：US14524661

申请日：2014-10-27

Applicant: STMicroelectronics S.r.l.

Inventor： Giorgio Allegato ,  Marco Ferrera ,  Matteo Garavaglia ,  Lorenzo Corso

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0074 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/097 ,  B81C1/00238 ,  B81C1/00325 ,  B81C2203/0118 ,  B81C2203/0792

Abstract: A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.

Abstract translation: 一种用于制造模具组件的方法，包括以下步骤：将半导体材料的第一晶片接合到第二晶片，所述第二晶片包括具有各自的初始厚度的相应的半导体本体，并形成集成的电子电路; 随后减小第二晶片的半导体本体的初始厚度; 并且随后将所述第二晶片接合到第三晶片，所述第三晶片形成微机电感测结构。