公开(公告)号：JP2004006862A

公开(公告)日：2004-01-08

申请号：JP2003129578

申请日：2003-04-01

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W ,  DISTEFANO THOMAS H ,  WALTON A CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10

Abstract: PROBLEM TO BE SOLVED: To provide an assembly of contacts useful for mounting semiconductor chips comprising sheet-like material having a plurality of holes aligned in a regular grid pattern, and elastic-layered contacts having a plurality of projections extending internally on the hole of the material. SOLUTION: A connector of a subminiature electronic element is equipped with a sheet-shaped main body (30) including a plurality of holes (36) that are preferably arranged with regular grid patterns. Each hole is provided with an elastic sheathed contact (38) including a plurality of protrusions (42) extending inward above the holes of the main body. The subminiature electronic element (68) including bump reeds (70) like solder balls can be engaged with the connector by making the bump reeds (70) enter into the holes of the connector so that the bump leads become engaged with the contacts. When it has become clear that the integrated body can be tested and can be admissible, the bump leads can be connected permanently to the contacts. COPYRIGHT: (C)2004,JPO

公开(公告)号：AU2777395A

公开(公告)日：1996-01-04

申请号：AU2777395

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W ,  DISTEFANO THOMAS H ,  WALTON A CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

公开(公告)号：AT267474T

公开(公告)日：2004-06-15

申请号：AT95923103

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W ,  DISTEFANO THOMAS H ,  WALTON A CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R12/04 ,  H01R12/32 ,  H01R12/16

Abstract: A connector for microelectronic elements includes a sheet-like body (3) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

公开(公告)号：EP0764352A4

公开(公告)日：2000-03-15

申请号：EP95923103

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W ,  DISTEFANO THOMAS H ,  WALTON A CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09 ,  H01R23/68

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A connector for microelectronic elements includes a sheet-like body (30) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子元件的连接器包括具有多个孔（36）的片状体（3），期望地布置成规则的格子图案。 每个孔设置有弹性层状接触件（38），其具有向内延伸到主体中的孔的多个突起（42）。 具有诸如其上的焊球的凸起引线（70）的微电子元件（68）可以通过使凸块引线进入连接器的孔而与连接器接合，以使触点与触点接合。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。