公开(公告)号：DE69835324T2

公开(公告)日：2007-08-23

申请号：DE69835324

申请日：1998-08-28

Applicant: UNITED TECHNOLOGIES CORP

Inventor： BEERS RUSSEL A ,  HENDRICKS ROBERT E ,  MARSZAL DEAN N ,  WRIGHT ROBERT J ,  NOETZEL ALLAN A

IPC: C23C14/24 ,  C23C14/32 ,  H01J37/32

Abstract: According to the present invention, an apparatus (10) for applying material by cathodic arc vapor deposition to a substrate (12) is provided which includes a vessel (14), apparatus (16) for maintaining a vacuum in the vessel, an annular cathode (18) having a bore (46) and an evaporative surface (44) extending between first (40) and second (42) end surfaces, apparatus (24) for selectively sustaining an arc of electrical energy between the cathode and a anode, and apparatus for driving the arc around the evaporative surface. The apparatus for driving the arc is positioned within the cathode bore, and produces a magnetic field that runs substantially parallel to the evaporative surface. The annular cathode is disposed radially inside of, and aligned with, the substrates inside the vessel.

公开(公告)号：DE69835324D1

公开(公告)日：2006-09-07

申请号：DE69835324

申请日：1998-08-28

Applicant: UNITED TECHNOLOGIES CORP

Inventor： BEERS RUSSEL A ,  HENDRICKS ROBERT E ,  MARSZAL DEAN N ,  WRIGHT ROBERT J ,  NOETZEL ALLAN A

IPC: C23C14/24 ,  C23C14/32 ,  H01J37/32

Abstract: According to the present invention, an apparatus (10) for applying material by cathodic arc vapor deposition to a substrate (12) is provided which includes a vessel (14), apparatus (16) for maintaining a vacuum in the vessel, an annular cathode (18) having a bore (46) and an evaporative surface (44) extending between first (40) and second (42) end surfaces, apparatus (24) for selectively sustaining an arc of electrical energy between the cathode and a anode, and apparatus for driving the arc around the evaporative surface. The apparatus for driving the arc is positioned within the cathode bore, and produces a magnetic field that runs substantially parallel to the evaporative surface. The annular cathode is disposed radially inside of, and aligned with, the substrates inside the vessel.

公开(公告)号：DE69832016T2

公开(公告)日：2006-07-13

申请号：DE69832016

申请日：1998-08-28

Applicant: UNITED TECHNOLOGIES CORP HARTF

Inventor： BEERS RUSSELL A ,  MARSZAL DEAN N ,  NOETZEL ALLAN A ,  SILEO GERARD A ,  HENDRICKS ROBERT E ,  WRIGHT ROBERT J ,  ERVIN DAVID R

IPC: C23C14/24 ,  C23C14/54 ,  C23C14/32 ,  C23C14/56

Abstract: A vapor deposition production system (10) for coating substrates (12) is provided which includes a plurality of vapor deposition coaters (14), a plurality of platters (16), a platter docking station (18), a shuttle track (20), and apparatus for transporting the platters between the coaters and the platter docking station. The shuttle track connects the platter docking station and the coaters. Platters selectively removed from the coaters are transported along the shuttle track to the platter docking station where processed substrates are unloaded from the platters and unprocessed substrates loaded on to the platters.

公开(公告)号：SG67546A1

公开(公告)日：1999-09-21

申请号：SG1998003308

申请日：1998-08-27

Applicant: UNITED TECHNOLOGIES CORP

Inventor： BEERS RUSSELL A ,  HENDRICKS ROBERT E ,  MARSZAL DEAN N ,  NOETZEL ALLAN A ,  WRIGHT ROBERT J ,  ROYAL TYRUS E

IPC: C23C14/24 ,  H01J37/32 ,  C23C14/32

Abstract: An apparatus (10) for applying material by cathodic arc deposition to a substrate (12) is provided which includes a vessel (14), means (16) for maintaining a vacuum in the vessel, a cathode (18), a contactor (20), means (24) for selectively sustaining an arc of electrical energy between the cathode and an anode (26), and an actuator (22). The cathode and contactor are positioned inside the vessel, and the contactor is electrically connected to the means for selectively sustaining an arc of electrical energy. The actuator selectively actuates the contactor into electrical contact with the cathode, and thereby electrically connects the cathode to the means for sustaining an arc of electrical energy.

公开(公告)号：DE69504678T2

公开(公告)日：1999-05-06

申请号：DE69504678

申请日：1995-03-27

Applicant: UNITED TECHNOLOGIES CORP

Inventor： WRIGHT ROBERT J ,  DALZELL WILLIAM J

IPC: C25D13/00 ,  C25D13/02 ,  C25D13/16

公开(公告)号：DE69504678D1

公开(公告)日：1998-10-15

申请号：DE69504678

申请日：1995-03-27

Applicant: UNITED TECHNOLOGIES CORP

Inventor： WRIGHT ROBERT J ,  DALZELL WILLIAM J

IPC: C25D13/00 ,  C25D13/02 ,  C25D13/16

公开(公告)号：CA1112015A

公开(公告)日：1981-11-10

申请号：CA316466

申请日：1978-11-20

Applicant: UNITED TECHNOLOGIES CORP

Inventor： WRIGHT ROBERT J ,  HECHT RALPH J ,  FENTON RICHARD J

IPC: B22F5/10 ,  B22F7/08 ,  C23C14/34 ,  B22F3/02

Abstract: SPUTTERING TARGET FABRICATION METHOD A method for producing a cooled sputtering target assembly is described. The resultant target is also described. The material to be sputtered is provided in the form of powder which is hot isostatically pressed in a toroidal metallic container under conditions which promote compaction and bonding of the powder particles to form a fully dense material. The container is then partially removed from the target material except for a remnant around the outer surface. A cooling jacket is then fabricated and attached to the remnant of the container.