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    Microelectronic lead structures with dielectric layers
    11.
    发明专利
    Microelectronic lead structures with dielectric layers 未知

    公开(公告)号：AU7161596A

    公开(公告)日：1997-04-09

    申请号：AU7161596

    申请日：1996-09-18

    Applicant: TESSERA INC

    Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W

    IPC: H05K1/18 ,  H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01R12/04 ,  H05K1/02

    Abstract: A microelectronic connection component has flexible leads formed by polymeric strips with metallic conductors thereon. The metallic conductors may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip may have two conductors thereon, one serving as a principal or signal conductor for connection to a contact on a chip or other microelectronic element and the other serving as potential reference or ground conductor. The potential reference conductor on the lead provides enhanced resistance to crosstalk.

    Method of encapsulating a semiconductor package
    15.
    发明专利
    Method of encapsulating a semiconductor package 未知

    公开(公告)号：AU2063097A

    公开(公告)日：1997-09-22

    申请号：AU2063097

    申请日：1997-03-04

    Applicant: TESSERA INC

    Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  FJELSTAD JOSEPH ,  MITCHELL CRAIG S ,  KARAVAKIS KONSTANTINE

    IPC: H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L21/60

    Abstract: A method of encapsulating a semiconductor device. The encapsulation method includes a semiconductor chip package assembly having a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has conductive leads thereon, the leads being electrically connected to terminals on a first end and bonded to respective chip contacts on a second end. Typically, the spacer layer is comprised of a compliant or elastomeric material. A protective layer is attached on a bottom surface of the substrate so as to cover the terminals on the substrate. A flowable, curable encapsulant material is deposited around a periphery of the semiconductor chip after the attachment of the protective layer so as to encapsulate the leads. The encapsulant material is then cured. Typically, this encapsulation method is performed on a plurality of chip assemblies simultaneously.

    Fabrication of leads on semiconductor connection components
    16.
    发明专利
    Fabrication of leads on semiconductor connection components 未知

    公开(公告)号：AU5674296A

    公开(公告)日：1996-11-21

    申请号：AU5674296

    申请日：1996-05-03

    Applicant: TESSERA INC

    Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W

    IPC: H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40 ,  B32B31/12 ,  B32B31/04 ,  H05K3/02 ,  H05K3/36

    Abstract: A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal, or by applying separately formed strips such as lengths of wire. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple and economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead portion formed from a precious metal. The leads may incorporate sections of round cross-sectional shape to facilitate engagement by a bonding tool during use of the component.

    Methods for manufacturing a semiconductor package
    20.
    发明专利
    Methods for manufacturing a semiconductor package 未知

    公开(公告)号：AU2734997A

    公开(公告)日：1997-11-07

    申请号：AU2734997

    申请日：1997-04-17

    Applicant: TESSERA INC

    Inventor： FJELSTAD JOSEPH

    IPC: D21F1/06 ,  D21G9/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L25/18 ,  H01L21/58 ,  H01L21/60

    Abstract: A microelectronic assembly includes a microelectronic element having a front face including contacts, a back surface remote from the front face and edges extending therebetween. A mass of a dielectric material at least partially encapsulates the microelectronic element. The microelectronic assembly includes conductive units embedded in the mass of dielectric material at at least one edge of the microelectronic element, whereby at least some of the conductive units are exposed on oppositely-facing exterior surfaces of the mass of dielectric material. Conductive elements extend through the mass of dielectric material and electrically interconnect the contacts with the conductive units.

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