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    Decal transfer microfabrication
    191.
    发明授权
    Decal transfer microfabrication 有权
    贴花转移微细加工

    公开(公告)号：US06805809B2

    公开(公告)日：2004-10-19

    申请号：US10230882

    申请日：2002-08-28

    Applicant: Ralph G. Nuzzo ,  William Robert Childs

    Inventor： Ralph G. Nuzzo ,  William Robert Childs

    IPC: C03C2568

    CPC classification number: B81C1/0046 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24562 ,  Y10T428/24628

    Abstract: A method of making a microstructure includes forming a pattern in a surface of a silicon-containing elastomer, oxidizing the pattern, contacting the pattern with a substrate; and bonding the oxidized pattern and the substrate such that the pattern and the substrate are irreversibly attached. The silicon-containing elastomer may be removably attached to a transfer pad.

    Abstract translation: 制造微结构的方法包括在含硅弹性体的表面形成图案，氧化图案，使图案与基板接触; 并且结合氧化图案和基板，使得图案和基板不可逆地附着。 含硅弹性体可以可移除地附接到转移垫。

    Method of manufacturing microneedle structures using soft lithography and photolithography
    194.
    发明申请
    Method of manufacturing microneedle structures using soft lithography and photolithography 有权
    使用软光刻和光刻制造微针结构的方法

    公开(公告)号：US20020133129A1

    公开(公告)日：2002-09-19

    申请号：US09808534

    申请日：2001-03-14

    Inventor： Francisco Arias ,  Faiz Feisal Sherman ,  Grover David Owens

    IPC: A61B017/20 ,  B29C067/00

    CPC classification number: A61B5/1411 ,  A61B5/14514 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150419 ,  A61B5/150984 ,  A61M37/0015 ,  A61M2037/0038 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/034

    Abstract: A method for manufacturing microneedle structures is disclosed using soft lithography and photolithography, in which micromold structures made of a photoresist material or PDMS are created. The micromold manufacturing occurs quite quickly, using inexpensive materials and processes. Once the molds are available, using moldable materials such as polymers, microneedle arrays can be molded or embossed in relatively fast procedures. In some cases a sacrificial layer is provided between the forming micromold and its substrate layer, for ease of separation. The microneedles themselves can be solid projections, hollow nullmicrotubes,null or shallow nullmicrocups.null Electrodes can be formed on the microneedle arrays, including individual electrodes per hollow microtube.

    Abstract translation: 公开了使用软光刻和光刻技术制造微针结构的方法，其中制造由光致抗蚀剂材料或PDMS制成的微型结构。 使用廉价的材料和工艺，微型制造相当快速地发生。 一旦模具可用，使用可模塑材料如聚合物，微针阵列可以以相对较快的程序模制或压花。 在一些情况下，为了易于分离，在成形微胶体与其基底层之间提供牺牲层。 微针本身可以是固体突起，中空的“微管”或浅的“微型杯”。 电极可以形成在微针阵列上，包括每个中空微管的单个电极。

    Method and apparatus for manufacturing a device
    196.
    发明申请
    Method and apparatus for manufacturing a device 审中-公开
    用于制造装置的方法和装置

    公开(公告)号：US20020053756A1

    公开(公告)日：2002-05-09

    申请号：US09974829

    申请日：2001-10-12

    Applicant: Becton Dickinson and Company

    Inventor： Kenneth G. Powell ,  Larry A. Monahan ,  Burton H. Sage JR.

    IPC: B29C033/38 ,  B29C033/56 ,  B29C043/02 ,  B29C045/37

    CPC classification number: B29C33/405 ,  A61M37/0015 ,  A61M2037/0046 ,  A61M2037/0053 ,  B29C33/424 ,  B29C45/372 ,  B29C2045/0094 ,  B29K2883/00 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/034

    Abstract: A device, preferably a micro-device, is molded from a plastic material by injection molding, compression molding or embossing. A microabrader can be molded having microneedles for abrading the stratum corneum of the skin to form an abraded site in the tissue for enhancing drug delivery. The micro-device is molded using a mold assembly having a silicon molding surface. The silicon molding surface can include a recess corresponding to the desired shape and length of the microneedles. The silicon molding surface enables micron and submicron size features to be molded from polymeric materials without the polymeric material adhering to the mold surface. Micro-devices having molded features having micron and submicron dimensions can be rapidly produced without the use of a release agent.

    Abstract translation: 一种装置，优选一种微型装置，通过注塑，压塑或压花由塑料材料模制。 微型造型机可以模制成具有用于研磨皮肤角质层的微针，以在组织中形成用于增强药物递送的磨损部位。 使用具有硅模制表面的模具组件来模制微型装置。 硅成型表面可以包括对应于所需形状和长度的微针的凹部。 硅成型表面使得微米和亚微米尺寸的特征能够由聚合物材料模制而不会使聚合材料粘附到模具表面。 具有微米和亚微米尺寸的模制特征的微型装置可以在不使用脱模剂的情况下快速生产。

    Method for manufacturing microfabrication apparatus
    197.
    发明申请
    Method for manufacturing microfabrication apparatus 失效

    公开(公告)号：US20020019064A1

    公开(公告)日：2002-02-14

    申请号：US09874165

    申请日：2001-06-04

    Inventor： Masaki Hara

    IPC: H01L021/00

    CPC classification number: B81C1/0019 ,  B81C2201/034

    Abstract: To offer a microstructure fabrication apparatus capable of realizing MEMS and a Rugate Filter excellent in performance characteristics by patterning a thick functional material film in high aspect ratio with a simple and practical manufacturing method. A Si layer is employed for a mask pattern. The advantages of the Si layer are withstood a process conducted at high temperature for forming a PZT layer, which is the functional material layer, patterned in high aspect ratio, and achieves excellent process consistency for the whole manufacturing processes of the microfabrication. A trench or a gap is formed with the mask pattern deeper than the desired PZT layer. The PZT layer, or functional material layer (films) is formed on the whole surface including the bottom of the concave part of the mask pattern. The PZT layer deposited on the mask pattern is removed with the mask pattern itself, and selectively remains the pattern of the PZT layer, thereby obtaining a pattern of the desired functional material layer.

    Designer particles of micron and submicron dimension
    198.
    发明授权
    Designer particles of micron and submicron dimension 失效
    设计颗粒的微米和亚微米尺寸

    公开(公告)号：US06284345B1

    公开(公告)日：2001-09-04

    申请号：US08980980

    申请日：1997-12-08

    Applicant: Rodney S. Ruoff

    Inventor： Rodney S. Ruoff

    IPC: B32B322

    CPC classification number: G03F7/00 ,  B81C99/008 ,  B81C2201/034 ,  C23C14/0005 ,  C23C14/042 ,  Y10T428/24372 ,  Y10T428/24802 ,  Y10T428/24893 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2982

    Abstract: Micron-sized particles are produced in quantity by one of various methods, including generally the steps of preparing a substrate surface through a lithographic process, the surface being characterized by defining a plurality of elements, depositing a layer of particle material on the substrate surface including the elements, processing the substrate surface to isolate the material deposited on the elements, and separating the particles from the elements. The size and shape of the elements predetermine the size and shape of the particles. The elements may comprise, inter alia, pillars of photoresist or spaces on the substrate surrounded and defined by photoresist.

    Abstract translation: 通过各种方法之一量产生微米尺寸的颗粒，包括通常通过平版印刷工艺制备衬底表面的步骤，该表面的特征在于限定多个元件，在衬底表面上沉积颗粒材料层，包括 元件，处理衬底表面以分离沉积在元件上的材料，并将颗粒与元件分离。 元素的大小和形状预先决定了粒子的大小和形状。 这些元件尤其可以包括光致抗蚀剂的支柱或被光致抗蚀剂包围和限定的衬底上的空间。

    Shape deposition manufacturing of microscopic ceramic and metallic parts using silicon molds
    199.
    发明授权
    Shape deposition manufacturing of microscopic ceramic and metallic parts using silicon molds 失效
    使用硅模具的微观陶瓷和金属部件的形状沉积制造

    公开(公告)号：US06242163B1

    公开(公告)日：2001-06-05

    申请号：US09387328

    申请日：1999-08-31

    Applicant: Jurgen Stampfl ,  Alexander Cooper ,  Rudolf Leitgeb ,  Yih-Lin Cheng ,  Friedrich Prinz

    Inventor： Jurgen Stampfl ,  Alexander Cooper ,  Rudolf Leitgeb ,  Yih-Lin Cheng ,  Friedrich Prinz

    IPC: C23F100

    CPC classification number: C23F1/00 ,  B81C99/0085 ,  B81C2201/019 ,  B81C2201/034

    Abstract: Micro-Mold Shape Deposition Manufacturing (&mgr;-Mold SDM) is a method for fabricating complex, three-dimensional microstructures from layered silicon molds. Silicon wafers are etched using conventional silicon-processing techniques to produce wafers with surface patterns, some of which contain through-etched regions. The wafers are then stacked and bonded together to form a mold, which is filled with part material. In one embodiment, the part material is a ceramic or metallic gelcasting slurry that is poured into the mold and solidified to form a part precursor. The mold is removed, and the precursor is sintered to form the final part. The gelcasting material may also be a polymer or magnetic slurry, in which case sintering is not needed. The mold can also be filled by electroplating a metal into it; if necessary, each layer is filled with metal after being bonded to a previously filled layer. Patterned silicon wafer layers may also be combined with macroscopic wax layers formed by Mold SDM to create macroscopic parts with some microscopic parts or features.

    Abstract translation: 微模形状沉积制造（mu-Mold SDM）是从分层硅模制造复杂的三维微结构的方法。 使用常规的硅处理技术来蚀刻硅晶片以产生具有表面图案的晶片，其中一些具有贯通蚀刻区域。 然后将晶片堆叠并结合在一起以形成用部件材料填充的模具。 在一个实施例中，部件材料是陶瓷或金属凝胶浇注浆料，其被倒入模具中并固化以形成部件前体。 去除模具，并将前体烧结以形成最终部分。 凝胶浇铸材料也可以是聚合物或磁性浆料，在这种情况下不需要烧结。 模具也可以通过将金属电镀到其中来填充; 如果需要，每层在结合到预先填充的层之后都填充有金属。 图案化的硅晶片层还可以与由模具SDM形成的宏观蜡层组合以产生具有一些微观部件或特征的宏观部件。

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