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公开(公告)号：US09552953B2
公开(公告)日：2017-01-24
申请号：US14753380
申请日：2015-06-29
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： Bing-Chu Du , Peng Liu , Duan-Liang Zhou , Chun-Hai Zhang , Shou-Shan Fan
CPC classification number: H01J1/304 , H01J3/021 , H01J9/025 , H01J2201/30469 , H01J2203/0268 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288
Abstract: The disclosure relates to a field emission cathode. The field emission cathode includes a microchannel plate, a cathode electrode and a number of cathode emitters. The microchannel plate is an insulative plate and includes a first surface and a second surface opposite to the first surface. The microchannel plate defines a number of holes extending through the microchannel plate from the first surface to the second surface. The cathode electrode is located on the first surface. The number of cathode emitters are filled in the number of holes and electrically connected with the cathode electrode.
Abstract translation: 本发明涉及场致发射阴极。 场发射阴极包括微通道板，阴极电极和多个阴极发射体。 微通道板是绝缘板，包括第一表面和与第一表面相对的第二表面。 微通道板限定了从第一表面到第二表面延伸穿过微通道板的许多孔。 阴极位于第一表面。 阴极发射体的数量填充有孔数并与阴极电连接。
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公开(公告)号：US20160013005A1
公开(公告)日：2016-01-14
申请号：US14753380
申请日：2015-06-29
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： BING-CHU DU , PENG LIU , DUAN-LIANG ZHOU , CHUN-HAI ZHANG , SHOU-SHAN FAN
IPC: H01J1/304
CPC classification number: H01J1/304 , H01J3/021 , H01J9/025 , H01J2201/30469 , H01J2203/0268 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288
Abstract: The disclosure relates to a field emission cathode. The field emission cathode includes a microchannel plate, a cathode electrode and a number of cathode emitters. The microchannel plate is an insulative plate and includes a first surface and a second surface opposite to the first surface. The microchannel plate defines a number of holes extending through the microchannel plate from the first surface to the second surface. The cathode electrode is located on the first surface. The number of cathode emitters are filled in the number of holes and electrically connected with the cathode electrode.
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13.发明申请Dielectric and display device having a dielectric and dielectric manufacturing method 失效具有电介质和电介质制造方法的介电和显示装置公开(公告)号：US20070224429A1
公开(公告)日：2007-09-27
申请号：US11725945
申请日：2007-03-20
Applicant: Keiichiro Hayakawa , Masakatsu Kuroki
Inventor： Keiichiro Hayakawa , Masakatsu Kuroki
CPC classification number: C03C17/34 , B32B17/06 , C03C3/066 , C03C4/16 , C03C8/04 , C03C17/3411 , H01J3/021 , H01J9/02 , H01J29/481 , H01J31/127 , H01J2203/0268 , H01J2329/4669
Abstract: This invention provides a thick-film type dielectric with desired adhesivity to the base and very good insulation properties. The dielectric of the present invention includes a lower dielectric layer made of a photosensitive composition and an upper dielectric layer which is made of a photosensitive composition and formed on the aforementioned lower dielectric layer. The softening point (T1) of the primary glass powder used for the aforementioned lower dielectric layer, the softening point (T2) of the primary glass powder used for the aforementioned upper dielectric layer, and the firing temperature (T3) of the aforementioned primary glass powder satisfy the following relationship: T1
Abstract translation: 本发明提供了一种具有与基底具有所需粘合性的厚膜型电介质和非常好的绝缘性能。 本发明的电介质包括由光敏组合物制成的下电介质层和由感光组合物制成并形成在上述下介电层上的上电介质层。 用于上述下部电介质层的一次玻璃粉末的软化点（T1），上述上部电介质层中使用的一次玻璃粉末的软化点（T2）和上述初级玻璃的烧成温度（T3） 粉末满足以下关系：T1
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14.发明申请DEVICE FOR THE EXTRACTION OF ELECTRONS IN FIELD EMISSION SYSTEMS AND METHOD TO FORM THE DEVICE 审中-公开用于在场发射系统中提取电子的装置和形成装置的方法
公开(公告)号：WO2016024878A1
公开(公告)日：2016-02-18
申请号：PCT/RU2014/000607
申请日：2014-08-13
Applicant: SIEMENS AKTIENGESELLSCHAFT
Inventor： BONDARENKO, Taras Vladimirovich , BOTYACHKOVA, Alexandra Igorevna , KARPINSKIY, Gennadiy Gennadievich , POLIKHOV, Stepan Alexandrovich
CPC classification number: H01J3/021 , H01J9/48 , H01J23/06 , H01J29/46 , H01J29/481 , H01J35/065 , H01J2201/30473 , H01J2203/0212 , H01J2203/0268 , H01J2329/4608 , H01J2329/4669
Abstract: The present invention relates to a device (1) for the extraction of electrons in field emission systems comprising a cathode (2) as electron source, a dielectric grid layer (3) and a conduction layer (4). The device (1) is in the form of a sandwich layered structure with cathode (2), grid layer (3) and conduction layer (4) arranged in the form of a stack. The invention further relates to a method to form the device (1) comprising steps forming the cathode (2) as electron source on one side of a dielectric substrate, forming the dielectric grid layer (3) within the substrate and forming the conduction layer (4) on the opposite side to the cathode (2) within the substrate.
Abstract translation: 本发明涉及一种用于在场发射系统中提取电子的装置（1），其包括作为电子源的阴极（2），电介质栅层（3）和导电层（4）。 装置（1）为具有以堆叠形式布置的阴极（2），栅格层（3）和导电层（4）的夹层结构形式。 本发明还涉及一种形成器件（1）的方法，包括在电介质基片一侧形成阴极（2）作为电子源的步骤，在衬底内形成电介质栅层（3）并形成导电层（ 4）在衬底内的与阴极（2）相反的一侧。
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公开(公告)号：WO2013138177A1
公开(公告)日：2013-09-19
申请号：PCT/US2013/029874
申请日：2013-03-08
Applicant: UT-BATTELLE, LLC , KISNER, Roger A. , KORSAH, Kofi , SIMPSON, John T. , MELIN, Alexander M.
Inventor： KISNER, Roger A. , KORSAH, Kofi , SIMPSON, John T. , MELIN, Alexander M.
CPC classification number: H01J1/3044 , B82Y10/00 , H01J3/022 , H01J9/025 , H01J19/24 , H01J19/28 , H01J21/10 , H01J2201/30407 , H01J2201/3043 , H01J2201/30434 , H01J2203/0268
Abstract: A field emission device includes a substrate and a plurality of wires embedded in the substrate. The plurality of wires has at least a field emitter cathode wire; a control grid wire array; and a collector anode array. The field emitter cathode wire, control grid wire array, and collector anode array are embedded in and extend through a nonconductive substrate matrix. A method for making a vacuum field emission device is also disclosed.
Abstract translation: 场致发射器件包括衬底和嵌入衬底中的多根电线。 多根导线至少具有场发射极阴极线; 控制网格线阵列; 和集电极阳极阵列。 场发射极阴极线，控制栅格线阵列和集电极阳极阵列嵌入并延伸穿过非导电基片阵列。 还公开了一种制造真空场发射装置的方法。
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Patent Agency Ranking
公开(公告)号：JP2016018779A
公开(公告)日：2016-02-01
申请号：JP2014213441
申请日：2014-10-20
Applicant: ツィンファ ユニバーシティ , 鴻海精密工業股▲ふん▼有限公司
CPC classification number: H01J1/304 , H01J3/021 , H01J9/025 , H01J2201/30469 , H01J2203/0268 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288
Abstract: 【課題】電界放出陰極素子及びその製造方法、並びに電界放出装置に関する。 【解決手段】電界放出陰極素子100は、第一基板110と、複数の陰極放出体120と、を含み、第一基板110は導電材料からなり、第一表面1104及び該第一表面1104と対向する第二表面1106を有し、第一基板110は複数の第一孔1102を有し、各第一孔1102は第一表面1104から第二表面1106まで貫通し、複数の陰極放出体120は各第一孔1102に充填され、且つ第一基板110と電気的に接続され、各第一孔1102における複数の陰極放出体120は相互に連接され、第一孔1102の内壁と接触して固定され、複数の陰極放出体120は複数のカーボンナノチューブ1202を含み、複数のカーボンナノチューブ1202の少なくとも一部は、電界放出端を形成する。 【選択図】図2
Abstract translation: 要解决的问题：提供场发射阴极元件并提供其制造方法和场发射器件。解决方案：场发射阴极元件100包括第一衬底110和多个阴极发射器120。 第一基板110由导电材料构成，并且具有面向第一表面1104的第一表面1104和第二表面1106.第一基板110具有多个第一孔1102，每个第一孔1102从第一表面1104穿透到第二表面1104。 多个阴极发射器120填充每个第一孔1102，并与第一衬底110电连接。每个第一孔1102中的多个阴极发射器120彼此连接，并固定成与第一衬底110的内壁 第一孔1102.多个阴极发射器120包括多个碳纳米管1202，其中至少一些形成场发射端。选择的图示：图2
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公开(公告)号：JP5878222B2
公开(公告)日：2016-03-08
申请号：JP2014213441
申请日：2014-10-20
Applicant: ツィンファ ユニバーシティ , 鴻海精密工業股▲ふん▼有限公司
CPC classification number: H01J1/304 , H01J3/021 , H01J9/025 , H01J2201/30469 , H01J2203/0268 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288
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18.发明专利Dielectric, display device with dielectric and method of producing dielectric 审中-公开电介质，具有介电性的显示装置和制造电介质的方法
公开(公告)号：JP2007317642A
公开(公告)日：2007-12-06
申请号：JP2007077370
申请日：2007-03-23
Applicant: E I Du Pont De Nemours & Co , イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company
Inventor： HAYAKAWA KEIICHIRO , KUROKI MASAKATSU
IPC: H01B3/00 , C03C8/04 , G03F7/004 , G03F7/40 , H01B19/00 , H01J1/304 , H01J9/02 , H01J11/02 , H01J31/12
CPC classification number: C03C17/34 , B32B17/06 , C03C3/066 , C03C4/16 , C03C8/04 , C03C17/3411 , H01J3/021 , H01J9/02 , H01J29/481 , H01J31/127 , H01J2203/0268 , H01J2329/4669
Abstract: PROBLEM TO BE SOLVED: To provide a thick-film dielectric having desirable adhesiveness to a base and very good insulation property. SOLUTION: The dielectric comprises a lower dielectric layer made of photosensitive composition and an upper dielectric layer made of photosensitive composition formed on the lower dielectric layer. There is the relationship of T1 COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供具有对基底具有期望的粘合性的厚膜电介质和非常好的绝缘性。 解决方案：电介质包括由感光组合物制成的下电介质层和由形成在下电介质层上的感光组合物制成的上电介质层。 在用于下电介质层（T1）的主要玻璃粉末的软化点，用于上部电介质层（T2）的主要玻璃粉末的软化点之间存在T1
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公开(公告)号：KR100874281B1
公开(公告)日：2008-12-18
申请号：KR1020070028611
申请日：2007-03-23
Applicant: 이 아이 듀폰 디 네모아 앤드 캄파니
Inventor： 하야까와,게이이찌로 , 구로끼,마사까쯔
IPC: H01B5/14
CPC classification number: C03C17/34 , B32B17/06 , C03C3/066 , C03C4/16 , C03C8/04 , C03C17/3411 , H01J3/021 , H01J9/02 , H01J29/481 , H01J31/127 , H01J2203/0268 , H01J2329/4669
Abstract: This invention provides a thick-film type dielectric with desired adhesivity to the base and very good insulation properties. The dielectric of the present invention includes a lower dielectric layer made of a photosensitive composition and an upper dielectric layer which is made of a photosensitive composition and formed on the aforementioned lower dielectric layer. The softening point (T1) of the primary glass powder used for the aforementioned lower dielectric layer, the softening point (T2) of the primary glass powder used for the aforementioned upper dielectric layer, and the firing temperature (T3) of the aforementioned primary glass powder satisfy the following relationship: T1
Abstract translation: 本发明提供了对基底具有所需粘附性和非常好的绝缘性能的厚膜型电介质。 本发明的电介质包括由光敏组合物制成的下电介质层和由光敏组合物制成并形成在上述下电介质层上的上电介质层。 用于上述下介电层的初级玻璃粉末的软化点（T1），用于上述上介电层的初级玻璃粉末的软化点（T2）和上述初级玻璃的烧制温度（T3） 粉末满足以下关系：T1＆lt; T3＆lt; T2＆lt; T3 + 30℃。
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公开(公告)号：KR1020070096895A
公开(公告)日：2007-10-02
申请号：KR1020070028611
申请日：2007-03-23
Applicant: 이 아이 듀폰 디 네모아 앤드 캄파니
Inventor： 하야까와,게이이찌로 , 구로끼,마사까쯔
IPC: H01B5/14
CPC classification number: C03C17/34 , B32B17/06 , C03C3/066 , C03C4/16 , C03C8/04 , C03C17/3411 , H01J3/021 , H01J9/02 , H01J29/481 , H01J31/127 , H01J2203/0268 , H01J2329/4669
Abstract: A dielectric material, a display device having the dielectric material, and a method for manufacturing the dielectric material are provided to increase an adhesion property of the dielectric material, even when the dielectric material is mixed with a glass substrate, by sintering a micro circuit at a temperature of 850°C. A dielectric material contains a lower dielectric layer(208) and an upper dielectric layer(210), which is formed on the lower dielectric layer. The lower dielectric layer contains first primary glass powders. The upper dielectric layer contains second primary glass powders. A relation among a softening point(T1) of the first primary glass powder, a softening point(T2) of the second primary glass powder, and a sintering temperature(T3) of the primary glass powders at a maximum volume satisfy the following relation, T1
Abstract translation: 提供电介质材料，具有电介质材料的显示装置和制造电介质材料的方法，以提高电介质材料的粘附性，即使当电介质材料与玻璃基板混合时，通过将微电路烧结 温度为850°C。 电介质材料包含形成在下电介质层上的下电介质层（208）和上电介质层（210）。 下介电层包含第一初级玻璃粉末。 上介电层含有第二主玻璃粉末。 第一初级玻璃粉末的软化点（T1），第二级玻璃粉末的软化点（T2）与初级玻璃粉末的最大体积的烧结温度（T3）之间的关系满足以下关系： T1
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