Abstract:
A protected faceplate structure (900) includes a faceplate (100) and a barrier layer (902) of silica. The faceplate (100) may be made of soda glass, and the barrier layer (902) may be made of silica.
Abstract:
A photocathode emitter (500) as a source of electron beams (504), having an optically transmissive substrate (501) patterned to define a protrusion, heat conducting material (506) occupying the space surrounding the protrusion, and a photoemitter layer (502) over the protrusion. The photoemitter is positioned on the side of the substrate opposite the surface on which the illumination is incident, and has an irradiation region (505) at the contact with the top of the protrusion patterned on the substrate, and an emission region (508) opposite the irradiation region, these regions being defined by the path of the illumination. The heat conducting material around the protrusion conducts heat away from this focused region of illumination on the photocathode. The thermal conductivity of heat-conducting materials such as gold, copper, and platinum is at least 200 times greater than that of fused silica, which is a substrate material typically used in photocathodes. This efficiently conducts heat away from the irradiation region/emission region interface, and therefore allows higher currents to be achieved from the photocathode. This in turn, permits higher throughput rates in applications including electron beam lithography.
Abstract:
A photocathode emitter (500) as a source of electron beams (504), having an optically transmissive substrate (501) patterned to define a protrusion, heat conducting material (506) occupying the space surrounding the protrusion, and a photoemitter layer (502) over the protrusion. The photoemitter is positioned on the side of the substrate opposite the surface on which the illumination is incident, and has an irradiation region (505) at the contact with the top of the protrusion patterned on the substrate, and an emission region (508) opposite the irradiation region, these regions being defined by the path of the illumination. The heat conducting material around the protrusion conducts heat away from this focused region of illumination on the photocathode. The thermal conductivity of heat-conducting materials such as gold, copper, and platinum is at least 200 times greater than that of fused silica, which is a substrate material typically used in photocathodes. This efficiently conducts heat away from the irradiation region/emission region interface, and therefore allows higher currents to be achieved from the photocathode. This in turn, permits higher throughput rates in applications including electron beam lithography.
Abstract:
A protected faceplate structure (900) includes a faceplate (100) and a barrier layer (902) of silica. The faceplate (100) may be made of soda glass, and the barrier layer (902) may be made of silica.
Abstract:
A photocathode emitter (500) as a source of electron beams (504), having an optically transmissive substrate (501) patterned to define a protrusion, heat conducting material (506) occupying the space surrounding the protrusion, and a photoemitter layer (502) over the protrusion. The photoemitter is positioned on the side of the substrate opposite the surface on which the illumination is incident, and has an irradiation region (505) at the contact with the top of the protrusion patterned on the substrate, and an emission region (508) opposite the irradiation region, these regions being defined by the path of the illumination. The heat conducting material around the protrusion conducts heat away from this focused region of illumination on the photocathode. The thermal conductivity of heat-conducting materials such as gold, copper, and platinum is at least 200 times greater than that of fused silica, which is a substrate material typically used in photocathodes. This efficiently conducts heat away from the irradiation region/emission region interface, and therefore allows higher currents to be achieved from the photocathode. This in turn, permits higher throughput rates in applications including electron beam lithography.