WIRE BONDING PROCESS
    1.
    发明专利

    公开(公告)号:JPS5992541A

    公开(公告)日:1984-05-28

    申请号:JP20227482

    申请日:1982-11-18

    Applicant: TOSHIBA KK

    Abstract: PURPOSE:To perform the titled bonding process accurately with a ball closely adhering to a bonding tool by a method wherein the opening and closing times of the upper clamp are improved. CONSTITUTION:A wire 2 rolled out by a wire roller 1 is led down to a bonding tool 6 guided by an upper clamp 4 and a lower clamp 5 through the intermediary of a wire guide 3. A ball 7 is formed at the lower end of the wire 2 led out of the bonding tool 6 and the ball 7 is bonded to a pellet 9 on a lead frame 8. At this time, the upper clamp 4 is closed (ON) until the ball 7 lowering together with the bonding tool 6 adheres to the pellet 9 to complete the bonding and opened (OFF) immediately before the bonding tool 6 starts to rise. Through these procedures, the ball 7 may adhere to the bonding tool 6 when the tool 6 is lowered.

    WIRE BONDING DEVICE
    2.
    发明专利

    公开(公告)号:JPS60239034A

    公开(公告)日:1985-11-27

    申请号:JP9459084

    申请日:1984-05-14

    Applicant: TOSHIBA KK

    Abstract: PURPOSE:To make a bonding head to operate stably at a wire bonding device by a method wherein inductance elements are connected to a discharge circuit as to absorb discharge noise to be generated at discharge time between a discharge electrode and a bonding wire. CONSTITUTION:Coils 44, 45 are connected in series respectively to the output terminals of a rectifier circuit 43 as inductance elements respectively, for example, the high voltage side is connected to the wire 47 of a spool 46, and the low voltage side on another side is connected to a torch through a resistor 48. Moreover, a series circuit of resistors 50, 51 is connected between the high voltage side and the low voltage side to construct a discharge absorbing circuit 52. By providing the circuit 52 like this, when the idle edge of the wire 47 led out to the tip of a capillary is to be formed in a spherical shape, it is formed by performing discharge making the torch to be adjacent to the idle edge of the wire, while at this time, discharge noise can be absorbed to check application of an influence to other circuits.

    WIRE BONDING METHOD AND DEVICE
    3.
    发明专利

    公开(公告)号:JPS60245140A

    公开(公告)日:1985-12-04

    申请号:JP10040984

    申请日:1984-05-21

    Applicant: TOSHIBA KK

    Abstract: PURPOSE:To detect no residue of a wire during a normal wire bonding period by providing means for detecting whether the wire is provided over between two clampers or not. CONSTITUTION:A gold wire 1 wound on a spool 2 is led through the first and second clampers 3, 4 to a bonding tool 5, and conveyed to the end of the tool 5. The conducting state between the clampers 3 and 4 is first detected, a torch 7 is approached to the wire 1 projected from the tool 5 by a command from a computer 9 as normal at the conductive time, a discharge spark is generated to form a ball 6 at the end of the wire 1, and a bonding is then executed. Thus, when the final end of the wire 1 passes the clamper 3, the clampers 3, 4 are opened therebetween. Therefore, when this state is output from a detector 10, the prescribed display is indicated on a display unit 11 by the command from the computer 9, and next ball forming step and later steps are stopped.

    WIRE BONDING METHOD
    4.
    发明专利

    公开(公告)号:JPS60113439A

    公开(公告)日:1985-06-19

    申请号:JP21949783

    申请日:1983-11-24

    Applicant: TOSHIBA KK

    Abstract: PURPOSE:To improve loop formation between a pellet and a lead frame by a method wherein a valve that controls ventilation is closed after a bonding tool bonds wires to pellets and then opened before bonding finish. CONSTITUTION:The control valve opens, air flowing into an air nozzle 41, and tension force being then applied on the wires 5. A ball 13 is formed at the tip of the wire and pressed fit to the pellet 10. Thereafter, the control valve closes with the rise of the bonding tool 9, and then the flow of air stops. In this state, the tip of the tool becomes positioned at a bonding point of the lead frame 11. Here, the tool is lowered, pressing the wire fit to the lead frame, and electrically connecting the pellet to the lead frame. The control valve is opened before pressure bonding, and tension force acts on the wires by the air from the air nozzle. Thereby, the loop L formed by the wire comes to an appropriate shape.

    WIRE-BONDING METHOD AND DEVICE THEREOF

    公开(公告)号:JPS60246644A

    公开(公告)日:1985-12-06

    申请号:JP10173584

    申请日:1984-05-22

    Applicant: TOSHIBA KK

    Abstract: PURPOSE:To enable to find a work error by confirming the error with the eyes each time when the teaching work ends at each bonding position by a method wherein a sign to show the completion of storage in the memory is indicated on the output indicating unit of the ITV camera. CONSTITUTION:An X-axis 2 and a Y-axis 3 are made to shift by operating a chessman 15 and a camera matching point 18 on the image surface of a TV monitor 8 is made to conform to the bonding pad 19 of an IC chip 9. The correction of the memory contents of the memory 13 of a control unit 12 is performed by a switch 16 and an input is performed to the X-Y coordinates of the bonding pad 19. A figure 1 is indicated in the indicating region of the pad 19 from a numeric signal generating circuit by the control of the computer, whereby the completion of the correcting work can be confirmed. The chessman 15 is operated, the camera matching point 18 is made to conform to the bonding point (not being shown in the diagram) on the side of the lead and the X-Y coordinates are inputted. A figure 1 is indicated on the indicating part of the pad from the circuit 17. When figures are indicated in 2, 3, 4... in every bonding wire in the same manner thereafter, those are an indication to show the complete end of the bonding work.

    WIRE BONDING DEVICE
    6.
    发明专利

    公开(公告)号:JPS60138930A

    公开(公告)日:1985-07-23

    申请号:JP24633783

    申请日:1983-12-27

    Applicant: TOSHIBA KK

    Abstract: PURPOSE:To perform correctly control necessary for bonding always by a method wherein rocking motion of a rocking arm is converted into linear motion, and control informations in regard to bonding parts are obtained through sensors from the converted motion thereof having no positional discrepancy. CONSTITUTION:A linear motor 5 is driven, a bonding tool 4 is descended through a rocking arm 3, and a ball 21 formed at the tip of a bonding wire 18 is bonded with pressure to the pad of a pellet 19. At this case, momentum of the arm 3 is converted into momentum of linear motion during transmitted through a bracket 14, a link piece 15 and a hinge pin 16, and replaced with linear momentum of a slider 13. Accordingly, because linear motion having no element of positional discrepancy entirely of the slider 13 thereof can be detected according to a position detector 9 and a speed detector 10 respectively through respective probes 9a, 10a, correct control informations can be outputted at the position detector 9 and the speed detector 10 respectively without receiving the influence of a moving coil 6.

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