公开(公告)号：JPS60260133A

公开(公告)日：1985-12-23

申请号：JP11552584

申请日：1984-06-07

Applicant: TOSHIBA KK

Inventor： YAMAGUCHI MASAYOSHI ,  KASHIMA NORIYASU ,  YOKOI KIYOTAKE ,  CHIBA KOUICHI ,  KANEDA KATSUHIKO

IPC: H01L21/52 ,  H01L21/58 ,  H01L21/60

Abstract: PURPOSE:To realize automatic operations from the die bonding process to the wire bonding process by obtaining an apparatus which automatically and sequentially executes continuously the dispense work, mount work and the wire bonding work. CONSTITUTION:The standard pattern of loading position of semiconductor chip 7 of circuit substrate is previously and manually stored in the memory. Therefore, the loading position of semiconductor chip 7 of circuit substrate is taken with a television camera 6 each time it is appearing. Displcement is calculated by collating the binary pick-up output and the standard pattern. The actual semiconductor chip loading position is recognized from such a displacement and a semiconductor chip 7 is fixed to such area. At the mounting position, a picture is taken by a television camera 9 mounted on the mount head 8 and the loading position of semiconductor chip 7 is automatically detected. In the same way, a picture is taken by a monochrome television camera 12 in order to automatically detect the bonding position.

公开(公告)号：JPS5992541A

公开(公告)日：1984-05-28

申请号：JP20227482

申请日：1982-11-18

Applicant: TOSHIBA KK

Inventor： YONEZAWA MICHITAKA ,  YAMAGUCHI MASAYOSHI ,  YOKOI KIYOTAKE ,  KASHIMA NORIYASU ,  CHIBA KOUICHI ,  ATSUMI KOUICHIROU

IPC: H01L21/603 ,  H01L21/60

Abstract: PURPOSE:To perform the titled bonding process accurately with a ball closely adhering to a bonding tool by a method wherein the opening and closing times of the upper clamp are improved. CONSTITUTION:A wire 2 rolled out by a wire roller 1 is led down to a bonding tool 6 guided by an upper clamp 4 and a lower clamp 5 through the intermediary of a wire guide 3. A ball 7 is formed at the lower end of the wire 2 led out of the bonding tool 6 and the ball 7 is bonded to a pellet 9 on a lead frame 8. At this time, the upper clamp 4 is closed (ON) until the ball 7 lowering together with the bonding tool 6 adheres to the pellet 9 to complete the bonding and opened (OFF) immediately before the bonding tool 6 starts to rise. Through these procedures, the ball 7 may adhere to the bonding tool 6 when the tool 6 is lowered.