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公开(公告)号：CN100367109C
公开(公告)日：2008-02-06
申请号：CN03103150.1
申请日：2003-01-31
Applicant: 惠普公司
Inventor： H·李
IPC: G03F7/00
CPC classification number: B29C59/022 , B29C2059/023 , B81C99/009 , B81C2201/036 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10T428/24479 , Y10T428/2457 , Y10T428/24579 , Y10T428/24595
Abstract: 本发明公开一种大面积纳米尺寸压印模。大面积纳米尺寸压印模包括具有基部表面的基底，在基部表面上形成多个微特征。每个微特征包括多个淀积在其相对侧表面上的间隔体。间隔体从相对的侧表面侧向朝外延伸而微特征和间隔体从基部表面向外延伸。选择性地蚀刻微特征和间隔体以便产生高度差从而限定具有印记轮廓的压印模。可以在基底的基本上所有可用面积上形成压印模，压印模可以有在各压印模之间变化的复杂形状。可以将压印模用作模板把印记轮廓传递给掩膜层，在掩膜层中将复制出印记轮廓。
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公开(公告)号：CN1435728A
公开(公告)日：2003-08-13
申请号：CN03103150.1
申请日：2003-01-31
Applicant: 惠普公司
Inventor： H·李
IPC: G03F7/00
CPC classification number: B29C59/022 , B29C2059/023 , B81C99/009 , B81C2201/036 , B82Y10/00 , B82Y40/00 , G03F7/0002 , Y10T428/24479 , Y10T428/2457 , Y10T428/24579 , Y10T428/24595
Abstract: 本发明公开一种大面积纳米尺寸压印模。大面积纳米尺寸压印模包括具有基部表面的基底，在基部表面上形成多个微特征。每个微特征包括多个淀积在其相对侧表面上的间隔体。间隔体从相对的侧表面侧向朝外延伸而微特征和间隔体从基部表面向外延伸。选择性地蚀刻微特征和间隔体以便产生高度差从而限定具有印记轮廓的压印模。可以在基底的基本上所有可用面积上形成压印模，压印模可以有在各压印模之间变化的复杂形状。可以将压印模用作模板把印记轮廓传递给掩膜层，在掩膜层中将复制出印记轮廓。
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公开(公告)号：US20180016136A1
公开(公告)日：2018-01-18
申请号：US15546260
申请日：2016-01-21
Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Inventor： Muchen Xu , Chang-Jin Kim
CPC classification number: B81C1/00373 , B29C33/42 , B29C33/44 , B29C33/64 , B81B2207/056 , B81C1/00111 , B81C1/00357 , B81C1/00555 , B81C99/0085 , B81C2201/0198 , B81C2201/036 , B81C2203/0136 , B81C2203/036 , B81C2203/0757
Abstract: A method of making microstructures having re-entrant or doubly re-entrant topology includes forming a mold defining the negative surface features of the re-entrant or doubly re-entrant topology that is to be formed. In one embodiment, a soft or flowable material is formed on a first substrate and the mold is contacted with the same to form a solid, now positive surface having the re-entrant or doubly re-entrant topology. The mold is then released from the first substrate. The microstructures are secured to a second, different substrate, and the first substrate is removed. Any residual microstructure material located between adjacent microstructures may be removed to form the separate microstructures on the second substrate. The second substrate may be thin and flexible any manipulated into useful or desired shapes having the microstructures on one side thereof.
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公开(公告)号：US20160207758A1
公开(公告)日：2016-07-21
申请号：US14914015
申请日：2014-08-26
Applicant: SILEX MICROSYSTEMS AB
Inventor： Edvard KALVESTEN , Thorbjorn EBEFORS , Niklas SVEDIN
CPC classification number: B81B7/007 , B81B2201/01 , B81B2201/0264 , B81B2201/0271 , B81B2203/0118 , B81B2203/0127 , B81B2207/095 , B81C1/00301 , B81C2201/0153 , B81C2201/036 , B81C2203/0109 , B81C2203/0145 , H01L21/50 , H01L23/08 , H01L24/94 , H01L2924/16235
Abstract: A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702). It also includes spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via the spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) includes vias (710) including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.
Abstract translation: 一种装置包括具有附接到其上的微型部件（702）的基底（700）。 适当地，它设置有用于向组件（702）进行信号的路由选择元件（704）。 它还包括间隔件（706），其也可以用作垂直路线信号的导电结构。 优选地通过共晶接合，通过间隔件（706），设置在基底基板（700）上方的玻璃材料的封盖结构（708），其中封盖结构（708）包括通孔（710），包括金属 用于提供通过封盖结构的电连接。 通孔可以通过冲压/压制方法制成，在加热下需要加压针，使玻璃软化并施加压力至玻璃中预定的深度。 然而，其他方法是可行的，例如钻孔，蚀刻，爆破。
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15.发明申请Device and Method for Obtaining a Substrate Structured on Micrometric or Nanometric Scale 审中-公开用于获得微米或纳米尺度结构的基板的装置和方法公开(公告)号：US20090080323A1
公开(公告)日：2009-03-26
申请号：US12226923
申请日：2007-05-04
Applicant: Massimiliano Cavallini , Gianluca Massaccesi , Francesco Cino Matacotta , Fabio Biscarini
CPC classification number: G03F7/0002 , B29C59/022 , B29C2059/023 , B81C1/00111 , B81C2201/036 , B82Y10/00 , B82Y40/00 , Y10T428/24802
Abstract: A method for providing a locally rough surface which is spatially structured on micrometric and/or nanometric scale and is formed by a substrate, so as to obtain a product. The method comprises the steps of flattening and/or smoothing the rough substrate in preset regions.
Abstract translation: 一种用于提供局部粗糙表面的方法，该表面由微米和/或纳米尺度空间结构，并由基底形成，以获得产品。 该方法包括在预设区域中平坦化和/或平滑粗糙衬底的步骤。
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Patent Agency Ranking
16.发明申请Nano impression lithographic process which involves the use of a die having a region able to generate heat 有权涉及使用具有能够产生热量的区域的模具的纳米压印平版印刷工艺公开(公告)号：US20070063390A1
公开(公告)日：2007-03-22
申请号：US10562014
申请日：2004-06-22
Applicant: Tormen Massimo
Inventor： Tormen Massimo
IPC: B29C59/02
CPC classification number: G03F7/0002 , B29C33/02 , B81C99/0085 , B81C2201/0153 , B81C2201/036 , B82Y10/00 , B82Y40/00
Abstract: A lithographic process for forming a pattern in relief (20) on a mass (10) of polymeric material comprises the steps of: preparing the mass (10) of polymeric material and a die (12) having a surface region (14) facing towards the mass (10) of polymeric material and which reproduces in negative the pattern in relief (20); heating the die (12) and putting the mass (10) of polymeric material into contact with the die (12) in any temporal sequence, in such a way that the part of the mass (10) of polymeric material in contact with the surface zone (14) is subject to softening; and separating the die (12) from the mass (10) of polymeric material on the surface of which the pattern in relief (20) has been formed. The heating of at least one part of the die (12) is obtained by generation of thermal energy upon dissipation of another form of energy in at least one region (16) of the die (12).
Abstract translation: 用于在聚合物材料（10）上形成浮雕（20）中的图案的平版印刷工艺包括以下步骤：制备聚合物材料块（10）和模具（12），所述模具（12）具有面向 聚合物材料的质量（10）并且以凹凸（20）的形式呈现为负值; 加热模具（12）并将聚合材料的质量块（10）以任何时间顺序与模具（12）接触，使得聚合材料质量（10）的与表面接触的部分 区域（14）容易软化; 以及将模具（12）与形成有凹凸图案（20）的表面上的聚合材料块（10）分离。 模具（12）的至少一部分的加热通过在模具（12）的至少一个区域（16）中消散另一形式的能量时产生热能而获得。
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公开(公告)号：US20030192587A1
公开(公告)日：2003-10-16
申请号：US10454985
申请日：2003-06-04
Inventor： Guillaume Guzman , Jean-Pierre Themont
IPC: F15C001/06
CPC classification number: B81C1/00119 , B01L3/5027 , B33Y70/00 , B33Y80/00 , B81B2201/058 , B81B2203/0353 , B81C1/00071 , B81C2201/019 , B81C2201/036 , C03B19/063 , C03B23/20 , Y10T137/0391 , Y10T137/0402 , Y10T137/2224 , Y10T137/6416
Abstract: The present invention relates to microfluidic devices and to their method of manufacture. The microfluidic devices are original by their specific structure (of sandwich type) and by the materials from which they are made (mainly glasses, glass ceramics, ceramics), and also by their specific method of manufacture, which is based on a vacuum-forming operation. The microfluidic device includes a first assembly including a microstructure and a first substrate, wherein the microstructure is constructed and arranged on the substrate under vacuum. A second assembly includes a second substrate positioned on the microstructure after the first assembly is presintered and adhered thereto by heat treatment to form a one-piece microstructure defining at least one recess between the first and second substrates.
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公开(公告)号：US06451240B1
公开(公告)日：2002-09-17
申请号：US09579798
申请日：2000-05-26
Applicant: Faiz Feisal Sherman , Vadim Vladimirovich Yuzhakov , Vladimir Gartstein , Grover David Owens
Inventor： Faiz Feisal Sherman , Vadim Vladimirovich Yuzhakov , Vladimir Gartstein , Grover David Owens
IPC: B26F124
CPC classification number: B29C51/082 , A61M37/00 , A61M37/0015 , A61M2037/0023 , A61M2037/003 , A61M2037/0053 , B26F1/24 , B29C33/0033 , B29C33/42 , B29C37/0053 , B29C45/2628 , B29C51/00 , B29C2059/023 , B29L2031/7544 , B29L2031/756 , B81B2201/055 , B81C1/00111 , B81C2201/036
Abstract: A microneedle array is manufactured using a mold preparation procedure that begins by placing an optical mask over a layer of PMMA material, exposing the PMMA material to x-rays, then developing using a photoresist process. The remaining PMMA material is then electroplated with metal. Once the metal has reached an appropriate thickness, it is detached to become a metal mold that is used in a microembossing procedure, in which the metal mold is pressed against a heated layer of plastic material. Once the mold is pressed down to its proper distance, the plastic material is cooled until solidified, and the mold is then detached, thereby leaving behind an array of microneedles.
Abstract translation: 使用模具制备程序制造微针阵列，其通过在PMMA材料层上放置光学掩模开始，将PMMA材料暴露于x射线，然后使用光致抗蚀剂工艺显影。 然后将剩余的PMMA材料用金属电镀。 一旦金属达到适当的厚度，就将其分离成为用于微压制程序的金属模具，其中金属模具被压在加热的塑料材料层上。 一旦将模具按压到适当的距离，塑料材料被冷却直到固化，然后将模具分离，从而留下一组微针。
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公开(公告)号：US5512131A
公开(公告)日：1996-04-30
申请号：US131841
申请日：1993-10-04
Applicant: Amit Kumar , George M. Whitesides
Inventor： Amit Kumar , George M. Whitesides
IPC: B05D1/28 , C40B60/14 , G02B5/18 , G02B6/12 , G02B6/36 , G03F7/00 , G03F7/16 , H01L21/48 , H01L21/768 , B44C1/22
CPC classification number: B81C1/00206 , B05D1/283 , B82Y10/00 , B82Y30/00 , B82Y40/00 , G02B5/1857 , G03F7/0002 , G03F7/165 , H01L21/4867 , H01L21/768 , B01J2219/00382 , B01J2219/00605 , B01J2219/00612 , B01J2219/00619 , B01J2219/0063 , B01J2219/00659 , B81B2201/0214 , B81C2201/036 , C40B60/14 , G02B2006/12102 , G02B2006/12107 , G03H1/182
Abstract: A method of patterning a material surface is provided in which an elastomeric stamp having a stamping surface is coated with a self-assembled monolayer forming species having a functional group selected to bind to a particular material, and the stamping surface is placed against a surface of material and is removed to leave a self-assembled monolayer of the species according to the stamping surface pattern of the stamp. Additional stamping steps may be subsequently effected to produce any of a variety of SAM patterns on the surface. Additionally, portions of the material surface that are not coated with a stamped SAM pattern may be filled in with another SAM-forming species. Alternately, portions that are not covered by a SAM layer may be etched or plated. Additionally, an optical switch and other optical devices and elements are provided, comprising articles similar to the inventive stamp.
Abstract translation: 提供了图案化材料表面的方法，其中具有冲压表面的弹性体印模涂覆有具有选定成结合特定材料的官能团的自组装单层形成物质，并且将冲压表面放置在 材料，并根据印模的冲压表面图案移除以留下物种的自组装单层。 随后可以进行额外的冲压步骤以产生表面上的各种SAM图案中的任何一种。 此外，未涂覆冲压的SAM图案的材料表面的部分可以用另外的SAM形成物质填充。 或者，可以蚀刻或镀覆未被SAM层覆盖的部分。 另外，提供光学开关和其它光学装置和元件，其包括与本发明的印模相似的制品。
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20.发明授权
公开(公告)号：EP2457880B1
公开(公告)日：2014-03-05
申请号：EP10306303.8
申请日：2010-11-26
Applicant: Corning Incorporated
CPC classification number: C03B23/02 , B81B2201/051 , B81B2203/0338 , B81C99/0085 , B81C2201/019 , B81C2201/036
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