公开(公告)号：US11943877B2

公开(公告)日：2024-03-26

申请号：US17684421

申请日：2022-03-02

Applicant: Unimicron Technology Corp.

Inventor： Wen-Yu Lin ,  Kai-Ming Yang ,  Chen-Hao Lin ,  Pu-Ju Lin ,  Cheng-Ta Ko ,  Chin-Sheng Wang ,  Guang-Hwa Ma ,  Tzyy-Jang Tseng

IPC: H05K3/24 ,  H01L21/56 ,  H01L23/15 ,  H01L23/31 ,  H01L23/488 ,  H01L23/544 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K3/467 ,  H05K1/112 ,  H05K2201/0191

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

公开(公告)号：US20230178520A1

公开(公告)日：2023-06-08

申请号：US17571543

申请日：2022-01-10

Applicant: Unimicron Technology Corp.

Inventor： Wen-Yu Lin ,  Kai-Ming Yang ,  Chen-Hao Lin

IPC: H01L25/075 ,  H01L33/00 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L33/0093 ,  H01L24/19 ,  H01L24/94 ,  H01L24/20 ,  H01L33/62

Abstract: A light-emitting diode package includes a redistribution layer, a light-emitting diode, a first dielectric layer, a plurality of wavelength conversion structures, and a transparent encapsulant. The light-emitting diode is disposed on and electrically connected to the redistribution layer. The light-emitting diode includes a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode. The first dielectric layer is disposed on the redistribution layer and covers the light-emitting diode. The wavelength conversion structures are disposed on the first dielectric layer and respectively in contact with the second light-emitting diode and the third light-emitting diode. The transparent encapsulant is disposed on the first dielectric layer and covers the plurality of wavelength conversion structures. In addition, a manufacturing method of the light-emitting diode package is provided.

公开(公告)号：US11219130B2

公开(公告)日：2022-01-04

申请号：US16528560

申请日：2019-07-31

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming Yang ,  Chen-Hao Lin

IPC: H05K1/11 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24

Abstract: A circuit board including a substrate, a patterned conductive layer, a patterned insulating layer, a conductive terminal, and a dummy terminal is provided. The patterned conductive layer is disposed on the substrate. The patterned insulating layer is disposed on the substrate and at least covers a portion of the patterned conductive layer. The conductive terminal is disposed on the patterned conductive layer and has a first top surface. The dummy terminal is disposed on the patterned conductive layer and has a second top surface. A first height between the first top surface and the substrate is greater than a second height between the second top surface and the substrate.

公开(公告)号：US10993332B2

公开(公告)日：2021-04-27

申请号：US16746968

申请日：2020-01-20

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming Yang ,  Chen-Hao Lin

IPC: H01L29/40 ,  H05K3/46 ,  H01L21/768 ,  H01L23/00 ,  H01L23/522 ,  H05K3/32 ,  H05K3/40 ,  H01L23/488

Abstract: A circuit substrate includes a substrate, a wire build-up layer structure, and an insulating layer. The substrate has a first surface and a second surface opposites to the first surface. The substrate includes a plurality of patterned pads. The patterned pads are disposed on the first surface of the substrate, and having contact openings. The wire build-up layer structure is disposed on the first surface of the substrate. The wire build-up layer structure includes an interconnect build-up layer and a plurality of conductive pillars. The conductive pillars electrically connect to the interconnect build-up layer and the patterned pads. The insulating layer is disposed between the substrate and the wire build-up layer structure.

公开(公告)号：US20200154578A1

公开(公告)日：2020-05-14

申请号：US16746968

申请日：2020-01-20

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming Yang ,  Chen-Hao Lin

IPC: H05K3/46 ,  H01L21/768 ,  H01L23/00 ,  H01L23/522 ,  H01L23/488 ,  H05K3/32 ,  H05K3/40

Abstract: A circuit substrate includes a substrate, a wire build-up layer structure, and an insulating layer. The substrate has a first surface and a second surface opposites to the first surface. The substrate includes a plurality of patterned pads. The patterned pads are disposed on the first surface of the substrate, and having contact openings. The wire build-up layer structure is disposed on the first surface of the substrate. The wire build-up layer structure includes an interconnect build-up layer and a plurality of conductive pillars. The conductive pillars electrically connect to the interconnect build-up layer and the patterned pads. The insulating layer is disposed between the substrate and the wire build-up layer structure.