公开(公告)号：US09288917B2

公开(公告)日：2016-03-15

申请号：US14073873

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4679 ,  H05K1/0268 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09918 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有彼此相对的两个表面的基板和连接在其间的通孔。 接下来，通过使用通孔作为对准对象，在每个表面上形成图案化电路层。 每个图案化电路层包括同心圆图案。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 接着，在第一层叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US20160025944A1

公开(公告)日：2016-01-28

申请号：US14337248

申请日：2014-07-22

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/43 ,  H01L31/0232 ,  G02B6/42

CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。

公开(公告)号：US09198303B2

公开(公告)日：2015-11-24

申请号：US14073869

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang ,  Ai-Hwa Lim

IPC: B05D5/12 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  B05D7/00 ,  C23C18/16 ,  H05K1/11 ,  H05K3/24 ,  H05K3/12

CPC classification number: H05K3/4038 ,  B05D5/12 ,  B05D7/50 ,  C23C18/1655 ,  H05K1/0269 ,  H05K1/0298 ,  H05K1/111 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/12 ,  H05K3/244 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2203/107 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，将两个芯层压缩以形成具有彼此相对的两个表面的基板。 然后，形成连接表面的通孔。 然后通过使用通孔作为对准靶，在每个表面上形成包括同心圆图案的图案化电路层。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 然后在每个第一堆叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US11997785B2

公开(公告)日：2024-05-28

申请号：US17577359

申请日：2022-01-17

Applicant: Unimicron Technology Corp.

Inventor： Chun-Lin Liao ,  Pei-Chang Huang

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0272 ,  H05K2201/0116 ,  H05K2201/10371

Abstract: A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.

公开(公告)号：US11641720B2

公开(公告)日：2023-05-02

申请号：US17224078

申请日：2021-04-06

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Shao-Chien Lee ,  Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang ,  Pei-Chang Huang ,  Chin-Min Hu

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/34

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

公开(公告)号：US20200329565A1

公开(公告)日：2020-10-15

申请号：US16739133

申请日：2020-01-10

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Pei-Chang Huang ,  Chi-Chun Po ,  Chun-Lin Liao ,  Po-Hsiang Wang ,  Hsuan-Wei Chen

IPC: H05K3/10

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

公开(公告)号：US20200083142A1

公开(公告)日：2020-03-12

申请号：US16683266

申请日：2019-11-14

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Pei-Chang Huang

IPC: H01L23/42 ,  H01L23/498 ,  H01L23/18 ,  H01L23/367 ,  H01L23/467 ,  H01L23/14 ,  H01L21/48

Abstract: A package substrate includes a multilayer circuit structure, a gas-permeable structure, a heat conducting component, a first circuit layer, a second circuit layer and a build-up circuit structure. The gas-permeable structure and the heat conducting component are respectively disposed in a first and a second through holes of the multilayer circuit structure. The first and the second circuit layers are respectively disposed on an upper and a lower surfaces of the multilayer circuit structure and expose a first and a second sides of the gas-permeable structure. The build-up circuit structure is disposed on the first circuit layer and includes at least one patterned photo-imageable dielectric layer and at least one patterned circuit layer alternately stacked. The patterned circuit layer is electrically connected to the first circuit layer by at least one opening. The build-up circuit structure and the first circuit layer exposed by a receiving opening form a recess.

公开(公告)号：US09739963B2

公开(公告)日：2017-08-22

申请号：US15152569

申请日：2016-05-12

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/43 ,  G02B6/42 ,  H01L31/0232 ,  G02B6/12 ,  G02B6/32

CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

公开(公告)号：US08979372B2

公开(公告)日：2015-03-17

申请号：US13776737

申请日：2013-02-26

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Wen-Fang Liu ,  Cheng-Po Yu

IPC: G02B6/12 ,  H05K3/46

CPC classification number: G02B6/12 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4232 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/4626 ,  H05K2201/0187 ,  H05K2201/10121 ,  Y10T29/49126

Abstract: A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer is disposed on the substrate and the waveguide layer. The second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer. The convex structure is disposed on the sidewall of the waveguide layer. The convex structure and the waveguide layer respectively have refractive index n1 and n2, and |n1−n2|/n1

Abstract translation: 提供一种电路板及其制造方法以及具有该电路板的电光装置。 电路板包括：基板，包括第一介电层和设置在其上的第一电路层;布置在基板的一部分上的波导层，第二介电层，凸结构和第二电路层。 第二介电层设置在基板和波导层上。 第二电介质层具有暴露波导层的侧壁和第一电路层的一部分的开口。 凸形结构设置在波导层的侧壁上。 凸结构和波导层分别具有折射率n1和n2，| n1-n2 | / n1 <1％。 凸结构的表面粗糙度小于波导层的侧壁的表面粗糙度。 第二电路层设置在第二电介质层上。

公开(公告)号：US11373927B2

公开(公告)日：2022-06-28

申请号：US16683266

申请日：2019-11-14

Applicant: Unimicron Technology Corp.

Inventor： Chin-Sheng Wang ,  Ra-Min Tain ,  Pei-Chang Huang

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L23/18 ,  H01L23/467 ,  H01L23/14 ,  H01L21/48 ,  H01L23/00

Abstract: A package substrate includes a multilayer circuit structure, a gas-permeable structure, a heat conducting component, a first circuit layer, a second circuit layer and a build-up circuit structure. The gas-permeable structure and the heat conducting component are respectively disposed in a first and a second through holes of the multilayer circuit structure. The first and the second circuit layers are respectively disposed on an upper and a lower surfaces of the multilayer circuit structure and expose a first and a second sides of the gas-permeable structure. The build-up circuit structure is disposed on the first circuit layer and includes at least one patterned photo-imageable dielectric layer and at least one patterned circuit layer alternately stacked. The patterned circuit layer is electrically connected to the first circuit layer by at least one opening. The build-up circuit structure and the first circuit layer exposed by a receiving opening form a recess.