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    GROUPED ELEMENT TRANSMISSION CHANNEL LINK TERMINATION ASSEMBLIES
    13.
    发明申请
    GROUPED ELEMENT TRANSMISSION CHANNEL LINK TERMINATION ASSEMBLIES 审中-公开
    分组元件传输通道链接终止组件

    公开(公告)号：WO2003058751A1

    公开(公告)日：2003-07-17

    申请号：PCT/US2002/041793

    申请日：2002-12-30

    Applicant: MOLEX INCORPORATED

    Inventor： BRUNKER, David, L. ,  DAWIEDCZYK, Daniel, L. ,  LOPATA, John, E. ,  DUTTA, Arindum

    IPC: H01P3/02

    CPC classification number: H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

    Abstract: Termination assemblies for terminating high-frequency data signal transmission lines include housings with one or more cavities that receive ends of the transmission line therein. The transmission line typically includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. The termination assemblies, in one embodiment include hollow end caps that are formed from a dielectric and which have one or more conductive contacts or plated surfaces disposed on or within the cavity so that they will frictionally mate with the conductive traces on the transmission line. In another embodiment, a connector housing is provided with a center slot and a plurality of dual loop contacts to provide redundant circuit paths and low inductance to the termination assembly. A coupling element may be utilized in the slot to achieve a desired level of coupling between the termination contacts.

    Abstract translation: 用于终止高频数据信号传输线路的终端组件包括具有一个或多个腔体的壳体，该腔体容纳传输线路的端部。 传输线通常包括绝缘体和设置在其上的多个导电元件，多个导电元件成对布置以用于差分信号传输。 终端组件在一个实施例中包括由电介质形成并且具有一个或多个导电触点或设置在空腔中或腔内的电镀表面的空心端盖，使得它们将与传输线上的导电迹线摩擦配合。 在另一个实施例中，连接器壳体设置有中心狭槽和多个双环触点，以向终端组件提供冗余电路路径和低电感。 可以在槽中使用耦合元件以实现端接触点之间期望的耦合水平。

    DEVICE AND METHOD OF MANUFACTURE OF AN INTERCONNECTION STRUCTURE FOR PRINTED CIRCUIT BOARDS
    14.
    发明申请
    DEVICE AND METHOD OF MANUFACTURE OF AN INTERCONNECTION STRUCTURE FOR PRINTED CIRCUIT BOARDS 审中-公开
    印刷电路板互连结构的制造方法及其制造方法

    公开(公告)号：WO2006007166A2

    公开(公告)日：2006-01-19

    申请号：PCT/US2005/017926

    申请日：2005-05-20

    Applicant: JOY, Stephen, C.

    Inventor： JOY, Stephen, C.

    IPC: H05K1/18

    CPC classification number: H05K1/184 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/092 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10893 ,  H05K2203/1115 ,  H05K2203/1189

    Abstract: An interconnection structure for coupling conductive layers of a circuit board includes a pin configured to be press-fitted in an aperture traversing the circuit board, to electrically couple the conductive traces. The pin may be placed in a predrilled aperture, or driven into the circuit board, forming the aperture thereby. The pin may also be configured as a punch, removing a plug of material as it is driven therethrough. The pin may comprise a capacitive or resistive region configured to capacitively or resistively couple the first and second traces. The pin may be configured such that capacitive or resistive values are selectable according to a depth to which the pin is positioned in the aperture. The pin may serve as an offset post for mounting the circuit board to a chassis. In such a case, the pin may be provided with a longitudinal aperture configured to receive a threaded screw.

    Abstract translation: 用于耦合电路板的导电层的互连结构包括被配置成压配合在穿过电路板的孔中的引脚，以电连接导电迹线。 销可以放置在预钻孔中，或者被驱动到电路板中，从而形成孔。 该销还可以被配置为冲头，当其被驱动通过其时移除材料塞。 该引脚可以包括被配置为电容地或电阻地耦合第一和第二迹线的电容或电阻区域。 引脚可以被配置为使得电容或电阻值可根据销定位在孔中的深度来选择。 该引脚可以用作将电路板安装到底盘的偏移柱。 在这种情况下，销可以设置有构造成接收螺纹螺钉的纵向孔。

    GROUPED ELEMENT TRANSMISSION CHANNEL LINK WITH POWER DELIVERY ASPECTS
    15.
    发明申请
    GROUPED ELEMENT TRANSMISSION CHANNEL LINK WITH POWER DELIVERY ASPECTS 审中-公开
    分组元件传输通道与电力传输方面的链接

    公开(公告)号：WO2003058752A1

    公开(公告)日：2003-07-17

    申请号：PCT/US2002/041794

    申请日：2002-12-30

    Applicant: MOLEX INCORPORATED

    Inventor： BRUNKER, David ,  DAWIEDCZYK, Daniel, L. ,  LOPATA, John, E. ,  DUTTA, Arindum

    IPC: H01P3/02

    CPC classification number: H05K1/024 ,  H01P3/02 ,  H01R12/716 ,  H01R12/79 ,  H01R13/658 ,  H05K1/0284 ,  H05K1/145 ,  H05K3/107 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10189 ,  H05K2201/10893

    Abstract: An engineered transmission line for transmitting high-frequency data signal s between two points of connection includes a dielectric body and a plurality of conductive elements disposed thereon, with the plurality of conductive elements being arranged in pairs for differential signal transmission. In one embodiment, the dielectric body is solid and has its conductive elements supported on its exterior surface. In another embodiment, the dielectric body is extruded and has grooves or raised lands formed therein. The grooves or lands support conductive elements formed thereon by a suitable plating process. A ground plane may be provided as a base layer of the dielectric body. Enlarged conductive surfaces may also be provided on the body which have a greater surface area than those intended for use with the signal channels. The enlarged surfaces are utilized to carry power.

    Abstract translation: 用于在两个连接点之间传输高频数据信号s的工程传输线包括介电体和设置在其上的多个导电元件，其中多个导电元件成对设置用于差分信号传输。 在一个实施例中，电介质体是固体并且其导电元件被支撑在其外表面上。 在另一个实施例中，电介质体被挤出并且在其中形成有凹槽或凸起的焊盘。 凹槽或平台通过合适的电镀工艺支撑在其上形成的导电元件。 可以提供接地平面作为电介质体的基层。 扩大的导电表面也可以设置在主体上，其具有比用于信号通道的表面积更大的表面积。 放大的表面用于承载电力。

    DEVICE AND METHOD OF MANUFACTURE OF AN INTERCONNECTION STRUCTURE FOR PRINTED CIRCUIT BOARDS
    16.
    发明申请
    DEVICE AND METHOD OF MANUFACTURE OF AN INTERCONNECTION STRUCTURE FOR PRINTED CIRCUIT BOARDS 审中-公开
    印刷电路板互连结构的制造方法及其制造方法

    公开(公告)号：WO2006007166A3

    公开(公告)日：2007-01-11

    申请号：PCT/US2005017926

    申请日：2005-05-20

    Applicant: JOY STEPHEN C

    Inventor： JOY STEPHEN C

    IPC: H01R12/04 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40

    CPC classification number: H05K1/184 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/092 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10893 ,  H05K2203/1115 ,  H05K2203/1189

    Abstract: An interconnection structure for coupling conductive layers (126 and 128) of a circuit board (122) includes a pin (138) configured to be press-fitted in an aperture traversing the circuit board, to electrically couple the conductive traces. The pin may be placed in a predrilled aperture, or driven into the circuit board, forming the aperture thereby. The pin may also be configured as a punch, removing a plug of material as it is driven therethrough. The pin may comprise a capacitive or resistive region configured to capacitively or resistively couple the first and second traces. The pin may be configured such that capacitive or resistive values are selectable according to a depth to which the pin is positioned in the aperture. The pin may serve as an offset post for mounting the circuit board to a chassis. In such a case, the pin may be provided with a longitudinal aperture configured to receive a threaded screw.

    Abstract translation: 用于耦合电路板（122）的导电层（126和128）的互连结构包括构造成压配合在穿过电路板的孔中的引脚（138），以电连接导电迹线。 销可以放置在预钻孔中，或者被驱动到电路板中，从而形成孔。 该销还可以被配置为冲头，当其被驱动通过其时移除材料塞。 引脚可以包括被配置为电容地或电阻地耦合第一和第二迹线的电容或电阻区域。 引脚可以被配置为使得电容或电阻值可根据销定位在孔中的深度来选择。 该引脚可以用作将电路板安装到底盘的偏移柱。 在这种情况下，销可以设置有构造成接收螺纹螺钉的纵向孔。

    Interconnect structure
    19.
    发明公开
    Interconnect structure 有权
    互连结构

    公开(公告)号：EP1191635A3

    公开(公告)日：2003-10-15

    申请号：EP01122202.3

    申请日：2001-09-17

    Applicant: NISSAN MOTOR CO., LTD.

    Inventor： Murakami, Yoshinori

    IPC: H01R12/04 ,  H05K3/36 ,  H05K7/14

    CPC classification number: H05K3/368 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2924/13091 ,  H01R12/52 ,  H05K1/0216 ,  H05K1/145 ,  H05K1/148 ,  H05K1/162 ,  H05K3/36 ,  H05K2201/0792 ,  H05K2201/09672 ,  H05K2201/1028 ,  H05K2201/10818 ,  H05K2201/10893 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An interconnect structure has a plurality of planar interconnects (1, 2) mutually superposed with a prescribed distance therebetween and serving as interconnects between two circuit boards (A, B), each of the planar interconnects (1, 2) having at least two connection terminals (1A, 1B, 2A, 2B) at the circuit boards (1, 2). Rather than using rigid wire interconnects as done in the past to make interconnections, planar interconnects having relatively large surface areas are used to increase the line-to-line capacitance, thereby enhancing the filtering function that reduces high-frequency noise.

    Abstract translation: 互连结构具有多个互相重叠的平面互连（1,2），它们之间具有规定的距离并且用作两个电路板（A，B）之间的互连，每个平面互连（1,2）具有至少两个连接 在电路板（1,2）处的端子（1A，1B，2A，2B）。 与过去使用刚性导线互连进行互连相比，使用具有相对较大表面积的平面互连来增加线间电容，从而增强了降低高频噪声的滤波功能。

    Printed circuit board having holes with multiple conductors
    20.
    发明公开
    Printed circuit board having holes with multiple conductors 失效
    具有多个导体的孔的印刷电路板

    公开(公告)号：EP0467698A3

    公开(公告)日：1992-07-15

    申请号：EP91306594.2

    申请日：1991-07-19

    Applicant: NORTHERN TELECOM LIMITED

    Inventor： Barnhouse, Robert L. ,  Estes, H. Scott

    IPC: H05K3/42

    CPC classification number: H05K3/403 ,  H05K3/0047 ,  H05K3/043 ,  H05K3/061 ,  H05K3/108 ,  H05K3/308 ,  H05K3/427 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10295 ,  H05K2201/10893 ,  H05K2203/0557

    Abstract: A printed circuit board having holes provided with two or more electrical conductors (16,34) on the surface of each hole. The conductors are circumferentially spaced apart around each hole so as to electrically isolate them from one another and each conductor is connected to an individual circuit line of the board. The conductors may be through-hole conductors. Alternatively, the holes are pin receiving holes for insertion of pins having two or more conductor lines for electrical contact with the conductors within the holes.

    Abstract translation: 一种印刷电路板，具有在每个孔的表面上设置有两个或多个电导体（16,34）的孔。 导体围绕每个孔周向间隔开，以便将它们彼此电隔离，并且每个导体连接到板的单独电路线。 导体可以是通孔导体。 或者，孔是用于插入具有两个或更多个导线的销的销接收孔，用于与孔内的导体电接触。

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