公开(公告)号：AT523276T

公开(公告)日：2011-09-15

申请号：AT05737372

申请日：2005-04-27

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KUWABARA TETSUYA ,  TOSHIOKA HIDEAKI ,  KASHIHARA HIDEKI ,  KOYAMA KEIJI ,  SAKAI TAKASHI

IPC: B22F9/24 ,  B22F1/00 ,  B82B3/00 ,  C08F222/02 ,  H01B5/00 ,  H01B5/16 ,  H01F1/06 ,  H01F1/42

Abstract: The present invention provides a process for production of a chain metal powder, which comprises the steps of reducing ferromagnetic metal ions contained in an aqueous solution through the action of a reducing agent while applying a magnetic field to the solution in a fixed direction thereby to deposit fine metal particles, and bonding a lot of the fine metal particles in a chain form so as to orient the fine metal particles in a direction of the applied magnetic field through magnetism of the fine metal particles, characterized in that the reduction deposition reaction is conducted in the presence of: (g) a reducing agent for generating a gas during the reduction of metal ions, or a combination of the reducing agent and a foaming agent capable of generating a gas; and (h) a foamable water soluble compound for generating a bubble layer on the surface of the aqueous solution by generation of the gas and the bubble layer formed on the surface of the aqueous solution is separated from the aqueous solution and then the chain metal powder contained in the bubble layer is collected.

公开(公告)号：AT408250T

公开(公告)日：2008-09-15

申请号：AT03743552

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI ,  MAJIMA MASATOSHI ,  TANI YOSHIE

IPC: H01R11/01 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B5/16 ,  H01B13/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32

Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 mu m-20 mu m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

公开(公告)号：DE602005026579D1

公开(公告)日：2011-04-07

申请号：DE602005026579

申请日：2005-12-02

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： TOSHIOKA HIDEAKI ,  YAMAMOTO MASAMICHI ,  KAWABATA KAZUHIRO

IPC: H01B1/20 ,  C09J9/02 ,  C09J163/00 ,  H01B1/00 ,  H01R11/01

公开(公告)号：ES2368743T3

公开(公告)日：2011-11-21

申请号：ES05737372

申请日：2005-04-27

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KUWABARA TETSUYA ,  TOSHIOKA HIDEAKI ,  KASHIHARA HIDEKI ,  KOYAMA KEIJI ,  SAKAI TAKASHI

IPC: B22F9/24 ,  B82B3/00 ,  B22F1/00 ,  C08F222/02 ,  H01B5/00 ,  H01B5/16 ,  H01F1/06

Abstract: Un proceso para la producción de un polvo metálico de cadena, que comprende las etapas de reducción de iones metálicos ferromagnéticos contenidos en una solución acuosa a través de la acción de un agente reductor mientras se aplica un campo magnético a la solución en una dirección fijada, para depositar de esta forma partículas metálicas finas, y uniendo muchas de las partículas metálicas finas en forma de cadena para orientar las partículas metálicas finas en una dirección del campo magnético aplicado a través del magnetismo de las partículas metálicas finas, caracterizado porque la reacción de deposición por reducción se realiza en presencia de un compuesto polimérico que comprende: (a) unidades de repetición representadas por la fórmula (1): y (b) unidades de repetición representadas por cualquiera de la fórmula (2) o la fórmula (4): en la que R 1 representa un grupo aromático que puede tener un sustituyente, o un grupo cicloalquilo, y en la que R 4 y R 5 son idénticos o diferentes, y representan un átomo de hidrógeno o un grupo alquilo, con la condición de que R 4 y R 5 no sean simultáneamente átomos de hidrógeno.

公开(公告)号：ES2312797T3

公开(公告)日：2009-03-01

申请号：ES03743552

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI

IPC: H01R11/01 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B5/16 ,  H01B13/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32

Abstract: Una película conductora anisotrópica que contiene un polvo de metal con forma de cadena como componente conductor caracterizado porque el polvo contiene partículas metálicas M1 formadas a partir de una cadena de finas partículas de metal m1 en donde la relación L/D de la longitud L al diámetro D de la cadena no es menor que 3.

公开(公告)号：DE60323473D1

公开(公告)日：2008-10-23

申请号：DE60323473

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI ,  MAJIMA MASATOSHI ,  TANI YOSHIE

IPC: H01R11/01 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B5/16 ,  H01B13/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32

Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 mu m-20 mu m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

公开(公告)号：EP1743723A4

公开(公告)日：2009-06-10

申请号：EP05737372

申请日：2005-04-27

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KUWABARA TETSUYA ,  TOSHIOKA HIDEAKI ,  KASHIHARA HIDEKI ,  KOYAMA KEIJI ,  SAKAI TAKASHI

IPC: B22F9/24 ,  B22F1/00 ,  B82B3/00 ,  C08F222/02 ,  H01B5/00 ,  H01B5/16 ,  H01F1/06 ,  H01F1/42

CPC classification number: B22F9/24 ,  B22F2999/00 ,  H01F1/06 ,  H01F1/42 ,  Y10T428/12181 ,  Y10T428/256 ,  B22F2202/05

Abstract: A chain metal powder which is free from branches and is nearly uniformed in the chain length can be obtained by a process which comprises reducing ferromagnetic metal ions contained in an aqueous solution, while applying a magnetic field to the solution, in the presence of a polymer comprising repeating units of the formula (1) and repeating units of the general formula (2) or (4): or a process which comprises reducing ferromagnetic metal ions contained in an aqueous solution, while applying a magnetic filed to the solution, in the presence of both a reducing agent capable of generating a gas in the reduction of the metal ions and a water-soluble bubbling compound capable of forming, through the generation of a gas, a bubble layer on the surface of the aqueous solution to form a chain metal powder, separating a bubble layer formed on the surface of the aqueous solution from the solution, and recovering the chain metal powder contained in the bubble layer.

公开(公告)号：EP2256881A4

公开(公告)日：2014-12-24

申请号：EP09725452

申请日：2009-03-19

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： TAMURA MITSUAKI ,  SAKURAI WATARU ,  MATSUBARA HIDEKI ,  TOSHIOKA HIDEAKI ,  NAKATSUGI KYOUICHIROU ,  ADACHI MASAHIRO ,  OKUDA YASUHIRO

IPC: H01S5/022 ,  G02B6/42 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H01L31/0203 ,  G02B6/4201 ,  G02B6/4249 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4292 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01S5/02284 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP1944346A4

公开(公告)日：2010-01-27

申请号：EP06810552

申请日：2006-09-26

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： TOSHIOKA HIDEAKI ,  YAMAMOTO MASAMICHI

IPC: C09J163/00 ,  C09J7/00 ,  C09J171/10 ,  H01B1/00 ,  H01B1/20 ,  H01B5/16 ,  H01R11/01

CPC classification number: C09J9/02 ,  C08G59/621 ,  C08L61/00 ,  C08L63/00 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H01R43/007 ,  H05K3/323 ,  H05K2201/0209 ,  Y10T428/28 ,  Y10T428/31511 ,  C08L2666/22

Abstract: An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66°C to 100°C, so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.

公开(公告)号：EP1489695A4

公开(公告)日：2005-05-04

申请号：EP03743552

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI ,  MAJIMA MASATOSHI ,  TANI YOSHIE

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32 ,  H01R11/01 ,  H01B5/16 ,  H01B13/00

CPC classification number: H01R4/04 ,  G01R1/06755 ,  G01R1/073 ,  G01R3/00 ,  H01R43/007 ,  Y10T428/25 ,  Y10T428/258 ,  Y10T428/31678

Abstract: An anisotropic conductive film, and its production method, especially suitable for packaging a semiconductor and sufficiently satisfying the requirements of higher density packaging because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for packaging a contact probe because conductive connection not fused with a high current can be ensured with a lower voltage and even a high frequency signal can be dealt with. The anisotropic conductive film contains metallic powder having such a shape that many fine metal particles are chained as a conductive component, wherein the length of the chain of metallic powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor is packaged, and the diameter of the chain is set in the range of 1mum-20mum when a contact probe is packaged. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.