公开(公告)号：US20230268257A1

公开(公告)日：2023-08-24

申请号：US17902902

申请日：2022-09-05

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Wen-Yu Lin ,  Tse-Wei Wang ,  Jun-Ho Chen ,  Guang-Hwa Ma

IPC: H01L23/498 ,  H01L23/66 ,  H01Q1/38 ,  H01L21/48

CPC classification number: H01L23/49811 ,  H01L23/66 ,  H01Q1/38 ,  H01L23/49822 ,  H01L23/49833 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L24/16

Abstract: An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial conductive element located in the interposer substrate. The interposer substrate includes a cavity. The coaxial conductive element includes a first conductive structure, a second conductive structure surrounding the first conductive structure, and a first insulation structure. The first insulation structure is disposed between the first and second conductive structures. The circuit board is disposed on a lower surface of the interposer substrate and electrically connected to the coaxial conductive element. The chip is disposed in the cavity and located on the circuit board, so as to be electrically connected to the circuit board. The circuit structure is disposed on an upper surface of the interposer substrate and electrically connected to the coaxial conductive element.

公开(公告)号：US20230240023A1

公开(公告)日：2023-07-27

申请号：US17684421

申请日：2022-03-02

Applicant: Unimicron Technology Corp.

Inventor： Wen-Yu Lin ,  Kai-Ming Yang ,  Chen-Hao Lin ,  Pu-Ju Lin ,  Cheng-Ta Ko ,  Chin-Sheng Wang ,  Guang-Hwa Ma ,  Tzyy-Jang Tseng

IPC: H05K3/46 ,  H05K1/11

CPC classification number: H05K3/467 ,  H05K1/112 ,  H05K2201/0191

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

公开(公告)号：US11943877B2

公开(公告)日：2024-03-26

申请号：US17684421

申请日：2022-03-02

Applicant: Unimicron Technology Corp.

Inventor： Wen-Yu Lin ,  Kai-Ming Yang ,  Chen-Hao Lin ,  Pu-Ju Lin ,  Cheng-Ta Ko ,  Chin-Sheng Wang ,  Guang-Hwa Ma ,  Tzyy-Jang Tseng

IPC: H05K3/24 ,  H01L21/56 ,  H01L23/15 ,  H01L23/31 ,  H01L23/488 ,  H01L23/544 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K3/467 ,  H05K1/112 ,  H05K2201/0191

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

公开(公告)号：US20230187598A1

公开(公告)日：2023-06-15

申请号：US17583222

申请日：2022-01-25

Applicant: Unimicron Technology Corp.

Inventor： Wen-Yu Lin ,  Kai-Ming Yang

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/22 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/22 ,  H01L33/483 ,  H01L33/62 ,  H01L2933/0066 ,  H01L2933/0075

Abstract: A light-emitting diode package structure includes a heat dissipation substrate, a redistribution layer, and multiple light-emitting diodes. The heat dissipation substrate includes multiple copper blocks and a heat-conducting material layer. The copper blocks penetrate the heat-conducting material layer. The redistribution layer is disposed on the heat dissipation substrate and electrically connected to the copper blocks. The light-emitting diodes are disposed. on the redistribution layer and are electrically connected to the redistribution layer. A side of the light-emitting diodes away from the redistribution layer is not in contact with any component.

公开(公告)号：US20230178520A1

公开(公告)日：2023-06-08

申请号：US17571543

申请日：2022-01-10

Applicant: Unimicron Technology Corp.

Inventor： Wen-Yu Lin ,  Kai-Ming Yang ,  Chen-Hao Lin

IPC: H01L25/075 ,  H01L33/00 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L33/0093 ,  H01L24/19 ,  H01L24/94 ,  H01L24/20 ,  H01L33/62

Abstract: A light-emitting diode package includes a redistribution layer, a light-emitting diode, a first dielectric layer, a plurality of wavelength conversion structures, and a transparent encapsulant. The light-emitting diode is disposed on and electrically connected to the redistribution layer. The light-emitting diode includes a first light-emitting diode, a second light-emitting diode, and a third light-emitting diode. The first dielectric layer is disposed on the redistribution layer and covers the light-emitting diode. The wavelength conversion structures are disposed on the first dielectric layer and respectively in contact with the second light-emitting diode and the third light-emitting diode. The transparent encapsulant is disposed on the first dielectric layer and covers the plurality of wavelength conversion structures. In addition, a manufacturing method of the light-emitting diode package is provided.

公开(公告)号：US12255279B2

公开(公告)日：2025-03-18

申请号：US17583222

申请日：2022-01-25

Applicant: Unimicron Technology Corp.

Inventor： Wen-Yu Lin ,  Kai-Ming Yang

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/22 ,  H01L33/48 ,  H01L33/62

Abstract: A light-emitting diode package structure includes a heat dissipation substrate, a redistribution layer, and multiple light-emitting diodes. The heat dissipation substrate includes multiple copper blocks and a heat-conducting material layer. The copper blocks penetrate the heat-conducting material layer. The redistribution layer is disposed on the heat dissipation substrate and electrically connected to the copper blocks. The light-emitting diodes are disposed on the redistribution layer and are electrically connected to the redistribution layer. A side of the light-emitting diodes away from the redistribution layer is not in contact with any component.

公开(公告)号：US20230268256A1

公开(公告)日：2023-08-24

申请号：US17890279

申请日：2022-08-18

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Wen-Yu Lin ,  Tse-Wei Wang ,  Jun-Ho Chen ,  Guang-Hwa Ma

IPC: H01L23/498 ,  H01L23/66 ,  H01L23/13 ,  H01L23/552 ,  H01L21/48 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01L23/49811 ,  H01L23/66 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/49833 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H05K1/145 ,  H05K1/113 ,  H05K1/144 ,  H01L23/49822 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L24/16

Abstract: An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.