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公开(公告)号：US20160079550A1
公开(公告)日：2016-03-17
申请号：US14955782
申请日：2015-12-01
Applicant: AU Optronics Corporation
Inventor： Tsung-Ying KE
CPC classification number: H01L51/0097 , H01L21/78 , H01L21/7813 , H01L27/1266 , H01L27/3246 , H01L29/04 , H01L29/12 , H01L33/02 , H01L51/003 , H01L51/5237 , H01L51/5253 , H01L2251/5338 , H05K1/028 , H05K1/0353 , H05K1/181 , H05K2201/032 , Y02E10/549 , Y02P70/521
Abstract: An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.
Abstract translation: 有源器件衬底包括柔性衬底，无机去结合层和至少一个有源器件。 柔性基板具有与第一表面相对的第一表面和第二表面，其中第一表面是平坦表面。 无机去结合层覆盖柔性基板的第一表面，无机去结合层的材料是金属，金属氧化物或其组合。 有源器件设置在柔性衬底的第二表面上或上方。
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192.发明授权Method for electroless nickel-phosphorous alloy deposition onto flexible substrates 有权化学镀镍 - 磷合金沉积到柔性基板上的方法公开(公告)号：US09089062B2
公开(公告)日：2015-07-21
申请号：US14368878
申请日：2013-01-21
Applicant: Atotech Deutschland GmbH
Inventor： Boris Alexander Janssen
CPC classification number: H05K1/09 , B05D5/12 , C23C18/16 , C23C18/1633 , C23C18/36 , C23C18/50 , H05K1/028 , H05K3/22 , H05K3/244 , H05K2201/032
Abstract: The present invention relates to a method for electroless deposition of a bendable nickel-phosphorous alloy layer onto flexible substrates such as flexible printed circuit boards and the like. The nickel-phosphorous alloy layer is deposited from an aqueous plating bath comprising nickel ions, hypophosphite ions, at least one complexing agent and a grain refining additive selected from the group consisting of formaldehyde and formaldehyde precursors. The nickel-phosphorous alloy layers obtained have a columnar microstructure oriented perpendicular to the flexible substrate and are sufficiently bendable.
Abstract translation: 本发明涉及一种将可弯曲的镍 - 磷合金层无电沉积到诸如柔性印刷电路板等柔性基板上的方法。 镍 - 磷合金层由包含镍离子，次亚磷酸根离子，至少一种络合剂和选自甲醛和甲醛前体的晶粒细化添加剂的水性镀浴沉积。 获得的镍 - 磷合金层具有垂直于柔性基板的柱状微结构，并且是足够弯曲的。
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公开(公告)号：US20150156886A1
公开(公告)日：2015-06-04
申请号：US14094841
申请日：2013-12-03
Applicant: Yongcai Wang , John Andrew Lebens , Mitchell Lawrence Wright , Julie A. Cummings
Inventor： Yongcai Wang , John Andrew Lebens , Mitchell Lawrence Wright , Julie A. Cummings
CPC classification number: H05K1/09 , G03F7/0002 , G03F7/0035 , H05K1/0274 , H05K1/028 , H05K1/0296 , H05K1/0313 , H05K3/0023 , H05K3/04 , H05K3/22 , H05K2201/0108 , H05K2201/032
Abstract: Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity
Abstract translation: 导电性物品和器件具有通过在变形温度低于150℃的透明柔性基底上固化光固化层形成的导电微线。光固化层在温度微通道形成时的粘度<5,000帕斯卡 - 秒 微通道的平均宽度小于或等于4μm，平均深度和平均宽度比大于或等于1.光固化层暴露于固化紫外线辐射以形成光固化微观图案 并且在光固化微通道中形成包含金属纳米颗粒的导电组合物。 导电组合物以光固化微通道的图案固化，以在透明柔性基底上的光固化微通道的图案中提供导电微线图案。 至少50％的导电微细线中的每一个具有小于0.025欧姆/平方的薄层电阻。
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公开(公告)号：US09013882B2
公开(公告)日：2015-04-21
申请号：US14328989
申请日：2014-07-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoki Gouchi , Takahiro Baba
IPC: H05K7/00 , H05K1/18 , H01L23/538 , H01L23/66 , H05K1/16 , H01L23/58 , H01L25/16 , H05K1/11 , H01L23/498 , H01L21/48 , H05K3/46 , H01L23/00
CPC classification number: H05K1/185 , H01L21/4857 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L23/5389 , H01L23/562 , H01L23/585 , H01L23/66 , H01L24/19 , H01L25/165 , H01L25/18 , H01L2224/16225 , H01L2924/19105 , H01L2924/351 , H05K1/115 , H05K1/16 , H05K3/4632 , H05K3/4697 , H05K2201/032 , H05K2201/042 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T428/24917 , H01L2924/00
Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.
Abstract translation: 高频模块具有通过层压由热塑性树脂材料制成的多个片材并对层压片材进行热压接而形成的多层板，以及设置在多层板中的空腔中的IC芯片。 在IC芯片的一侧和空腔的内壁之间设置间隙。 多层板包括设置在空腔内壁附近的通孔导体，用于防止树脂片在热压接时软化并流入空腔。
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公开(公告)号：US08980414B2
公开(公告)日：2015-03-17
申请号：US13823349
申请日：2012-08-30
Applicant: Tomota Nagaura , Kazuhiko Sakaguchi
Inventor： Tomota Nagaura , Kazuhiko Sakaguchi
IPC: B32B15/00 , B32B15/20 , H05K1/09 , B32B15/01 , C25D1/04 , C25D3/04 , C25D3/12 , C25D3/38 , C25D3/58 , C25D5/14 , C25D7/06 , C25D9/08 , C23C28/02
CPC classification number: H05K1/09 , B32B15/01 , C23C18/165 , C23C18/31 , C23C28/023 , C25D1/04 , C25D3/04 , C25D3/12 , C25D3/14 , C25D3/16 , C25D3/38 , C25D3/562 , C25D3/565 , C25D3/58 , C25D5/14 , C25D7/0614 , C25D9/08 , C25D11/38 , H05K3/025 , H05K2201/0317 , H05K2201/032 , H05K2201/0338 , H05K2201/0355 , H05K2203/0307 , Y10T428/12438 , Y10T428/12493 , Y10T428/12514 , Y10T428/12611 , Y10T428/12667 , Y10T428/12861 , Y10T428/12882 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , Y10T428/12958 , Y10T428/24917
Abstract: The present invention provides a carrier-attached copper foil, wherein an ultrathin copper foil is not peeled from the carrier prior to the lamination to an insulating substrate, but can be peeled from the carrier after the lamination to the insulating substrate. A carrier-attached copper foil comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, wherein the intermediate foil is configured with a Ni layer in contact with an interface of the copper foil carrier and a Cr layer in contact with an interface of the ultrathin copper layer, said Ni layer containing 1,000-40,000 μg/dm2 of Ni and said Cr layer containing 10-100 μg/dm2 of Cr is provided.
Abstract translation: 本发明提供一种载体附着铜箔，其中在层压到绝缘基板之前，超薄铜箔不从载体剥离，而是可以在与绝缘基板层合之后从载体上剥离。 一种载体附着铜箔，包括铜箔载体，层压在所述铜箔载体上的中间层和层压在所述中间层上的超薄铜层，其中所述中间箔配置有与所述中间层的界面接触的Ni层 铜箔载体和与超薄铜层的界面接触的Cr层，所述Ni层含有1000-40,000μg/ dm 2的Ni，所述Cr层含有10-100μg/ dm 2的Cr。
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Patent Agency Ranking
公开(公告)号：US20150060842A1
公开(公告)日：2015-03-05
申请号：US14538288
申请日：2014-11-11
Applicant: AU Optronics Corporation
Inventor： Tsung-Ying KE
CPC classification number: H01L51/0097 , H01L21/78 , H01L21/7813 , H01L27/1266 , H01L27/3246 , H01L29/04 , H01L29/12 , H01L33/02 , H01L51/003 , H01L51/5237 , H01L51/5253 , H01L2251/5338 , H05K1/028 , H05K1/0353 , H05K1/181 , H05K2201/032 , Y02E10/549 , Y02P70/521
Abstract: An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.
Abstract translation: 有源器件衬底包括柔性衬底，无机去结合层和至少一个有源器件。 柔性基板具有与第一表面相对的第一表面和第二表面，其中第一表面是平坦表面。 无机去结合层覆盖柔性基板的第一表面，无机去结合层的材料是金属，金属氧化物或其组合。 有源器件设置在柔性衬底的第二表面上或上方。
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197.发明申请Transparent conductive electrodes comprising merged metal nanowires, their structure design, and method of making such structures 审中-公开包括合并的金属纳米线的透明导电电极，其结构设计和制造这种结构的方法公开(公告)号：US20150014025A1
公开(公告)日：2015-01-15
申请号：US14360876
申请日：2014-01-22
Applicant: Nuovo Film Inc.
Inventor： Hakfei Poon
CPC classification number: H01B1/02 , B22F9/16 , C23C22/58 , C23C22/73 , C23C22/78 , G06F3/041 , G06F2203/04103 , G06F2203/04112 , H01B1/22 , H01B13/30 , H01L31/022466 , H01L31/1884 , H05K1/0274 , H05K1/0298 , H05K1/03 , H05K1/09 , H05K2201/0108 , H05K2201/0302 , H05K2201/032 , Y10T428/249921
Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region having a network of metal nanowires; and a second region, having a metal/metal oxide nanowire in a core shell structure.
Abstract translation: 本发明公开了一种图案化的透明导电电极，其包含衬底和在衬底顶部上的基本单个导电层。 单个导电层包括具有金属纳米线网络的第一区域; 以及具有芯壳结构中的金属/金属氧化物纳米线的第二区域。
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公开(公告)号：US20140327006A1
公开(公告)日：2014-11-06
申请号：US14042869
申请日：2013-10-01
Applicant: AU Optronics Corporation
Inventor： Tsung-Ying KE
CPC classification number: H01L51/0097 , H01L21/78 , H01L21/7813 , H01L27/1266 , H01L27/3246 , H01L29/04 , H01L29/12 , H01L33/02 , H01L51/003 , H01L51/5237 , H01L51/5253 , H01L2251/5338 , H05K1/028 , H05K1/0353 , H05K1/181 , H05K2201/032 , Y02E10/549 , Y02P70/521
Abstract: An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.
Abstract translation: 有源器件衬底包括柔性衬底，无机去结合层和至少一个有源器件。 柔性基板具有与第一表面相对的第一表面和第二表面，其中第一表面是平坦表面。 无机去结合层覆盖柔性基板的第一表面，无机去结合层的材料是金属，金属氧化物或其组合。 有源器件设置在柔性衬底的第二表面上或上方。
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公开(公告)号：US20140299365A1
公开(公告)日：2014-10-09
申请号：US14240815
申请日：2012-09-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Muthu Sebastian , Dominic M. Travasso , Nancy S. Lennhoff , Steven T. Swartz
CPC classification number: H05K1/0274 , G06F3/044 , H05K1/09 , H05K3/06 , H05K2201/0302 , H05K2201/032
Abstract: An article includes a multilayer structure, such as, e.g., a touch sensor, having two opposing sides and comprising a central polymeric UV transparent substrate, a transparent conductive layer on each of the two major opposing surfaces of the polymeric substrate, a metallic conductive layer on each transparent conductive layer, and a patterned photoimaging mask on each metallic conductive layer.
Abstract translation: 一种物品包括多层结构，例如触摸传感器，具有两个相对的侧面并且包括中心聚合物UV透明基板，在聚合物基板的两个主要相对表面的每一个上的透明导电层，金属导电层 在每个透明导电层上，以及每个金属导电层上的图案化成像掩模。
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200.发明申请MIXED-METAL SYSTEM CONDUCTORS FOR USE IN LOW-TEMPERATURE CO-FIRED CERAMIC CIRCUITS AND DEVICES 审中-公开用于低温合成陶瓷电路和器件的混合金属系统导体公开(公告)号：US20140224530A1
公开(公告)日：2014-08-14
申请号：US14257306
申请日：2014-04-21
Applicant: E I DU PONT DE NEMOURS AND COMPANY
Inventor： KUMARAN MANIKANTAN NAIR , Scott E. GORDON , Mark Frederick MCCOMBS
CPC classification number: H05K3/0094 , H01B1/22 , H05K1/09 , H05K1/092 , H05K1/095 , H05K1/115 , H05K3/4061 , H05K2201/032 , H05K2201/09481 , H05K2201/09563 , H05K2203/1126
Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.
Abstract translation: 公开了一种用于形成过渡通孔和过渡管线导体的组合物，用于最小化异种金属组合物之间电连接处的界面效应。 该组合物具有（a）选自（i）20-45wt％金和80-55wt％银和（ii）100wt％银 - 金固溶体合金的无机成分，和（b）有机 中。 该组合物还可以含有（c）基于组合物重量的1-5重量％的选自Cu，Co，Mg和Al的金属的氧化物或混合氧化物和/或主要含有 难熔氧化物。 组合物可以用作通孔填充物中的多层组合物。 也可以使用用于形成过渡通孔和过渡管线导体的组合物来形成诸如LTCC电路和器件的多层电路。
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