公开(公告)号：JPS5988841A

公开(公告)日：1984-05-22

申请号：JP19859582

申请日：1982-11-12

Applicant: TOSHIBA KK

Inventor： YAMAGUCHI MASAYOSHI ,  CHIBA KOUICHI ,  ATSUMI KOUICHIROU ,  YOKOI KIYOTAKE ,  KASHIMA NORIYASU

IPC: H01L21/60

Abstract: PURPOSE:To perform stable loop control constantly by arranging a linear motor and a fine adjustment mechanism for adjusting clamping force by controlling current, on an upper wire clamp. CONSTITUTION:A wire 5 is held between clamp flaps 4a and 4b and a movable coil 22 of a linear motor having a magnetic circuit 21 is made conductive electrically and flaps 4a and 4b attached to the coil clamp the wire 5 and then a clamping force is measured by a proper means. If it is impossible to set the force at desired value by fine adjustment of current, a spindle 27a is moved back while watching a scale of a micrometer head 27 to set it at a desired value and a leaf spring 26 is fixed by a screw 30. Ths constitution enables fine adjustment of clamping force by unit of 1gr and constantly stable loop control.

公开(公告)号：JPS60117743A

公开(公告)日：1985-06-25

申请号：JP22576283

申请日：1983-11-30

Applicant: TOSHIBA KK

Inventor： ATSUMI KOUICHIROU

IPC: B23K20/10 ,  H01L21/60 ,  H01L21/66

Abstract: PURPOSE:To enable the decision of quality of a junction state of wire by performing the detection by use of a force of pressing by a capillary, a friction force of supersonic oscillation and a piezoelectric element. CONSTITUTION:If a capillary 12 is in pressure-contact with a pellet 29 or a lead frame 30 at bonding, a piezoelectric element 28 being in contact with the lead frame 30 is applied a force of pressing and a friction force of supersonic oscillation so that the piezoelectric element 28 outputs an electric signal. The electric signal outputted from the piezoelectric element 28 is inputted in a filter 31 and the component except the predetermined frequency region by the filter 31. The electric signal passing through the filter 31 is amplified by an amplifier 32a and is converted to be digital by an A/D converting circuit 32 and is inputted in a comparative decision circuit 33. In this comparative decision circuit 3, the predetermined voltage value is preset in advance and a voltage value of the electric signal from the piezoelectric element 28 is compared with the preset value. The bonding state of a wire 14 is determined according to that comparative value.

公开(公告)号：JPS5992541A

公开(公告)日：1984-05-28

申请号：JP20227482

申请日：1982-11-18

Applicant: TOSHIBA KK

Inventor： YONEZAWA MICHITAKA ,  YAMAGUCHI MASAYOSHI ,  YOKOI KIYOTAKE ,  KASHIMA NORIYASU ,  CHIBA KOUICHI ,  ATSUMI KOUICHIROU

IPC: H01L21/603 ,  H01L21/60

Abstract: PURPOSE:To perform the titled bonding process accurately with a ball closely adhering to a bonding tool by a method wherein the opening and closing times of the upper clamp are improved. CONSTITUTION:A wire 2 rolled out by a wire roller 1 is led down to a bonding tool 6 guided by an upper clamp 4 and a lower clamp 5 through the intermediary of a wire guide 3. A ball 7 is formed at the lower end of the wire 2 led out of the bonding tool 6 and the ball 7 is bonded to a pellet 9 on a lead frame 8. At this time, the upper clamp 4 is closed (ON) until the ball 7 lowering together with the bonding tool 6 adheres to the pellet 9 to complete the bonding and opened (OFF) immediately before the bonding tool 6 starts to rise. Through these procedures, the ball 7 may adhere to the bonding tool 6 when the tool 6 is lowered.

公开(公告)号：JPS603133A

公开(公告)日：1985-01-09

申请号：JP11138083

申请日：1983-06-21

Applicant: TOSHIBA KK

Inventor： ATSUMI KOUICHIROU

IPC: H01L21/60 ,  H01L23/48

Abstract: PURPOSE:To contrive to enhance reliability and producibility of a semiconductor device by a method wherein a wire heating heater and a bonding tool are moved vertically as one body, and a ball is adhered to a pellet by contact bonding in high temperature condition. CONSTITUTION:A bonding tool 7 and a torch 11 descend as one body from the highest position, the torch 11 operates directly before the tool 7 comes in contact with a pellet 12, and a ball 10 is formed at the tip of a wire 3. Then the ball 10 adhered closely to the tip of the tool 7 is adhered to the pellet 12 according to contact bonding by the tool 7 to descend moreover. Because time necessary for the period thereof is extremely short, the ball 10 is prevented from cooling, the wire 3 and the pellet 12 are bonded surely, and an impact applied to the pellet 12 is also small. When the primary bonding cycle is completed like this, the tool 7 repeats ascending and descending again to form a loop L, and the wire 3 is pressure welded to a lead frame 13 hereafter.