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    Printed wiring board structure with integral metal matrix composite core
    192.
    发明公开
    Printed wiring board structure with integral metal matrix composite core 有权
    电路板组件具有集成的复合材料芯具有金属基质

    公开(公告)号：EP1058491A3

    公开(公告)日：2002-03-13

    申请号：EP00304651.3

    申请日：2000-05-31

    Applicant: Northrop Grumman Corporation

    Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

    IPC: H05K1/05 ,  H05K1/02

    CPC classification number: H05K1/056 ,  H01L2224/73204 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

    Abstract: A printed wiring board structure (30) having at least one chip-carrying layer (16) adjacent a core (32) fabricated of a metal matrix (34) having disposed therein continuous pitch based graphite fibers (36). The chip carrying layers (16) and the core (32) have an interface (52) therebetween and are integrally connected to each other through vias (48) plated with an electrically and thermally conductive material (50) to thereby provide a plurality of connection sites along this interface (52). The matrix (34) is preferably fabricated of aluminum. Preferred fibers (36) are fabricated of pitch based graphite. A typically preferred present printed wiring board structure (30) has several circuit layers and two chip-carrying layers (16) each on opposite sides of the core (32), with each of the layers (16) and the core (32) having respective interfaces (52) therebetween wherein each layer is integrally connected to the core (32) at a plurality of connection sites, as required by circuit design, along the respective interfaces. Because of the plurality of connection sites along respective interfaces (52), superior thermal conductivity occurs from the layers (16) to the core (36) since heat travels through these connection sites to effectuate extremely efficient heat transfer and ultimate heat dissipation from the entire printed wiring board structure (30).

    Printed wiring board structure with integral organic matrix composite core
    193.
    发明公开
    Printed wiring board structure with integral organic matrix composite core 有权
    Leiterplattenanordnung mit integriertem Verbundkern mit Organischer Matrix

    公开(公告)号：EP1058490A3

    公开(公告)日：2002-03-13

    申请号：EP00304645.5

    申请日：2000-05-31

    Applicant: Northrop Grumman Corporation

    Inventor： Smith, Carl R. ,  Madura, Jeffrey R. ,  Kramer, Jesse J.

    IPC: H05K1/05 ,  H05K1/02

    CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/10727 ,  Y10T428/24124 ,  Y10T428/24132

    Abstract: A printed wiring board structure (30) having at least one chip-carrying layer (16) adjacent a core (32) fabricated of an organic matrix (34) having disposed therein continuous pitch based graphite fibers (36). The chip carrying layers (16) and the core (32) have an interface (52) therebetween and are integrally connected to each other through vias (48) plated with an electrically and thermally conductive material (50) to thereby provide a plurality of connection sites along this interface (52). An organic matrix (34) is preferably fabricated of a polymer material such as an epoxy resin. Preferred fibers (36) are fabricated of pitch based graphite. A typically preferred present printed wiring board structure (30) has several circuit layers and two chip-carrying layers (16) each on opposite sides of the core (32), with each of the layers (16) and the core (32) having respective interfaces (52) therebetween wherein each layer is integrally connected to the core at a plurality of connection sites, as required by circuit design, along the respective interfaces. Because of the plurality of connection sites along respective interfaces (52), superior thermal conductivity occurs from the layers (16) to the core (32) since heat travels through these connection sites to effectuate extremely efficient heat transfer and ultimate heat dissipation from the entire printed wiring board structure (30).

    Abstract translation: 一种印刷线路板结构，其具有至少一个芯片承载层，邻近由有机基体制成的芯，其中设置有连续的基于沥青的石墨纤维。 芯片承载层和芯在它们之间具有界面，并且通过电镀和导热材料的通孔彼此一体地连接，从而沿着该界面提供多个连接位置。 有机基质优选由聚合物材料如环氧树脂制成。 优选的纤维由沥青基石墨制成。 由于芯材密度的显着降低，实现了相对于普通钼芯印刷线路板的显着的重量。 通常优选的当前印刷布线板结构在芯的相对侧上具有几个电路层和两个芯片承载层，其中每个层和芯具有各自的界面，其中每个层以多个整体连接到芯 的连接站点，按照电路设计的要求，沿着相应的接口。 由于沿着各个界面的多个连接位置，因为热量传播通过这些连接部位从而实现了从整个印刷线路板结构的非常有效的热传递和最终的散热，所以从层到核心出现了优异的导热性。

    Multilayer wiring board, interlevel connector, and method for making same
    197.
    发明公开
    Multilayer wiring board, interlevel connector, and method for making same 失效
    多层线路板，层间连接器及其制造方法

    公开(公告)号：EP0547852A3

    公开(公告)日：1994-02-16

    申请号：EP92311375.7

    申请日：1992-12-14

    Applicant: XEROX CORPORATION

    Inventor： Wallce, Stanley J. ,  Swift, Joseph A.

    IPC: H01R9/09 ,  H01R23/72 ,  H05K3/36

    CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K3/325 ,  H05K2201/0281 ,  H05K2201/10378

    Abstract: An interlevel connector, a multilayer wiring board assembly, and method for making the same are presented. The interlevel connector includes a dielectric substrate having a plurality of through holes and a corresponding plurality of pultrusions. Each pultrusion includes a plurality of electrically conductive fibers and an electrically conductive or insulating host material carrying the plurality of fibers, each of the plurality of pultrusions being located in a respective through hole and having fibrillated portions extending from surfaces of the dielectric substrate. The interlevel connector is used in the construction of a multilayer wiring assembly in which first and second wiring boards having respective conductive portions are interconnected. The interlevel connector is located adjacent and between the first and second wiring boards, whereby the fibrillated portions of the pultrusion extending from the surfaces of the dielectric substrate contact the conductive portions of the first and second wiring boards. The wiring boards can be permanently or removably locatable adjacent the dielectric substrate.

    Abstract translation: 介绍了一种中间层连接器，多层线路板组件及其制造方法。 中间连接器包括具有多个通孔和相应的多个拉挤的电介质基板。 每个拉挤成型件包括多个导电纤维和携带所述多个纤维的导电或绝缘基质材料，所述多个拉挤中的每一个均位于相应的通孔中并且具有从所述电介质基底的表面延伸的原纤化部分。 层间连接器用于构造具有相应导电部分的第一和第二线路板相互连接的多层线路组件。 层间连接器位于第一布线板和第二布线板之间并且位于第一布线板和第二布线板之间，由此从介电基板的表面延伸的拉挤的原纤化部分接触第一布线板和第二布线板的导电部分。 接线板可以永久地或可移除地位于电介质基板附近。

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