-
公开(公告)号：US09793034B2
公开(公告)日：2017-10-17
申请号：US14625983
申请日：2015-02-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jong-hyun Seok
CPC classification number: H01C13/02 , G11C5/04 , G11C7/10 , G11C11/401 , H05K1/117 , H05K3/3415 , H05K2201/0385 , H05K2201/09545 , H05K2201/10159
Abstract: A semiconductor module includes a printed circuit board including an integrated circuit chip, connecting terminals at an edge of the printed circuit board, and signal lines respectively connecting electrical connection pads of the integrated circuit chip to the connecting terminals. The connecting terminals are plated using via-holes of the printed circuit board respectively connected to the signal lines.
-
公开(公告)号：US20130020606A1
公开(公告)日：2013-01-24
申请号：US13186461
申请日：2011-07-19
Applicant: Chang HAN , Lac NGUYEN
Inventor： Chang HAN , Lac NGUYEN
CPC classification number: H05K1/0203 , H01L33/62 , H01L33/642 , H01L2224/48091 , H05K1/0204 , H05K1/0306 , H05K1/05 , H05K2201/0385 , H05K2201/09045 , H05K2201/09054 , H05K2201/10106 , H05K2201/10416 , H05K2201/10969 , H01L2924/00014
Abstract: An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.
Abstract translation: 提出了一种具有改进的电路板LED支撑结构的LED器件。 该LED装置的导热基板的顶面包括导热柱。 柱子不被电介质层覆盖，并且LED封装直接布置在柱上，LED封装底部导热板与柱顶表面直接接触。
-
13.发明申请Process for producing a printed wiring board-forming sheet and multi-layered printed wiring board 有权制造印刷线路板形成片和多层印刷线路板的方法公开(公告)号：US20040111882A1
公开(公告)日：2004-06-17
申请号：US10728177
申请日：2003-12-04
Inventor： Toshiyuki Nakamura , Hideto Tanaka , Akira Ichiryu , Motonobu Takahashi , Masahito Ishii , Daisuke Arai
IPC: H05K003/36 , H05K003/02 , H05K001/00
CPC classification number: H05K3/4614 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K3/4038 , H05K3/4046 , H05K3/4617 , H05K3/462 , H05K2201/0385 , H05K2201/10378 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
Abstract: A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.
Abstract translation: 一种印刷线路板形成用片材的制造方法，其特征在于，具有在厚度方向上具有通孔的树脂片和插入所述通孔的金属片。 该片材通过将树脂片和导电金属片依次放置在具有模孔的模座上，从导电金属片侧进行冲压以在导电金属片中形成冲孔并在 树脂片，并将穿孔的导电金属芯片插入树脂片的通孔中，由此片材的前表面和后表面可以彼此电连接。 如果导电金属芯片如此插入，使得其尖端从片材的表面突出，并且如果大量这样的衬底被层压，则厚度方向上的电连接可以容易地由于突出的导电金属片和 多层板可以很容易地生产。
-
14.发明公开SHEET FOR PRINTED WIRING BOARD, METHOD OF FORMING VIA, RESIN SHEET HAVING FILLED VIA, PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开FILM用于印刷电路板，产生具有接触孔，PCB AND METHOD FOR填补了KONTAKLOCHS，树脂片材的方法及其
公开(公告)号：EP1107654A4
公开(公告)日：2006-05-24
申请号：EP00922937
申请日：2000-05-01
Applicant: MITSUI MINING & SMELTING CO , SUZUKI CO LTD
Inventor： NAKAMURA TOSHIYUKI , TANAKA HIDETO , ICHIRYU AKIRA , TAKAHASHI M , ISHII MASATO , ARAI DAISUKE
CPC classification number: H05K3/4614 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K3/4038 , H05K3/4046 , H05K3/4617 , H05K3/462 , H05K2201/0385 , H05K2201/10378 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
Abstract: A sheet for forming a printed wiring board which comprises a resin sheet (18) having a through-hole in the thickness direction and a metallic chip (46) inserted into the through-hole, and a method of manufacturing this sheet. The resin sheet (18) and a conductive metallic sheet (44) are placed in this order on a die base (16) having a die hole (14), then a hole is formed in the conductive metal sheet (44) with a punch (10) from the conductive metal sheet (44) side. At the same time, a hole (20) is also formed in the resin sheet, the conductive metal chip (46) formed by the punching from the conductive metal sheet (44) is inserted into the through-hole formed in the resin sheet (18). Thus, the sheet is manufactured. The front and rear surfaces of the sheet can be electrically interconnected by inserting this conductive metal chip (46) into the through-hole, and many substrates are stacked and by protruding and inserting the conductive metal chip (46). Thereby, the sheets can be electrically connected in the thickness direction by this protruded conductive metal chip (46) and a multilayer laminated board can be easily manufactured.
-
15.发明公开SHEET FOR PRINTED WIRING BOARD, METHOD OF FORMING VIA, RESIN SHEET HAVING FILLED VIA, PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开FILM用于印刷电路板，产生具有接触孔，PCB AND METHOD FOR填补了KONTAKLOCHS，树脂片材的方法及其
公开(公告)号：EP1107654A1
公开(公告)日：2001-06-13
申请号：EP00922937.8
申请日：2000-05-01
Applicant: Mitsui Mining & Smelting Co., Ltd. , Suzuki Co., Ltd
Inventor： NAKAMURA, Toshiyuki, Suzuki Co., Ltd , TANAKA, Hideto, Suzuki Co., Ltd. , ICHIRYU, Akira, Mitsui Mining & Smelting Co., Ltd , TAKAHASHI, M., Mitsui Min. & Smelt. Co., Ltd , ISHII, Masato , ARAI, Daisuke, Mitsui Mining & Smelting Co., Ltd
CPC classification number: H05K3/4614 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K3/4038 , H05K3/4046 , H05K3/4617 , H05K3/462 , H05K2201/0385 , H05K2201/10378 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
Abstract: The present invention provides a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole, and a process for producing the sheet. The sheet is produced by placing a resin sheet and a conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole also in the resin sheet, and inserting the punched conductive metal chip in the through hole of the resin sheet. By the insertion of the conductive metal chip in the through hole, the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet and if a large number of such substrates are laminated, electrical connection in the thickness direction can be readily made by virtue of the protruded conductive metal chips, and a multi-layer board can be readily produced.
Abstract translation: 本发明提供一种印刷电路板，形成片，其包括具有在厚度方向上的通孔并插入所述通孔的金属片，及其制造片材的方法的树脂片材。 片材是通过将树脂片和导电金属薄片在此订单中的具有基产生的孔中，从该导电性金属片侧进行冲孔以形成在导电金属片冲孔和以形成冲孔 所以在树脂片，和插入在所述树脂片的通孔中的导电冲压金属芯片。 通过在通孔内的导电金属片的插入，前，片材的后表面可以电连接到海誓山盟。 如果导电金属片被如此插入做它的尖端从片材的表面突出，并且如果大量搜索基板的层叠时，在厚度方向的电连接可以容易地借助于突出导电金属片制成，并且 多层板可以容易地制造。
-
Patent Agency Ranking
公开(公告)号：US20170064832A1
公开(公告)日：2017-03-02
申请号：US14989921
申请日：2016-01-07
Applicant: SK hynix Inc.
Inventor： Seung Yeop Lee , Joo Hyun Kang , Jong Hoon Kim , Han Jun Bae
CPC classification number: H05K1/028 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5387 , H01L2224/48227 , H01L2224/48228 , H01L2224/97 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H05K1/14 , H05K1/147 , H05K2201/0385 , H05K2201/05 , H05K2201/058 , H01L2924/00012
Abstract: A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.
Abstract translation: 柔性器件包括第一导电图案，第二导电图案和介电层。 第一导电图案包括第一滑动接触部分和第一延伸部分。 第二导电图案包括与第一滑动接触部分重叠的第二滑动接触部分，并且第二导电图案包括第二延伸部分。 第二滑动接触部分与第一滑动接触部分接触并可在第一滑动接触部分上移动以进行滑动。 第一和第二导电图案嵌入在介电层中。
-
公开(公告)号：US09349549B2
公开(公告)日：2016-05-24
申请号：US13982065
申请日：2012-01-27
Applicant: Kate Stone
Inventor： Kate Stone
CPC classification number: H01H13/52 , H01H13/7006 , H01H13/79 , H01H2203/02 , H01H2203/022 , H05K1/0293 , H05K1/0386 , H05K1/0393 , H05K1/092 , H05K1/118 , H05K1/16 , H05K2201/0385 , H05K2201/09063 , H05K2201/09263 , H05K2201/10053
Abstract: An electronic component comprises a flexible planar substrate which is substantially non-stretchable, the substrate having at least two slits arranged to allow first and second portions of the substrate lying in the same plane to be moved apart, the first portion of the substrate supporting a region of conductive material.
Abstract translation: 电子部件包括基本上不可拉伸的柔性平面基板，所述基板具有布置成允许位于同一平面中的基板的第一和第二部分移动分开的至少两个切口，所述基板的第一部分支撑 导电材料区域。
-
公开(公告)号：US08698186B2
公开(公告)日：2014-04-15
申请号：US13186461
申请日：2011-07-19
Applicant: Lac Nguyen , Chang Han
Inventor： Lac Nguyen , Chang Han
IPC: H01L33/62
CPC classification number: H05K1/0203 , H01L33/62 , H01L33/642 , H01L2224/48091 , H05K1/0204 , H05K1/0306 , H05K1/05 , H05K2201/0385 , H05K2201/09045 , H05K2201/09054 , H05K2201/10106 , H05K2201/10416 , H05K2201/10969 , H01L2924/00014
Abstract: An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.
Abstract translation: 提出了一种具有改进的电路板LED支撑结构的LED器件。 该LED装置的导热基板的顶面包括导热柱。 柱子不被电介质层覆盖，并且LED封装直接布置在柱上，LED封装底部导热板与柱顶表面直接接触。
-
公开(公告)号：US20130341173A1
公开(公告)日：2013-12-26
申请号：US13982065
申请日：2012-01-27
Applicant: Kate Stone
Inventor： Kate Stone
CPC classification number: H01H13/52 , H01H13/7006 , H01H13/79 , H01H2203/02 , H01H2203/022 , H05K1/0293 , H05K1/0386 , H05K1/0393 , H05K1/092 , H05K1/118 , H05K1/16 , H05K2201/0385 , H05K2201/09063 , H05K2201/09263 , H05K2201/10053
Abstract: An electronic component comprises a flexible planar substrate which is substantially non-stretchable, the substrate having at least two slits arranged to allow first and second portions of the substrate lying in the same plane to be moved apart, the first portion of the substrate supporting a region of conductive material.
Abstract translation: 电子部件包括基本上不可拉伸的柔性平面基板，所述基板具有布置成允许位于同一平面中的基板的第一和第二部分移动分开的至少两个切口，所述基板的第一部分支撑 导电材料区域。
-
公开(公告)号：US07178233B2
公开(公告)日：2007-02-20
申请号：US10728177
申请日：2003-12-04
Applicant: Toshiyuki Nakamura , Hideto Tanaka , Akira Ichiryu , Motonobu Takahashi , Masahito Ishii , Daisuke Arai
Inventor： Toshiyuki Nakamura , Hideto Tanaka , Akira Ichiryu , Motonobu Takahashi , Masahito Ishii , Daisuke Arai
IPC: H01K3/10
CPC classification number: H05K3/4614 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K3/4038 , H05K3/4046 , H05K3/4617 , H05K3/462 , H05K2201/0385 , H05K2201/10378 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T29/4916 , Y10T29/49165
Abstract: A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.
Abstract translation: 一种印刷线路板形成用片材的制造方法，其特征在于，具有在厚度方向上具有通孔的树脂片和插入所述通孔的金属片。 该片材通过将树脂片和导电金属片依次放置在具有模孔的模座上，从导电金属片侧进行冲压以在导电金属片中形成冲孔并在 树脂片，并将穿孔的导电金属芯片插入树脂片的通孔中，由此片材的前表面和后表面可以彼此电连接。 如果导电金属芯片如此插入，使得其尖端从片材的表面突出，并且如果大量这样的衬底被层压，则厚度方向上的电连接可以容易地由于突出的导电金属片和 多层板可以很容易地生产。
-
-
-
-
-
-
-
-
-
Search Results
30
records
(took 0.02 seconds)
