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公开(公告)号:CN102811552B
公开(公告)日:2016-11-16
申请号:CN201210177368.6
申请日:2012-05-31
Applicant: 日东电工株式会社
CPC classification number: H05K1/189 , G11B5/484 , G11B5/4853 , G11B5/4873 , H05K3/321 , H05K2201/0385 , H05K2201/053 , H05K2201/09072 , H05K2201/10083
Abstract: 本发明提供配线电路基板及其制造方法。该配线电路基板包括绝缘层和导体层,该导体层包括被绝缘层覆盖的配线和与配线连续的、用于与电子元件电连接的端子。在绝缘层中形成有使端子暴露出的绝缘开口部,端子形成为在厚度方向上呈凹凸形状的图案。
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公开(公告)号:CN102811552A
公开(公告)日:2012-12-05
申请号:CN201210177368.6
申请日:2012-05-31
Applicant: 日东电工株式会社
CPC classification number: H05K1/189 , G11B5/484 , G11B5/4853 , G11B5/4873 , H05K3/321 , H05K2201/0385 , H05K2201/053 , H05K2201/09072 , H05K2201/10083
Abstract: 本发明提供配线电路基板及其制造方法。该配线电路基板包括绝缘层和导体层,该导体层包括被绝缘层覆盖的配线和与配线连续的、用于与电子元件电连接的端子。在绝缘层中形成有使端子暴露出的绝缘开口部,端子形成为在厚度方向上呈凹凸形状的图案。
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公开(公告)号:US20180004318A1
公开(公告)日:2018-01-04
申请号:US15200949
申请日:2016-07-01
Applicant: Khaled Ahmed , Prashant Majhi
Inventor: Khaled Ahmed , Prashant Majhi
CPC classification number: G06F3/041 , G06F2203/04102 , G06F2203/04103 , H01J37/32009 , H01J37/32532 , H01J2237/3321 , H01J2237/334 , H05K1/0271 , H05K1/0346 , H05K1/0393 , H05K1/09 , H05K3/0014 , H05K3/007 , H05K3/027 , H05K3/067 , H05K3/107 , H05K2201/0154 , H05K2201/0323 , H05K2201/0338 , H05K2201/0341 , H05K2201/0385 , H05K2201/0391 , H05K2203/0759 , H05K2203/0769 , H05K2203/107
Abstract: Systems, apparatuses, and/or methods to manufacture and/or implement a sensor film, a composite electrode, and/or a computing device such as a flexible device. The sensor film may include a random network of metal lines and graphene interconnecting the metal lines. The composite electrode may be formed from the sensor film. In addition, the composite electrode may include a first portion including a metal layer in a graphene layer, wherein the metal layer is randomly located in the graphene layer, and a second portion excluding the metal layer and including the graphene layer. The sensor film may be patterned to include any composite electrode configuration, such as an antenna electrode configuration, a touch electrode configuration, and so on. Thus, the flexible device may include a flexible touch screen.
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公开(公告)号:US09241410B2
公开(公告)日:2016-01-19
申请号:US13485274
申请日:2012-05-31
Applicant: Saori Ishigaki , Jun Ishii , Yoshito Fujimura , Yuu Sugimoto
Inventor: Saori Ishigaki , Jun Ishii , Yoshito Fujimura , Yuu Sugimoto
CPC classification number: H05K1/189 , G11B5/484 , G11B5/4853 , G11B5/4873 , H05K3/321 , H05K2201/0385 , H05K2201/053 , H05K2201/09072 , H05K2201/10083
Abstract: A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.
Abstract translation: 布线电路板包括绝缘层和导电层,导电层包括被绝缘层覆盖的导线,以及连接到导线的端子,以将导线电连接到电子元件。 绝缘层形成有露出端子的绝缘开口,并且端子形成为在厚度方向上凹陷的图案。
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公开(公告)号:US20150373848A1
公开(公告)日:2015-12-24
申请号:US14625983
申请日:2015-02-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jong-hyun SEOK
IPC: H05K1/11 , H05K1/18 , G11C11/401 , H01C13/02
CPC classification number: H01C13/02 , G11C5/04 , G11C7/10 , G11C11/401 , H05K1/117 , H05K3/3415 , H05K2201/0385 , H05K2201/09545 , H05K2201/10159
Abstract: A semiconductor module includes a printed circuit board including an integrated circuit chip, connecting terminals at an edge of the printed circuit board, and signal lines respectively connecting electrical connection pads of the integrated circuit chip to the connecting terminals. The connecting terminals are plated using via-holes of the printed circuit board respectively connected to the signal lines.
Abstract translation: 半导体模块包括印刷电路板,其包括集成电路芯片,印刷电路板的边缘处的连接端子以及分别将集成电路芯片的电连接焊盘连接到连接端子的信号线。 使用分别连接到信号线的印刷电路板的通孔来对连接端子进行电镀。
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公开(公告)号:EP2668833A1
公开(公告)日:2013-12-04
申请号:EP12703144.1
申请日:2012-01-27
Applicant: Novalia Ltd
Inventor: STONE, Kate
IPC: H05K1/02 , H05K1/11 , H01H13/702 , H05K1/03 , H05K1/09
CPC classification number: H01H13/52 , H01H13/7006 , H01H13/79 , H01H2203/02 , H01H2203/022 , H05K1/0293 , H05K1/0386 , H05K1/0393 , H05K1/092 , H05K1/118 , H05K1/16 , H05K2201/0385 , H05K2201/09063 , H05K2201/09263 , H05K2201/10053
Abstract: An electronic component such as a push button switch or a connector comprises a flexible planar substrate (fig 1, 2) which is substantially non-stretchable, that has at least two slits 14 to allow a portion 15 of the substrate supporting a region of conductive material 12 to be moved apart from another portion of the substrate. There can be three or more slits which can be arcuate and overlap an adjacent slit forming a bridge 17 between them. The conducting region 12 can be isolated, and short out two further pads 7,8 on a second substrate 3 or connected to a conductive track (fig 7, 13) and formed from conductive ink. The slits can allow movement out of the plane of the substrate, and in the same plane as the substrate to form a flexible connector (fig 11 and 12) where the slits can extend from opposite edges. The substrate can comprise a laminate, paper, card or plastic membrane and the device can be used in an electronic circuit (fig 9), as part of a game (fig 10), a book, poster, calendar, greetings card or product packaging or point of sale display.
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公开(公告)号:EP2668833B1
公开(公告)日:2016-05-04
申请号:EP12703144.1
申请日:2012-01-27
Applicant: Novalia Ltd
Inventor: STONE, Kate
CPC classification number: H01H13/52 , H01H13/7006 , H01H13/79 , H01H2203/02 , H01H2203/022 , H05K1/0293 , H05K1/0386 , H05K1/0393 , H05K1/092 , H05K1/118 , H05K1/16 , H05K2201/0385 , H05K2201/09063 , H05K2201/09263 , H05K2201/10053
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公开(公告)号:US09888567B2
公开(公告)日:2018-02-06
申请号:US14989921
申请日:2016-01-07
Applicant: SK hynix Inc.
Inventor: Seung Yeop Lee , Joo Hyun Kang , Jong Hoon Kim , Han Jun Bae
CPC classification number: H05K1/028 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5387 , H01L2224/48227 , H01L2224/48228 , H01L2224/97 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H05K1/14 , H05K1/147 , H05K2201/0385 , H05K2201/05 , H05K2201/058 , H01L2924/00012
Abstract: A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.
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公开(公告)号:US20130014976A1
公开(公告)日:2013-01-17
申请号:US13485274
申请日:2012-05-31
Applicant: Saori ISHIGAKI , Jun ISHII , Yoshito FUJIMURA , Yuu SUGIMOTO
Inventor: Saori ISHIGAKI , Jun ISHII , Yoshito FUJIMURA , Yuu SUGIMOTO
CPC classification number: H05K1/189 , G11B5/484 , G11B5/4853 , G11B5/4873 , H05K3/321 , H05K2201/0385 , H05K2201/053 , H05K2201/09072 , H05K2201/10083
Abstract: [Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability.[Solving Means] A suspension board with circuit 3 includes power-source wires 25B, and piezoelectric-side terminals 40 formed continuously to the power-source wires 25B and electrically connected thereunder to piezoelectric elements 5. Each of the piezoelectric-side terminals 40 includes an outer contact portion 51, and an inner contact portion 53 provided around the outer contact portion 51 to protrude below the outer contact portion 51.
Abstract translation: [目的]提供一种布线电路基板,其中可以抑制导电粘合剂泄漏到外部,同时抑制端子的尺寸增加,并且还提高连接可靠性。 具体实施方式具有电路3的悬挂基板包括电源线25B和压电侧端子40,压电侧端子40与电源线25B连续地形成,并且与压电元件5电连接。各压电侧端子40包括 外接触部51和设置在外接触部51周围的内接触部53,突出到外接触部51的下方。
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公开(公告)号:US20080099922A1
公开(公告)日:2008-05-01
申请号:US11554472
申请日:2006-10-30
Applicant: Noriaki Sakamoto
Inventor: Noriaki Sakamoto
CPC classification number: H01L23/49531 , H01L21/565 , H01L23/4334 , H01L23/49544 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H05K1/056 , H05K3/284 , H05K3/328 , H05K3/4084 , H05K3/44 , H05K2201/0382 , H05K2201/0385 , H05K2201/09554 , H05K2201/1034 , H05K2201/10924 , H05K2203/049 , H01L2924/00 , H01L2924/20753 , H01L2924/2076 , H01L2224/05599 , H01L2924/00012
Abstract: A first insulating layer is formed on a front surface of a rectangular circuit board. Conductive patterns having a predetermined shape are formed on a front surface of the first insulating layer. A semiconductor element and a chip element are electrically connected to the conductive patterns by use of solder or conductive paste. The conductive patterns, the semiconductor element and the chip element which are formed on the front surface of the circuit board, are covered with a sealing resin. Pads on the circuit board and leads are connected to each other by use of thin metal wires.
Abstract translation: 第一绝缘层形成在矩形电路板的前表面上。 具有预定形状的导电图案形成在第一绝缘层的前表面上。 半导体元件和芯片元件通过使用焊料或导电膏电连接到导电图案。 形成在电路板的前表面上的导电图案,半导体元件和芯片元件被密封树脂覆盖。 电路板上的焊盘和引线通过使用细金属线相互连接。
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