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公开(公告)号：JPH08244168A
公开(公告)日：1996-09-24
申请号：JP4934795
申请日：1995-03-09
Applicant: UBE INDUSTRIES
Inventor： INOUE HIROSHI , TAKABAYASHI SEIICHIRO , TANIOKA RIKIO
IPC: B32B7/02 , B29C41/00 , B29C51/16 , B29C65/02 , B29K77/00 , B29L9/00 , B32B15/08 , B32B15/088 , H05K1/03 , H05K3/02
Abstract: PURPOSE: To bond a polyimide film with a metal foil firmly by overlapping a thermoplastic polyimide layer of a multilayer polyimide film formed by stacking integrally a thermoplastic aromatic polyimide layer of low logarithm viscosity on one surface of an aromatic polyimide layer of high heat resistance and then heating and fixing by pressure. CONSTITUTION: Thermoplastic aromatic polyimide solution of low logarithm viscosity or its precursor solution is applied at least to one surface of a self-supporting imide gelatinized film manufactured by cast applying the aromatic polyimide precursor solution of high heat resistance containing a dehydrating agent and a catalyst, and then heating and turning the solution into partial ring closure imide, and then dried and heat treated. A metal foil 20 is overlapped on a thermoplastic polyimide layer of a multi-polyimide film 10 formed integrally with the thermoplastic aromatic polyimide layer of low logarithm aromatic polyimide layer at least on one surface of the aromatic polyimide layer of high heat resistance thus formed, and heated and fixed by pressure by heating rollers 3 and 4 integrally, and a laminate thus formed is cooled by a cooling roll.
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公开(公告)号：JPH08230103A
公开(公告)日：1996-09-10
申请号：JP3746195
申请日：1995-02-27
Applicant: UBE INDUSTRIES
Inventor： INOUE HIROSHI , TAKABAYASHI SEIICHIRO , TANIOKA RIKIO
IPC: B32B15/08 , B32B15/088 , H05K1/03
Abstract: PURPOSE: To integrally laminate a metal foil and a polyimide substrate layer with high adhesion by laying the metal foil over a multilayer polyimide thin film provided by integrally laminating thermoplastic aromatic polyimide layers of a low logarithmic viscosity on a side of a high temperature-resistant polyimide substrate layer, and then heating and pressurizing the layers. CONSTITUTION: A multilayer polyimide film 2 of a metal foil-laminated polyimide film 1 is formed by coating at least one side of a high temperature-resistant aromatic polyimide substrate layer with a thin film formed by applying thereto a thermoplastic aromatic polyimide thin film by a coating method, and then drying and heating the laminate. The metal foil-laminated polyimide film 1 is formed by laying a metal foil on the thermoplastic aromatic polyimide thin film of the multilayer polyimide film 2 and then heating and pressuring them for lamination.
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公开(公告)号：JPH0527281A
公开(公告)日：1993-02-05
申请号：JP24425091
申请日：1991-08-30
Applicant: UBE INDUSTRIES
Inventor： ASHITAKA HIDETOMO , TANIOKA RIKIO , SUEHIRO TSUTOMU , ISHII MASAYOSHI
Abstract: PURPOSE:To allow the use of the above-mentioned tertiary nonlinear optical material as a device material for optical communication, optical information processing, etc., by consisting this material of carbohelicene or heterohelicene to obtain a high tertiary nonlinear characteristic and eliminating the thermal and optical damages by a laser. CONSTITUTION:This nonlinear optical material consists of the carbohelicene or heterohelicene. The carbohelicene is a compd. having a spiral structure connected with >=5 pieces, more preferably 6 to 20 pieces of a rings and the heterohelicene is a compd. consisting of a cocodensed ring of benzene and a heterocycle, such as furan, pyridine or pyrrole, and chiahelicene is not included therein. Further, the carbohelicene or heterohelicene may be attached with various kinds of substituents in its arom. ring or heterocycle. While the method for synthesizing the carbohelicene or heterohelicene is not particularly limited, the carbohelicene or heterohelicene is obtd. by photocyclization of the 1, 2- diarylethyelnes, etc., synthesized by a Witting reaction or Siegrist reaction.
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公开(公告)号：JPH10168310A
公开(公告)日：1998-06-23
申请号：JP33405096
申请日：1996-12-13
Applicant: UBE INDUSTRIES
Inventor： TANIOKA RIKIO , TANAKA SHOICHI , NISHIYAMA MASAO
IPC: C08J5/18 , B29C55/12 , B29D7/01 , B29K77/00 , B29L7/00 , C08K3/00 , C08K5/00 , C08K5/20 , C08K7/18 , C08L77/00
Abstract: PROBLEM TO BE SOLVED: To obtain the subject film having excellent slipperiness under high- humidity condition while keeping the transparency and surface gloss of the film by forming protrusions having a specific size on a polyamide film surface at a specific density and hydrophobicizing the film. SOLUTION: This polyamide film has a surface roughness characterized by the presence of 6-30/mm of protrusions having a height of >=0.06μm from the center line measured by a surface-roughness tester, a static contact angle of >=64 deg. with water at 23 deg.C, a haze value of 110. The film can be produced by compounding a polyamide resin with a surface- roughening substance, especially inorganic fine powder, concretely gel-type silica, etc., and a surface-hydrophobicizing substance, especially a long-chain aliphatic bisamide compound such as N,N'-ethylenebisbehenamide, forming the composition in the form of a film and drawing the film at an areal draw ratio of >=3.
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公开(公告)号：JPH08230101A
公开(公告)日：1996-09-10
申请号：JP4032895
申请日：1995-02-28
Applicant: UBE INDUSTRIES
Inventor： INOUE HIROSHI , TAKABAYASHI SEIICHIRO , TANIOKA RIKIO
IPC: B32B15/08 , B32B15/088 , H05K1/03
Abstract: PURPOSE: To integrally laminate a metal foil and a polyimide substrate layer with high adhesion by laying the metal foil over a multilayer extruded polyimide thin film provided by integrally laminating thermoplastic aromatic polyimide layers of a low logarithmic viscosity on a side of a high temperature-resistant polyimide substrate layer, and then heating and pressurizing the layers. CONSTITUTION: A multilayer extruded polyimide film 2 of a metal foil-laminated polyimide film 1 is formed by integral lamination of a thermoplastic aromatic polyimide thin film on at least one side of a high temperature-resistant aromatic polyimide substrate layer, which is achieved by, for example, the multilayer extrusion of a substrate layer polyimide precursor solution together with a thin film polyimide solution or its precursor solution. The metal foil-laminated polyimide film 1 is formed by laying a metal foil 3 on the thermoplastic aromatic polyimide thin film of the multilayer extruded polyimide film 2 and then heating and pressuring them for lamination.
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Patent Agency Ranking
公开(公告)号：JPH0483787A
公开(公告)日：1992-03-17
申请号：JP19394090
申请日：1990-07-24
Applicant: UBE INDUSTRIES
Inventor： ASHITAKA HIDETOMO , TANIOKA RIKIO , ISHII MASAYOSHI
Abstract: PURPOSE:To obtain the title single crystal in a short time by crystal deposition at the interface between a specific laminar perovskite-type compound and at least two kinds of solvent. CONSTITUTION:A laminar perovskite compound of formula I or II (M is metallic element selected from Pb, Cd, Cu, Fe, Co and Mn; X is at least one halogen element selected from I, Br and Cl; m is 2-8; n is 1-18) is immersed in at least two kinds of solvent (e.g. ethyl acetate and water) with an ammonium salt and a compound of formula MX2 dissolved therein, and the resultant system is left at rest at 0-4 deg.C, thus depositing the objective lamellar single crystal at the interface between said perovskite compound and solvents.
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公开(公告)号：JP2000239375A
公开(公告)日：2000-09-05
申请号：JP1775899
申请日：1999-01-27
Applicant: UBE INDUSTRIES
Inventor： TANIOKA RIKIO , TANAKA SHOICHI , OKUSHITA YOJI
Abstract: PROBLEM TO BE SOLVED: To obtain a polyamide excellent in stretchability especially successive biaxial stretchability. SOLUTION: This polyamide comprises a diamine and a dicarboxylic acid including a 6-22C branched and saturated carboxylic acid as essential components. The preferable composition is 50-99.95 mol% lactam and/or aminocarboxylic acid, 0.025-25 mol% diamine and 0.025-25 mol% dicarboxylic acid wherein 5-100 mol% of the dicarboxylic acid is a 6-22C branched and saturated carboxylic acid. As the 6-22C branched and saturated carboxylic acid, 1,6-decanedicarboxylic acid is preferable.
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公开(公告)号：JPH10168309A
公开(公告)日：1998-06-23
申请号：JP33404996
申请日：1996-12-13
Applicant: UBE INDUSTRIES
Inventor： TANIOKA RIKIO , TANAKA SHOICHI , NISHIYAMA MASAO
Abstract: PROBLEM TO BE SOLVED: To obtain the subject film having excellent slipperiness under high- humidity condition while keeping the transparency and surface gloss of the film by forming protrusions having a specific size on a polyamide film surface at a specific density. SOLUTION: This polyamide film has a surface roughness characterized by the presence of 6-30/mm of protrusions having a height of >=0.06μm from the center line measured by a surface-roughness tester, a haze value of ≃1.0% and a glass of >110. The film can be produced by compounding a polyamide resin with a surface-roughening substance, especially inorganic fine powder, concretely a gel-type silica, etc., forming the composition in the form of a film and drawing the film at an areal draw ratio of >=3. Preferably, >=50wt.% of the polyamide resin is a poly-ε-capramide or a copolymer containing the recurring structural unit of poly-ε-capramide as a main component.
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公开(公告)号：JPH08224843A
公开(公告)日：1996-09-03
申请号：JP3263895
申请日：1995-02-21
Applicant: UBE INDUSTRIES
Inventor： INOUE HIROSHI , TAKABAYASHI SEIICHIRO , TANIOKA RIKIO
Abstract: PURPOSE: To obtain high heat resistance and dimensional stability and heighten adhesive strength between a thermoplastic aromatic polyimide layer and an aromatic polyimide film by integrally laminating the thermoplastic aromatic polyimide layer having a low logarithmic viscosity number on at least one face of the aromatic polyimide film having high heat resistance. CONSTITUTION: A multilayer aromatic polyimide film 1 is formed by integrally laminating, for example, a thin film 3 consisting of a thermoplastic aromatic polyimide on at least one face of a base body layer 2 consisting of an aromatic polyimide having high heat resistance. The multilayer aromatic polyimide film is coated with an organic polar solvent solution of an aromatic polyimide precursor having a dehydrating agent and a catalyst. Thereafter, it is heated so as to form a layer 3 of an aromatic polyimide solution which is of an imide of the aromatic polyimide precursor on one face of the base body layer 2. The obtained laminated matter is dried preferably at 50-200 deg.C, and treated with heat at 300 deg.C or higher so as to evaporate the solvent and make the imide for manufacturing the film.
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公开(公告)号：JPH0632756A
公开(公告)日：1994-02-08
申请号：JP18674792
申请日：1992-07-14
Applicant: UBE INDUSTRIES
Inventor： INAGAKI TORU , TANIOKA RIKIO , ZUSHI KAZUO
IPC: B01J27/186 , C07B61/00 , C07C37/20 , C07C39/16 , C07C39/367
Abstract: PURPOSE:To obtain the subject compound without using particular corrosion- resistant reactor by reacting a phenolic compound with an aldehyde in the presence of a heteropolyacid catalyst. CONSTITUTION:A compound of the formula (R is H, alkyl or halogen; R is H, alkyl, aryl or aralkyl) is produced by reacting a phenolic compound with an aliphatic aldehyde or an aromatic aldehyde using a heteropolyacid (e.g. phosphotungstic acid) as an acid catalyst optionally in a solvent (e.g. acetic acid) at 15-120 deg.C. The amounts of the phenolic compound and the heteropolyacid are 2-50mol and 0.001-1mol based on 1mol of the aldehyde, respectively. Heteropolyacid has low corrosivity and stable catalytic activity. It is easily usable and does not cause the lowering of the reaction rate by water produced as a by-product of the reaction. Among the compounds of the formula, the yield of bis(4-hydroxyphenyl)methanes useful to improve the properties of epoxy resins can be selectively increased by the use of heteropolyacid.
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