公开(公告)号：MX2013002133A

公开(公告)日：2013-08-27

申请号：MX2013002133

申请日：2013-02-22

Applicant: TOSHIBA KK

Inventor： KURITA HIROFUMI ,  KASHIMA NORIYASU ,  SHIMAMOTO TOMOHIRO

IPC: F02P13/00 ,  H01R43/00

Abstract: De conformidad con una modalidad, se preparan uno de los dos conectores y una tarjeta de circuito en la cual el otro de los conectores está montado. Uno de los conectores tiene una porción de acoplamiento. El otro de los conectores tiene un retén de acoplamiento elásticamente deformable. El retén de acoplamiento puede pasar sobre la porción de acoplamiento y ser acoplado con la porción de acoplamiento. Uno de los conectores es ajustado al otro de los conectores. Se forma la imagen de una porción del equipo eléctrico por una cámara. Una pieza de datos que cambia se mide a partir de una imagen de fotografía obtenida. Una deformación del retén de acoplamiento se produce al pasar el retén de acoplamiento sobre la porción de acoplamiento. Se determina si los conectores son o no apropiadamente ajustados. El ajuste de los conectores se realiza de nuevo cuando se determina que los conectores no son apropiadamente ajustados.

公开(公告)号：JPS6021533A

公开(公告)日：1985-02-02

申请号：JP12890783

申请日：1983-07-15

Applicant: TOSHIBA KK

Inventor： YOKOI KIYOTAKE ,  KASHIMA NORIYASU ,  SUEMATSU MUTSUMI ,  KANEDA KATSUHIKO

IPC: H05K13/04 ,  H01L21/52 ,  H01L21/58

Abstract: PURPOSE:To always pressurizingly bond circuit elements to the attaching area with a constant pressure by detecting contactness between circuit elements and fixing area and controllig a drive amount of arm with such signal. CONSTITUTION:When a semiconductor element 25 is in contact with a lead frame 30, it is detected by the first and second contact pins 26, 27 and such detection signal is input to the controller. The controller to which the detection is input outputs a signal to a DC servo motor 5 and a semiconductor element 25 controls a rotating angle of the output shaft 6 of the DC servo motor 5 to the specified angle after it is in contact with the lead frame 30. Accordingly, amount of drop of arm 18 after the semiconductor element 25 is in contact with the lead frame 30 is kept constant by the detected signal. Therefore, even when height of semiconductor element 25 adsorbed to a nozzle 20 is different, displacement generated by the nozzle 20 when it compresses a spring 23 after the semiconductor element 25 is in contact with the lead frame 30 can be kept constant.

公开(公告)号：JPS5998529A

公开(公告)日：1984-06-06

申请号：JP20769782

申请日：1982-11-29

Applicant: TOSHIBA KK

Inventor： KASHIMA NORIYASU ,  YAMAGUCHI MASAYOSHI ,  TSURUTA TOSHIROU ,  SUZUKI NOBUSHI ,  KASHIHARA TOMIO ,  YOKOI KIYOTAKE

IPC: H01L21/68 ,  H01L21/50 ,  H01L21/60

Abstract: PURPOSE:To conduct drives of each part with high accuracy as well as to meet a change of application very easily by driving engagement and disengagement of a feeding mechanism which reciprocates freely in a carrying direction and an in-and-out of a positioning pin with using an electromagnet. CONSTITUTION:A heater brock 145 goes up and down as an arrow 151, a snap-in lid 133 goes up an down as an arrow 152, a positioning pin 76 moves as an arrow 153, a feed engaging slider 83 as an arrow 154 and an engaging bar 111 as an arrow 155. All of these things except the engaging bar 111 are controlled by increase and decrease of power of an electromagnet. The heater brock 145 rises to an upper limit stopper position and is pressed against a lower surface of a lead frame 1. The snap-in lid 133 is pressed against an upper surface of the lead frame 1. The positioning pin 76 is inserted in a positioning hole 1a. Namely the heater brock 145, the snap-in lid 133 and the positioning pin 76 position the lead frame 1 thereby performing an operation of bonding in a fixed state.

公开(公告)号：JPS60262433A

公开(公告)日：1985-12-25

申请号：JP11820184

申请日：1984-06-11

Applicant: TOSHIBA KK

Inventor： YAMAGUCHI MASAYOSHI ,  KASHIMA NORIYASU ,  YOKOI KIYOTAKE ,  CHIBA KOUICHI ,  KANEDA KATSUHIKO

IPC: H01L21/52 ,  H01L21/58 ,  H01L21/60

Abstract: PURPOSE:To perform die bonding or wire bonding by providing a bonding material supply head, by providing a component fitting head and a wire bonding head on an X-Y table, by collating a pick-up output of a TV camera with a standard to correct deviations, and by conduct switching automatically according to the correction. CONSTITUTION:A position to which a component is fitted is detected automatically, a supply head is guided to a normal position, and a bonding material is supplied therefrom. Thereafter a circuit board is conveyed to a position at which it is fitted with components. A TV camera 9, a turret-type fitting head and a wire bonding head 23 are fitted on a block 21 which is fixed on an X-Y table. A pick-up output of the TV camera 9 is collated with a standard, deviations, if any, are corrected automatically, a desired head is selected to be fitted with a component. Next, when said board is forwarded under the bonding head 23, a wire is guided from a spool 20, via a guide 24, to a capillary 27 fixed to an arm 28 forming a supersonic horn, through the intermediary of clampers 25 and 26, and the head 23 is moved vertically to execute wire bonding. By this constitution, bonding dropping, component fitting and wire bonding can be executed sequentially and consecutively in a full-automatic and efficient manner.

公开(公告)号：JPS60262432A

公开(公告)日：1985-12-25

申请号：JP11820084

申请日：1984-06-11

Applicant: TOSHIBA KK

Inventor： NEMOTO TOSHIYA ,  YAMAGUCHI MASAYOSHI ,  KASHIMA NORIYASU ,  YOKOI KIYOTAKE ,  CHIBA KOUICHI ,  KANEDA KATSUHIKO

IPC: H01L21/52 ,  H01L21/58

Abstract: PURPOSE:To obtain a mounting system applying a bonding material smoothly in a full-automatic manner by a constitution wherein informations obtained by picking up by a camera set on a supply head are collated with standards to calculate positional deviations and the head is driven to a proper position so as to supply the bonding material. CONSTITUTION:When circuit boards 21 and 22 get from a magazine 2 to positions under a supply head 5 installed on an X-Y table 26, marks 23 and 24 are picked up by a TV camera 6, subjected to image processing 30 and then inputted to CPU28, wherein they are collated with standards to calculate deviations. Based on this calculation, the head 5 is moved to a proper position, and Ag paste is injected to drip from a needle 26 positioned at the end of a cylinder 25, by controlling a solenoid-operated valve 29. According to this construction, the Ag paste can be supplied onto the boards in a successive and full-automatic manner, and the productivity is further improved to a great extent by incorporating a chip fitting process also into the same process.

公开(公告)号：JPS5988841A

公开(公告)日：1984-05-22

申请号：JP19859582

申请日：1982-11-12

Applicant: TOSHIBA KK

Inventor： YAMAGUCHI MASAYOSHI ,  CHIBA KOUICHI ,  ATSUMI KOUICHIROU ,  YOKOI KIYOTAKE ,  KASHIMA NORIYASU

IPC: H01L21/60

Abstract: PURPOSE:To perform stable loop control constantly by arranging a linear motor and a fine adjustment mechanism for adjusting clamping force by controlling current, on an upper wire clamp. CONSTITUTION:A wire 5 is held between clamp flaps 4a and 4b and a movable coil 22 of a linear motor having a magnetic circuit 21 is made conductive electrically and flaps 4a and 4b attached to the coil clamp the wire 5 and then a clamping force is measured by a proper means. If it is impossible to set the force at desired value by fine adjustment of current, a spindle 27a is moved back while watching a scale of a micrometer head 27 to set it at a desired value and a leaf spring 26 is fixed by a screw 30. Ths constitution enables fine adjustment of clamping force by unit of 1gr and constantly stable loop control.

公开(公告)号：JPS613418A

公开(公告)日：1986-01-09

申请号：JP12368984

申请日：1984-06-18

Applicant: TOSHIBA KK

Inventor： KANEDA KATSUHIKO ,  CHIBA KOUICHI ,  KASHIMA NORIYASU

IPC: H01L21/677 ,  H01L21/52 ,  H01L21/58 ,  H01L21/67 ,  H01L21/68

Abstract: PURPOSE:To enable the safe and accurate teaching of the pick-up position of semiconductor chips which requires no skill by calculating a quantity of position discrepancy by collating the data of an image picked up by a TV camera with the reference data. CONSTITUTION:A means for arranging semiconductor chips 7 in trays 13 with the predetermined state and a means for arranging plural trays 13 in stockers 14 with the predetermined state are provided. Then the operation process including the program that a quantity of position discrepancy is calculated by collating the data of an image of the predetermined position of said stocker 14 picked up by a TV camera 9 with the previously stored reference data and the program that based on the above quantity, the semiconductor chips 7 of the first tray 13 to be arranged in the stocker 14 are took out in order by a pick-up tool and the chips 7 of the second tray 13 are took out in order and a means for transporting the took-out chips 7 to the mounting position automatically are provided.

公开(公告)号：JPS60260133A

公开(公告)日：1985-12-23

申请号：JP11552584

申请日：1984-06-07

Applicant: TOSHIBA KK

Inventor： YAMAGUCHI MASAYOSHI ,  KASHIMA NORIYASU ,  YOKOI KIYOTAKE ,  CHIBA KOUICHI ,  KANEDA KATSUHIKO

IPC: H01L21/52 ,  H01L21/58 ,  H01L21/60

Abstract: PURPOSE:To realize automatic operations from the die bonding process to the wire bonding process by obtaining an apparatus which automatically and sequentially executes continuously the dispense work, mount work and the wire bonding work. CONSTITUTION:The standard pattern of loading position of semiconductor chip 7 of circuit substrate is previously and manually stored in the memory. Therefore, the loading position of semiconductor chip 7 of circuit substrate is taken with a television camera 6 each time it is appearing. Displcement is calculated by collating the binary pick-up output and the standard pattern. The actual semiconductor chip loading position is recognized from such a displacement and a semiconductor chip 7 is fixed to such area. At the mounting position, a picture is taken by a television camera 9 mounted on the mount head 8 and the loading position of semiconductor chip 7 is automatically detected. In the same way, a picture is taken by a monochrome television camera 12 in order to automatically detect the bonding position.

公开(公告)号：JPS60233832A

公开(公告)日：1985-11-20

申请号：JP8845684

申请日：1984-05-04

Applicant: TOSHIBA KK

Inventor： YOKONAMI KIYOTAKE ,  KASHIMA NORIYASU ,  SUEMATSU MUTSUMI

IPC: H01L21/52 ,  H01L21/58 ,  H01L21/67

Abstract: PURPOSE:To continue bonding work by a method wherein paste deposited on the side wall of a nozzle supporting the paste is removed with a cleaner before bonding a semiconductor element or wires to electrodes by interposing paste or a viscous substance. CONSTITUTION:A mount 5 with many thick film circuits 1 is carried into place by means of two carrier belts 3 and 4, and IC elements 2 are die bonded to the circuits 1 by being held with a hold lid 8 having holes 9 appointing bonding regions. In this construction, at the same time with the stop of the mount 5, a die-bonding position is fixed by a position recognizer 10, and a dispense nozzle 12 projecting downward out of the device 10 is lowered and made to spout the paste, resulting in die bonding. The paste 13 deposited on the side wall of the nozzle 12 during repetition of these steps is removed by being immersed together with the nozzle 12 in a cleaning box 15 provided on the belt 4 by the use of an X-Y table 11; accordingly, the interruptions of die bonding work are shortened.

公开(公告)号：JPS5992541A

公开(公告)日：1984-05-28

申请号：JP20227482

申请日：1982-11-18

Applicant: TOSHIBA KK

Inventor： YONEZAWA MICHITAKA ,  YAMAGUCHI MASAYOSHI ,  YOKOI KIYOTAKE ,  KASHIMA NORIYASU ,  CHIBA KOUICHI ,  ATSUMI KOUICHIROU

IPC: H01L21/603 ,  H01L21/60

Abstract: PURPOSE:To perform the titled bonding process accurately with a ball closely adhering to a bonding tool by a method wherein the opening and closing times of the upper clamp are improved. CONSTITUTION:A wire 2 rolled out by a wire roller 1 is led down to a bonding tool 6 guided by an upper clamp 4 and a lower clamp 5 through the intermediary of a wire guide 3. A ball 7 is formed at the lower end of the wire 2 led out of the bonding tool 6 and the ball 7 is bonded to a pellet 9 on a lead frame 8. At this time, the upper clamp 4 is closed (ON) until the ball 7 lowering together with the bonding tool 6 adheres to the pellet 9 to complete the bonding and opened (OFF) immediately before the bonding tool 6 starts to rise. Through these procedures, the ball 7 may adhere to the bonding tool 6 when the tool 6 is lowered.