公开(公告)号：AT408250T

公开(公告)日：2008-09-15

申请号：AT03743552

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI ,  MAJIMA MASATOSHI ,  TANI YOSHIE

IPC: H01R11/01 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B5/16 ,  H01B13/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32

Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 mu m-20 mu m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

公开(公告)号：NO321955B1

公开(公告)日：2006-07-31

申请号：NO990476

申请日：1999-02-01

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KONDO MAMORU ,  HATA RYOSUKE ,  TAKIGAWA HIROSHI ,  YORITA JUN ,  HORIKAWA TAKAHIRO ,  ASHIBE YUICHI ,  SEKI MORIHIRO

IPC: H01B9/06 ,  H01B3/22 ,  H01B3/28 ,  H01B3/44 ,  H01B7/02 ,  H01B7/14 ,  H01B7/29 ,  H01B13/00 ,  H02G15/24

Abstract: A solid cable provided with an insulation layer on the outer circumference of a conductor, and impregnated with insulating oil in this insulation layer. Medium-viscosity insulating oil the viscosity of which is between not less than 10 cst and less than 500 cst at 60 DEG is used as the insulating oil.

公开(公告)号：NO981927A

公开(公告)日：1998-10-30

申请号：NO981927

申请日：1998-04-28

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： YORITA JUN ,  HATA RYOSUKE ,  TAKIGAWA HIROSHI

IPC: H01B9/06 ,  H01B9/02

CPC classification number: H01B9/0688

公开(公告)号：DK0875907T4

公开(公告)日：2009-12-07

申请号：DK98303285

申请日：1998-04-28

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： YORITA JUN ,  HATA RYOSUKE ,  TAKIGAWA HIROSHI

IPC: H01B9/06

Abstract: In a solid DC cable formed of a conductor (1, 21, 41) and an insulating layer provided on an outer circumference of a conductor, the insulating layer is constituted by one of: (A) a main insulating layer (4), and a low-resistance tape layer (2) comprising carbon paper having a volume resistivity which is smaller by one or more figures than that of the main insulating layer (4) (Fig. 1); (B) a main insulating layer (23) comprising kraft paper (23A), and a low-resistance insulating layer (23B) comprising low-resistance kraft paper having a resistivity smaller than the kraft paper (23A) of the main insulating layer; (C) a main insulating layer (43) comprising a composite tape in which low-loss plastic film and kraft paper (43A) are bonded, and a low-resistance insulating layer comprising kraft paper (43B) having a resistivity lower than the main insulating layer; and (D) a low-resistance tape layer (2) comprising carbon paper, a low-resistance insulating layer comprising the low-resistance kraft paper (23B), and a main insulating layer (23A) which is successively provided from the conductor side to the main insulating layer side. In the solid DC cable, the low-resistance insulating layer (23B, 43B) and the low-resistance tape layer (2) are provided just above the conductor (1, 21, 41) in a region where the pressure of insulating oil becomes negative when a load is cut off.

公开(公告)号：DK0875907T3

公开(公告)日：2004-12-13

申请号：DK98303285

申请日：1998-04-28

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： YORITA JUN ,  HATA RYOSUKE ,  TAKIGAWA HIROSHI

IPC: H01B9/06

Abstract: In a solid DC cable formed of a conductor (1, 21, 41) and an insulating layer provided on an outer circumference of a conductor, the insulating layer is constituted by one of: (A) a main insulating layer (4), and a low-resistance tape layer (2) comprising carbon paper having a volume resistivity which is smaller by one or more figures than that of the main insulating layer (4) (Fig. 1); (B) a main insulating layer (23) comprising kraft paper (23A), and a low-resistance insulating layer (23B) comprising low-resistance kraft paper having a resistivity smaller than the kraft paper (23A) of the main insulating layer; (C) a main insulating layer (43) comprising a composite tape in which low-loss plastic film and kraft paper (43A) are bonded, and a low-resistance insulating layer comprising kraft paper (43B) having a resistivity lower than the main insulating layer; and (D) a low-resistance tape layer (2) comprising carbon paper, a low-resistance insulating layer comprising the low-resistance kraft paper (23B), and a main insulating layer (23A) which is successively provided from the conductor side to the main insulating layer side. In the solid DC cable, the low-resistance insulating layer (23B, 43B) and the low-resistance tape layer (2) are provided just above the conductor (1, 21, 41) in a region where the pressure of insulating oil becomes negative when a load is cut off.

公开(公告)号：NO981927L

公开(公告)日：1998-10-30

申请号：NO981927

申请日：1998-04-28

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： YORITA JUN ,  HATA RYOSUKE ,  TAKIGAWA HIROSHI

IPC: H01B9/06 ,  H01B9/02

Abstract: In a solid DC cable formed of a conductor (1, 21, 41) and an insulating layer provided on an outer circumference of a conductor, the insulating layer is constituted by one of: (A) a main insulating layer (4), and a low-resistance tape layer (2) comprising carbon paper having a volume resistivity which is smaller by one or more figures than that of the main insulating layer (4) (Fig. 1); (B) a main insulating layer (23) comprising kraft paper (23A), and a low-resistance insulating layer (23B) comprising low-resistance kraft paper having a resistivity smaller than the kraft paper (23A) of the main insulating layer; (C) a main insulating layer (43) comprising a composite tape in which low-loss plastic film and kraft paper (43A) are bonded, and a low-resistance insulating layer comprising kraft paper (43B) having a resistivity lower than the main insulating layer; and (D) a low-resistance tape layer (2) comprising carbon paper, a low-resistance insulating layer comprising the low-resistance kraft paper (23B), and a main insulating layer (23A) which is successively provided from the conductor side to the main insulating layer side. In the solid DC cable, the low-resistance insulating layer (23B, 43B) and the low-resistance tape layer (2) are provided just above the conductor (1, 21, 41) in a region where the pressure of insulating oil becomes negative when a load is cut off.

公开(公告)号：ES2312797T3

公开(公告)日：2009-03-01

申请号：ES03743552

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI

IPC: H01R11/01 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B5/16 ,  H01B13/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32

Abstract: Una película conductora anisotrópica que contiene un polvo de metal con forma de cadena como componente conductor caracterizado porque el polvo contiene partículas metálicas M1 formadas a partir de una cadena de finas partículas de metal m1 en donde la relación L/D de la longitud L al diámetro D de la cadena no es menor que 3.

公开(公告)号：DE60323473D1

公开(公告)日：2008-10-23

申请号：DE60323473

申请日：2003-03-03

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： KASHIHARA HIDEKI ,  YAMAMOTO MASAMICHI ,  YORITA JUN ,  TOSHIOKA HIDEAKI ,  OSOEGAWA MISAKO ,  KOYAMA KEIJI ,  MAJIMA MASATOSHI ,  TANI YOSHIE

IPC: H01R11/01 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B5/16 ,  H01B13/00 ,  H01R4/04 ,  H01R43/00 ,  H05K3/32

Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 mu m-20 mu m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

公开(公告)号：HK1071233A1

公开(公告)日：2005-07-08

申请号：HK05104158

申请日：2005-05-18

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： HIDEKI KASHIHARA ,  MASAMICHI YAMAMOTO ,  YORITA JUN ,  HIDEAKI TOSHIOKA ,  MISAKO OSOEGAWA ,  KEIJI KOYAMA ,  MASATOSHI MAJIMA ,  YOSHIE TANI

IPC: H01R20060101 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01B20060101 ,  H01R4/04 ,  H01R43/00 ,  H05K20060101 ,  H05K3/32

Abstract: An anisotropic conductive film, and its production method, especially suitable for mounting a semiconductor package and sufficiently satisfying the requirements of higher density mounting because short circuit does not occur in the plane direction of the film even if the pitch of electrodes is small, or suitable for mounting a contact probe because conductive connection not fused with a high current can be ensured with a lower pressure and even a high frequency signal can be dealt with. The anisotropic conductive film contains metal powder having such a shape that many fine metal particles are linked as a conductive component, wherein the length of the chain of metal powder is set not longer than the distance between adjacent electrodes being bonded conductively when a semiconductor package is mounted, and the diameter of the chain is set in the range of 1 mu m-20 mu m when a contact probe is mounted. At least a part of the film is formed while orienting a chain formed of a paramagnetic metal with a magnetic field.

公开(公告)号：CA2391218A1

公开(公告)日：2003-01-05

申请号：CA2391218

申请日：2002-06-25

Applicant: SUMITOMO ELECTRIC INDUSTRIES

Inventor： YORITA JUN ,  TATOH NOBUYOSHI

IPC: H05K1/09 ,  H01L21/48 ,  H01L23/12 ,  H01L23/15 ,  H01L23/498 ,  H05K1/03 ,  H05K1/16 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K1/02

Abstract: A circuit board comprising a first metal layer formed in patterns on a ceramic substrate, a second metal layer formed in patterns on the first metal layer, and a third metal layer formed covering the top surface of the second metal layer and the majority of the side surface, wherein the first and partial second metal layers not covered by the third metal layer are reduced in width by etching. The circuit board has a fine and high-resolution wiring pattern and makes it possible to realize a miniature high-performance high-output module by mounting at least one high-output semiconductor element thereon.