公开(公告)号：CH697268B1

公开(公告)日：2008-07-31

申请号：CH14292004

申请日：2004-02-11

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  LAHDENPERAE JUHA ,  MUTIKAINEN RISTO

IPC: G01P15/125 ,  B81B3/00 ,  B81C1/00 ,  G01P15/08

公开(公告)号：NO20080334A

公开(公告)日：2008-03-14

申请号：NO20080334

申请日：2008-01-16

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI

IPC: G01P15/125 ,  G01P20060101 ,  G01P15/08 ,  G01P15/18

CPC classification number: G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0831 ,  Y10T29/49007

公开(公告)号：NO20054579L

公开(公告)日：2005-10-05

申请号：NO20054579

申请日：2005-10-05

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  LAHDENPERA JUHA ,  MUTIKAINEN RISTO

IPC: G01P15/08 ,  B81B3/00 ,  B81C1/00 ,  G01P15/125 ,  B81B7/00

Abstract: The invention relates to measuring devices used for the measuring of acceleration, and specifically to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention comprises a pair of electrodes composed of a movable electrode ( 4 ) and a stationary electrode ( 5 ), and, related to the pair of electrodes, an isolator protrusion having a special coating. The invention provides an improved, more durable sensor structure, which withstands wear caused by overload situations better than earlier structures.

公开(公告)号：FI20030338A0

公开(公告)日：2003-03-05

申请号：FI20030338

申请日：2003-03-05

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  LAHDENPERAE JUHA ,  MUTIKAINEN RISTO

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  G01P

Abstract: The invention relates to measuring devices used for the measuring of acceleration, and specifically to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention comprises a pair of electrodes composed of a movable electrode ( 4 ) and a stationary electrode ( 5 ), and, related to the pair of electrodes, an isolator protrusion having a special coating. The invention provides an improved, more durable sensor structure, which withstands wear caused by overload situations better than earlier structures.

公开(公告)号：FI20096034A

公开(公告)日：2011-04-09

申请号：FI20096034

申请日：2009-10-08

Applicant: VTI TECHNOLOGIES OY ,  TOYOTA MOTOR CORP

Inventor： KAERKKAEINEN ANNA-MAIJA ,  KYYNAERAEINEN JUKKA ,  ROSCHIER LEIF ,  KUISMA HEIKKI

IPC: B81B20060101 ,  H01L20060101

Abstract: A device (100) harvests energy from vibration and/or strain and utilizes both capacitive (102a, 102b) and piezoelectric elements (105). The principle of operation is out-of-plane capacitive harvester, where the bias voltage for the capacitive element is generated with a piezoelectric element (105). The device utilizes a thin dielectric film (104) between the capacitor plates (102a, 102b) maximizing the harvested energy and enabling the harvester operation in semi-contact mode so that short circuits are prevented. For example when utilized in a wheel or the like, the capacitor is closed and opened at every strike or every turn of a wheel being thus independent of the harvester's mechanical resonance frequency.

公开(公告)号：FI119728B

公开(公告)日：2009-02-27

申请号：FI20055618

申请日：2005-11-23

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI

IPC: B81B7/00 ,  B81B20060101 ,  B81C1/00 ,  B81C99/00 ,  G01C19/56 ,  G01C19/5783

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part (46), sealed by means of a cover part (24), (28), (33), (41), (47), (48), and an electronic circuit part (64), (74), suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

公开(公告)号：FI20055323A

公开(公告)日：2007-03-05

申请号：FI20055323

申请日：2005-06-17

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI

IPC: G01P15/125 ,  G01P20060101 ,  G01P15/08 ,  G01P15/18 ,  H01L21/00

Abstract: The present invention relates to measuring devices used in measuring acceleration and, more precisely, to capacitive acceleration sensors. The object of the invention is to provide an improved method of manufacturing a capacitive acceleration sensor, and to provide a capacitive acceleration sensor, which is applicable for use in small capacitive acceleration sensor solutions, and which, in particular, is applicable for use in small and extremely thin capacitive acceleration sensor solutions measuring acceleration in relation to several axes.

公开(公告)号：CA2610185A1

公开(公告)日：2006-12-21

申请号：CA2610185

申请日：2006-06-13

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI

IPC: G01P15/125 ,  G01P20060101 ,  G01P15/08 ,  G01P15/18

Abstract: The present invention relates to measuring devices used in measuring acceleration and, more precisely, to capacitive acceleration sensors. The object of the invention is to provide an improved method of manufacturing a capacitive acceleration sensor, and to provide a capacitive acceleration sensor, which is applicable for use in small capacitive acceleration sensor solutions, and which, in particular, is applicable for use in small and extremely thin capacitive acceleration sensor solutions measuring acceleration in relation to several axes.

公开(公告)号：FI20065484A0

公开(公告)日：2006-07-07

申请号：FI20065484

申请日：2006-07-07

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI ,  NIEMISTOE JIRI

IPC: H05K20060101 ,  B81B20060101 ,  B81C1/00 ,  B81C99/00 ,  G01C19/56 ,  G01C19/5783 ,  G01P15/18

Abstract: The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises, suitably bonded to each other, a microelectromechanical chip part sealed by a cover part, and at least one electronic circuit part. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

公开(公告)号：NO20080334L

公开(公告)日：2008-03-14

申请号：NO20080334

申请日：2008-01-16

Applicant: VTI TECHNOLOGIES OY

Inventor： KUISMA HEIKKI

IPC: G01P15/125 ,  G01P20060101 ,  G01P15/08 ,  G01P15/18

Abstract: The present invention relates to measuring devices used in measuring acceleration and, more precisely, to capacitive acceleration sensors. The object of the invention is to provide an improved method of manufacturing a capacitive acceleration sensor, and to provide a capacitive acceleration sensor, which is applicable for use in small capacitive acceleration sensor solutions, and which, in particular, is applicable for use in small and extremely thin capacitive acceleration sensor solutions measuring acceleration in relation to several axes.