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    ELECTRONIC COMPONENT WITH HIGH DENSITY, LOW COST ATTACHMENT
    12.
    发明申请
    ELECTRONIC COMPONENT WITH HIGH DENSITY, LOW COST ATTACHMENT 审中-公开
    具有高密度，低成本附件的电子元件

    公开(公告)号：WO2008094135A2

    公开(公告)日：2008-08-07

    申请号：PCT/US2006045624

    申请日：2006-11-29

    Applicant: AMPHENOL CORP ,  GAILUS MARK W ,  KHILCHENKO LEON M

    Inventor： GAILUS MARK W ,  KHILCHENKO LEON M

    CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

    Abstract translation: 与表面贴装制造技术兼容的电子元件的接触尾部。 接触尾部被压印，提供相对低的制造成本和高精度。 接触尾部的高精度依次在电子部件中的接触尾部阵列上提供更可靠的焊点。 此外，接触尾部可以被成形为在回流操作期间降低焊料从连接区域芯吸的倾向。 降低焊料对芯的倾向降低了焊料会干扰电子部件的操作的可能性。 此外，降低焊料对芯的倾向允许接触尾部附着的焊盘定位在通孔上方，从而增加接触可附着于基底的密度。 当接触尾部用于自定心阵列时，使用接触尾部组装部件的电子组件的可靠性也增加。

    LEAD(PB)-FREE ELECTRONIC COMPONENT ATTACHMENT
    14.
    发明公开
    LEAD(PB)-FREE ELECTRONIC COMPONENT ATTACHMENT 有权
    铅（Pb）自由电子部件安装

    公开(公告)号：EP1969910A2

    公开(公告)日：2008-09-17

    申请号：EP06838534.3

    申请日：2006-11-29

    Applicant: Amphenol Corporation

    Inventor： GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

    IPC: H05K7/00

    CPC classification number: H05K3/321 ,  H01L2924/0002 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2201/10984 ,  H01L2924/00

    Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb) - free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. The further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

    Surface mounting discharge tube
    16.
    发明公开
    Surface mounting discharge tube 有权
    OberflächenmontierbaresEntladungsrohr

    公开(公告)号：EP1610428A2

    公开(公告)日：2005-12-28

    申请号：EP05252301.6

    申请日：2005-04-13

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Machida, Kazuhiko, Shinko Electric Ind. Co., Ltd. ,  Emori, Chisato, Shinko Electric Ind. Co., Ltd. ,  Takeuchi, Kesayuki, Shinko Electric Ind. Co., Ltd.

    IPC: H01T4/12

    CPC classification number: H01T4/12 ,  H01T1/00 ,  H05K3/3426 ,  H05K2201/10795 ,  Y02P70/613

    Abstract: A surface mounting discharge tube, comprise of a cylindrical ceramic envelope sealed at its two ends by side surfaces of electrodes, designed to be directly soldered on to a mounting board, where the electrodes at the two ends are rectangular, project outward radially at the ends of the ceramic envelope and are provided at peripheral edges at the side surfaces of the electrodes with soldering use tapers or step differences, whereby positional deviation at the time of soldering is suppressed and sufficient PCT properties are secured.

    Abstract translation: 表面安装放电管包括圆柱形陶瓷外壳，其两端由电极的侧表面密封，设计成直接焊接到安装板上，其中两端的电极为矩形，在端部径向向外突出 并且在电极的侧面的周边处设置有焊接使用锥度或阶差，由此抑制了焊接时的位置偏差并且确保了足够的PCT性能。

    PLANAR CONTACT WITH SOLDER
    18.
    发明申请
    PLANAR CONTACT WITH SOLDER 审中-公开
    平面与焊接接触

    公开(公告)号：WO2010108011A3

    公开(公告)日：2011-01-27

    申请号：PCT/US2010027827

    申请日：2010-03-18

    Applicant: INTERPLEX IND INC ,  SEIDLER JACK

    Inventor： SEIDLER JACK

    IPC: H01R33/76 ,  G01R31/26 ,  H01R4/24

    CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

    Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

    Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长的可回流构件被推到多个触点的尾部上。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。

    LEAD(PB)-FREE ELECTRONIC COMPONENT ATTACHMENT
    19.
    发明申请
    LEAD(PB)-FREE ELECTRONIC COMPONENT ATTACHMENT 审中-公开
    LEAD（PB）-FREE电子元件附件

    公开(公告)号：WO2007064672A2

    公开(公告)日：2007-06-07

    申请号：PCT/US2006/045621

    申请日：2006-11-29

    Applicant: AMPHENOL CORPORATION ,  GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

    Inventor： GAILUS, Mark, W. ,  KHILCHENKO, Leon, M.

    IPC: H05K7/00

    CPC classification number: H05K3/321 ,  H01L2924/0002 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2201/10984 ,  H01L2924/00

    Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb) - free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. The further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

    Abstract translation: 用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，该导电粘合剂可以是无铅（Pb）。 接触尾部被压印，提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头，将粘合剂保持在铅附近，以保持更牢固的接头。 此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。 在粘合剂的转移方面的进一步的帮助下，接触尾部可以形成有凹部，这增加了粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

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