公开(公告)号：US20250040026A1

公开(公告)日：2025-01-30

申请号：US18918080

申请日：2024-10-17

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Hsuan-Wei Chen ,  Chi-Chun Po

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

Abstract: A manufacturing method of the package carrier includes the following steps. A circuit substrate having a through via is provided. A heat-conducting material layer coving the inner wall of the through via is electroplated on the circuit substrate. A first build-up structure and a second build-up structure are respectively formed on two opposite sides of the circuit substrate. Parts of the first build-up structure, the circuit substrate, the heat-conducting material layer and the second build-up structure are removed to expose the remaining heat-conducting material layer, so as to define a heat-conducting element and form a circuit structure layer including a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conducting portion is aligned with a side surface of the circuit structure layer.

公开(公告)号：US20210074606A1

公开(公告)日：2021-03-11

申请号：US16952080

申请日：2020-11-19

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Ching Sheng Chen ,  Ra-Min Tain ,  Ming-Hao Wu ,  Hsuan-Wei Chen

IPC: H01L23/373 ,  H01L23/498 ,  H01L21/48

Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

公开(公告)号：US12016133B2

公开(公告)日：2024-06-18

申请号：US17083271

申请日：2020-10-28

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Hsuan-Wei Chen

IPC: H05K3/40 ,  H01L23/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K3/4007 ,  H01L24/13 ,  H01L24/14 ,  H05K1/0296 ,  H05K3/0094 ,  H05K3/421 ,  H05K2201/0367

Abstract: A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.

公开(公告)号：US20200329565A1

公开(公告)日：2020-10-15

申请号：US16739133

申请日：2020-01-10

Applicant: Unimicron Technology Corp.

Inventor： Ra-Min Tain ,  Pei-Chang Huang ,  Chi-Chun Po ,  Chun-Lin Liao ,  Po-Hsiang Wang ,  Hsuan-Wei Chen

IPC: H05K3/10

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

公开(公告)号：US20220159824A1

公开(公告)日：2022-05-19

申请号：US17137293

申请日：2020-12-29

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Hsuan-Wei Chen ,  Chi-Chun Po

IPC: H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00 ,  H05K3/42 ,  H05K1/11 ,  H05K3/46

Abstract: A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.

公开(公告)号：US12156325B2

公开(公告)日：2024-11-26

申请号：US17137293

申请日：2020-12-29

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao Wu ,  Hsuan-Wei Chen ,  Chi-Chun Po

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

Abstract: A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.

公开(公告)号：US11545412B2

公开(公告)日：2023-01-03

申请号：US16952080

申请日：2020-11-19

Applicant: Unimicron Technology Corp.

Inventor： Pei-Wei Wang ,  Ching Sheng Chen ,  Ra-Min Tain ,  Ming-Hao Wu ,  Hsuan-Wei Chen

IPC: H01L21/48 ,  H01L23/373 ,  H01L23/498

Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.