公开(公告)号：EP1850351A4

公开(公告)日：2009-06-03

申请号：EP05811653

申请日：2005-12-02

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： TOSHIOKA HIDEAKI ,  YAMAMOTO MASAMICHI ,  KAWABATA KAZUHIRO

IPC: H01B1/20 ,  C09J9/02 ,  C09J163/00 ,  H01B1/00 ,  H01R11/01

CPC classification number: C09J163/00 ,  C09J9/02 ,  H01B1/22 ,  H01B1/24 ,  H01R4/04

公开(公告)号：EP1426978A4

公开(公告)日：2008-09-10

申请号：EP02765342

申请日：2002-08-21

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： YORITA JUN ,  INAZAWA SHINJI ,  MAJIMA MASATOSHI ,  KASHIHARA HIDEKI ,  SAKAMOTO TOSHIHIRO ,  TOSHIOKA HIDEAKI

IPC: C25D1/08 ,  C25D1/10 ,  C25D5/00 ,  C25D5/02 ,  H01L21/283 ,  H01L21/288 ,  H05K3/20 ,  H05K3/32 ,  H01B1/22 ,  C25D7/00 ,  H01B5/00 ,  H01B5/16

CPC classification number: H05K3/205 ,  C25D1/08 ,  C25D1/10 ,  C25D5/022 ,  H01L21/283 ,  H01L21/2885 ,  H05K3/202 ,  H05K3/323 ,  H05K2201/035

Abstract: A conductive paste capable of further reducing the electrical resistance of a conductive film or the like, a conductive film having an anisotropic conductivity, a plating method for forming a plated coating having a uniform crystal structure, and a method of producing a fine metal component having good characteristics. A conductive paste is such that metal powder in the form of many fine metal particles being linked in a chain form is blended. A conductive film is such that chain-form metal powder having paramagnetism is oriented in a constant direction by applying a magnetic field to a coating formed by the application of conductive paste. A plating method grows a plated coating by electroplating on a conductive film formed from a conductive paste. A method of producing a fine metal component which selectively grows a plated coating (4’) on a conductive film (1) exposed at fine pass-hole pattern portions in a mold (3) to produce a fine metal component.

公开(公告)号：JP2007002299A

公开(公告)日：2007-01-11

申请号：JP2005183896

申请日：2005-06-23

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KUWABARA TETSUYA ,  TOSHIOKA HIDEAKI ,  KASUGA TAKASHI ,  MASHIMA MASATOSHI

IPC: B22F1/00 ,  B01J23/42 ,  B22F1/02 ,  B22F9/24 ,  H01B1/22 ,  H01B5/00 ,  H01B13/00

Abstract: PROBLEM TO BE SOLVED: To provide a metal powder having more excellent dispersibility into a resin and catalyst efficiency than a chain metal powder; a manufacturing method therefor; an anisotropic electroconductive film using the metal powder; an electroconductive paste; and a catalyst. SOLUTION: The tubular metal powder is formed into a tubular shape by the steps of: coating the surface of a chain core powder with a metal which is a main material; and eliminating the core powder from the above product. The anisotropic electroconductive film contains the tubular metal powder which has been formed by using Au as the main metal, and has an average length of the chain adjusted to less than distance between electrodes to be electrically connected, as an electroconductive component. The anisotropic electroconductive paste contains the tubular metal powder which has been formed by using Ag as the main metal, and has an average length of the chain adjusted to 1 to 20 μm, as an electroconductive component. The catalyst employs the tubular metal powder which has been formed by using Pt as the main metal, and has a ratio L/(D 2 -D 1 ) of the average length (L) of the chains to a difference (D 2 -D 1 ) between a mean inner diameter (D 1 ) and a mean outer diameter (D 2 ) of the chains adjusted to 10 to 1,000. COPYRIGHT: (C)2007,JPO&INPIT

公开(公告)号：JP2003141948A

公开(公告)日：2003-05-16

申请号：JP2001341137

申请日：2001-11-06

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： MASHIMA MASATOSHI ,  YODA JUN ,  KASHIWABARA HIDEKI ,  KOYAMA KEIJI ,  TOSHIOKA HIDEAKI

IPC: H05K1/09 ,  H01B1/22 ,  H01B13/00 ,  H01L23/14 ,  H05K3/12

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a micro metal structural body having excellent characteristics as a conductor circuit, a metal component or the like, and a ceramic package, a multi-chip substrate and PDP substrate each having better characteristics than before using the above method. SOLUTION: In a forming method of a micro metal structural body, conductive paste containing metal powder with an average particle size of 400 nm or less as a conductive component is put under pattern formation into a given shape to obtain a micro metal structural body. The method is used for forming a conductor circuit for a ceramic package, a multi-chip substrate, and a PDP substrate.