公开(公告)号：DE602005026579D1

公开(公告)日：2011-04-07

申请号：DE602005026579

申请日：2005-12-02

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： TOSHIOKA HIDEAKI ,  YAMAMOTO MASAMICHI ,  KAWABATA KAZUHIRO

IPC: H01B1/20 ,  C09J9/02 ,  C09J163/00 ,  H01B1/00 ,  H01R11/01

公开(公告)号：AT408250T

公开(公告)日：2008-09-15

申请号：AT03743552

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI ,  MAJIMA MASATOSHI ,  TANI YOSHIE

IPC: H01R11/01 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B5/16 ,  H01B13/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32

Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 mu m-20 mu m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

公开(公告)号：ES2312797T3

公开(公告)日：2009-03-01

申请号：ES03743552

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI

IPC: H01R11/01 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B5/16 ,  H01B13/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32

Abstract: Una película conductora anisotrópica que contiene un polvo de metal con forma de cadena como componente conductor caracterizado porque el polvo contiene partículas metálicas M1 formadas a partir de una cadena de finas partículas de metal m1 en donde la relación L/D de la longitud L al diámetro D de la cadena no es menor que 3.

公开(公告)号：DE60323473D1

公开(公告)日：2008-10-23

申请号：DE60323473

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI ,  MAJIMA MASATOSHI ,  TANI YOSHIE

IPC: H01R11/01 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B5/16 ,  H01B13/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32

Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 mu m-20 mu m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

公开(公告)号：EP1850351A4

公开(公告)日：2009-06-03

申请号：EP05811653

申请日：2005-12-02

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： TOSHIOKA HIDEAKI ,  YAMAMOTO MASAMICHI ,  KAWABATA KAZUHIRO

IPC: H01B1/20 ,  C09J9/02 ,  C09J163/00 ,  H01B1/00 ,  H01R11/01

CPC classification number: C09J163/00 ,  C09J9/02 ,  H01B1/22 ,  H01B1/24 ,  H01R4/04

公开(公告)号：EP2440024A4

公开(公告)日：2012-12-05

申请号：EP10783253

申请日：2010-05-18

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELEC PRINTED CIRCUITS

Inventor： YAMAMOTO MASAMICHI ,  NAKATSUGI KYOUICHIROU ,  YAMAGUCHI TAKASHI ,  KAWAKAMI SHIGEKI ,  KIMURA MICHIHIRO

IPC: H05K3/32 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/361 ,  C23F11/149 ,  H01L2924/0002 ,  H05K3/282 ,  H05K3/305 ,  H05K3/323 ,  H05K3/3431 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/094 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/308 ,  Y10T156/10 ,  H01L2924/00

公开(公告)号：EP2437582A4

公开(公告)日：2014-10-22

申请号：EP10780370

申请日：2010-04-13

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELEC PRINTED CIRCUITS

Inventor： YAMAMOTO MASAMICHI ,  NAKATSUGI KYOUICHIROU ,  YAMAGUCHI TAKASHI ,  KAWAKAMI SHIGEKI ,  KIMURA MICHIHIRO

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/282 ,  H01L2924/0002 ,  H05K1/148 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/083 ,  H05K2201/10977 ,  H05K2203/104 ,  Y10T29/49213 ,  H01L2924/00

公开(公告)号：EP1944346A4

公开(公告)日：2010-01-27

申请号：EP06810552

申请日：2006-09-26

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： TOSHIOKA HIDEAKI ,  YAMAMOTO MASAMICHI

IPC: C09J163/00 ,  C09J7/00 ,  C09J171/10 ,  H01B1/00 ,  H01B1/20 ,  H01B5/16 ,  H01R11/01

CPC classification number: C09J9/02 ,  C08G59/621 ,  C08L61/00 ,  C08L63/00 ,  C09J163/00 ,  H01B1/22 ,  H01R4/04 ,  H01R43/007 ,  H05K3/323 ,  H05K2201/0209 ,  Y10T428/28 ,  Y10T428/31511 ,  C08L2666/22

Abstract: An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66°C to 100°C, so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.

公开(公告)号：EP1489695A4

公开(公告)日：2005-05-04

申请号：EP03743552

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI ,  MAJIMA MASATOSHI ,  TANI YOSHIE

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32 ,  H01R11/01 ,  H01B5/16 ,  H01B13/00

CPC classification number: H01R4/04 ,  G01R1/06755 ,  G01R1/073 ,  G01R3/00 ,  H01R43/007 ,  Y10T428/25 ,  Y10T428/258 ,  Y10T428/31678

Abstract: An anisotropic conductive film, and its production method, especially suitable for packaging a semiconductor and sufficiently satisfying the requirements of higher density packaging because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for packaging a contact probe because conductive connection not fused with a high current can be ensured with a lower voltage and even a high frequency signal can be dealt with. The anisotropic conductive film contains metallic powder having such a shape that many fine metal particles are chained as a conductive component, wherein the length of the chain of metallic powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor is packaged, and the diameter of the chain is set in the range of 1mum-20mum when a contact probe is packaged. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.