公开(公告)号：US06720201B2

公开(公告)日：2004-04-13

申请号：US10384495

申请日：2003-03-10

Applicant: Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

Inventor： Eun-sung Lee ,  Chung-woo Kim ,  In-sang Song ,  Jong-seok Kim ,  Moon-chul Lee

IPC: H01L2100

CPC classification number: B81B3/0078 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81C2201/0107 ,  B81C2201/014 ,  H01H59/0009

Abstract: A method for fabricating a MEMS device having a fixing part fixed to a substrate, a connecting part, a driving part, a driving electrode, and contact parts, includes patterning the driving electrode on the substrate; forming an insulation layer on the substrate; patterning the insulation layer and etching a fixing region and a contact region of the insulation layer; forming a metal layer over the substrate; planarizing the metal layer until the insulation layer is exposed; forming a sacrificial layer on the substrate; patterning the sacrificial layer to form an opening exposing a portion of the insulation layer and the metal layer in the fixing region; forming a MEMS structure layer on the sacrificial layer to partially fill the opening, thereby forming sidewalls therein; and selectively removing a portion of the sacrificial layer by etching so that a portion of the sacrificial layer remains in the fixing region.

公开(公告)号：US20030234179A1

公开(公告)日：2003-12-25

申请号：US10434315

申请日：2003-05-07

Applicant: MEMGen Corporation

Inventor： Christopher A. Bang

IPC: C25D005/02 ,  C25D001/10

CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFABnull formation process), and typically contain features having resolutions within the 1 to 100 nullm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract translation: 提供了模制结构，制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其他模具部件组合，并将模塑材料注入模具中并硬化。 层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

公开(公告)号：US20030117257A1

公开(公告)日：2003-06-26

申请号：US10290807

申请日：2002-11-08

Applicant: Coventor, Inc.

Inventor： Shawn Jay Cunningham

IPC: H01C010/50

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch having a movable microcomponent is provided and includes a substrate having a stationary contact. The switch can also include a structural layer having a movable contact positioned for contacting the stationary contact when the structural layer moves toward the substrate. An electrothermal latch attached to the structural layer and having electrical communication with the movable contact to provide current flow between the electrothermal latch and the stationary contact when the movable contact contacts the stationary contact for maintaining the movable contact in contact with the stationary contact.

Abstract translation: 电热自锁式MEMS开关及方法。 根据一个实施例，提供具有可移动微组件的微型开关，并且包括具有固定触点的基板。 该开关还可以包括具有可移动触点的结构层，该结构层定位成当结构层向衬底移动时与固定触点接触。 一个电热锁定件，其连接到结构层并且当可动触点接触固定触点以便使可动触点与固定触点接触时，与可动触头电连通以提供电热闩和固定触点之间的电流。

公开(公告)号：US06365442B1

公开(公告)日：2002-04-02

申请号：US09679582

申请日：2000-10-04

Applicant: Dean Tran ,  John Joseph Berenz ,  Luis M. Rochin ,  Thomas J. Roth ,  Ronald A. DePace

Inventor： Dean Tran ,  John Joseph Berenz ,  Luis M. Rochin ,  Thomas J. Roth ,  Ronald A. DePace

IPC: H01L2182

CPC classification number: B81C1/00396 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C2201/0107 ,  H01H1/0036 ,  H01H35/14 ,  H01H59/0009

Abstract: A method of making a micro-miniature switch device (10), which has at least one member (68) movable relative to a substrate (12) upon which the device is provided, includes providing a layer of sacrificial non-photolithography material upon a stratum connected to the substrate. A template is provided via photolithographing step that uses a photoresist material upon a stratum connected to the substrate. A layer is provided to include at least a portion of the movable member. The photoresist material and the sacrificial non-photolithography material are removed using photoresist developer. Preferably, at least two photolithography process steps utilize a single photolithographic mask. Also preferably, substrate material is removed to create a recess and at least one channel into the substrate, wherein the channel intersects the recess. At least a portion of the movable member is provided at a location within the recess and at least a portion of the movable member is provided at a location within the channel.

Abstract translation: 一种制造微型开关装置（10）的方法，该微型开关装置（10）具有至少一个可相对于其上提供该装置的基板（12）移动的构件（68），包括在一个 层与基板连接。 通过光刻步骤提供模板，其在连接到衬底的层上使用光致抗蚀剂材料。 提供层以包括可移动构件的至少一部分。 使用光致抗蚀剂显影剂除去光致抗蚀剂材料和牺牲非光刻材料。 优选地，至少两个光刻工艺步骤使用单个光刻掩模。 还优选地，去除衬底材料以产生凹陷和至少一个通道进入衬底，其中沟道与凹部相交。 可移动部件的至少一部分设置在凹部内的位置处，并且可移动部件的至少一部分设置在通道内的位置处。

公开(公告)号：US6020215A

公开(公告)日：2000-02-01

申请号：US844971

申请日：1997-04-28

Applicant: Takayuki Yagi ,  Masatake Akaike

Inventor： Takayuki Yagi ,  Masatake Akaike

IPC: B81B3/00 ,  B81C1/00 ,  G03F7/00 ,  H01H59/00 ,  H01L23/00 ,  H02N1/00 ,  H02N2/00 ,  H02N2/02 ,  H01L21/311

CPC classification number: B81C1/0092 ,  B81C1/00936 ,  H01H59/0009 ,  H02N1/006 ,  B81B2203/0118 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2203/031

Abstract: A microstructure comprising a substrate (1), a patterned structure (beam member) (2) suspended over the substrate (1) with an air-space (4) therebetween and supporting structure (3) for suspending the patterned structure (2) over the substrate (1). The microstructure is prepared by using a sacrificial layer (7) which is removed to form the space between the substrate (1) and the patterned structure (2) adhered to the sacrificial layer. In the case of using resin as the material of the sacrificial layer, the sacrificial layer can be removed without causing sticking, and an electrode can be provided on the patterned structure. The microstructure can have application as electrostatic actuator, etc., depending on choice of shape and composition.

Abstract translation: 一种微结构，其包括衬底（1），悬挂在衬底（1）上的图案化结构（梁构件）（2），其间具有空气空间（4）和用于将图案化结构（2）悬挂在其上的支撑结构（3） 基板（1）。 通过使用牺牲层（7）来制备微结构，所述牺牲层被除去以形成衬底（1）和附着到牺牲层的图案化结构（2）之间的空间。 在使用树脂作为牺牲层的材料的情况下，可以除去牺牲层而不引起粘附，并且可以在图案化结构上提供电极。 根据形状和组成的选择，微结构可以用作静电致动器等。

公开(公告)号：US4681403A

公开(公告)日：1987-07-21

申请号：US877696

申请日：1986-06-19

Applicant: Ties S. Te Velde ,  Joannes L. M. Van de Venne

Inventor： Ties S. Te Velde ,  Joannes L. M. Van de Venne

IPC: G02F1/133 ,  B81B3/00 ,  G02F1/01 ,  G02F1/1362 ,  G02F1/15 ,  G02F1/163 ,  G02F1/17 ,  G09F9/30 ,  G09G3/20 ,  G09G3/38 ,  H01H1/00 ,  H01H59/00

CPC classification number: B81C1/00333 ,  G02F1/0102 ,  G02F1/1362 ,  G02F1/163 ,  G09G3/38 ,  H01H59/0009 ,  B81C2201/0107 ,  B81C2203/0136 ,  G09G2300/08 ,  G09G3/20 ,  H01H1/0036

Abstract: A layer of liquid crystal is present between two supporting plates with a large number of picture electrodes arranged in rows and columns on at least one of the supporting plates. Strip-shaped row electrodes and strip-shaped column electrodes are provided between the respective rows and columns of the picture electrodes. The picture electrodes arranged in rows can be contacted with a respective row electrode by way of at least one micromechanical leaf spring which provides the liquid crystal with a sufficiently steep threshold with respect to the applied voltage, and provides the liquid crystal with a memory when the picture electrodes form picture elements of a display device. Because of this arrangement, the number of lines to be driven of the display device can be extended.

Abstract translation: 在两个支撑板之间存在一层液晶，其中至少一个支撑板上具有排列成行和列的大量图像电极。 带状行电极和带状列电极设置在图象电极的各列和列之间。 排列成行的图像电极可以通过至少一个微机械板簧与相应的行电极接触，其提供相对于所施加的电压的足够陡峭的阈值的液晶，并且当液晶具有存储器时 图像电极形成显示装置的图像元素。 由于这种布置，可以延长显示装置的被驱动的行数。

公开(公告)号：TWI224578B

公开(公告)日：2004-12-01

申请号：TW090127015

申请日：2001-10-31

Applicant: 萬國商業機器公司 INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： 密雪兒 迪斯龐 MICHEL DESPONT ,  尤特 德崔斯勒 UTE DRECHSLER ,  羅伊H. 瑪格紐森 ROY H. MANGUSON

IPC: B81C

CPC classification number: H01L21/30604 ,  B81B2201/12 ,  B81B2203/0118 ,  B81C1/00801 ,  B81C2201/0107 ,  B81C2201/0114 ,  B81C2201/0133 ,  C23F13/14

Abstract: 一種在製造期間保護微結構材料免於不想要電蝕刻之方法，該微結構包含該材料與貴金屬層(8)，此方法包括在結構上形成具有氧化還原電位比該材料低之犧牲性金屬層(12)，該犧牲性金屬層(12)係電連接至該貴金屬層(8)。

Abstract in simplified Chinese: 一种在制造期间保护微结构材料免于不想要电蚀刻之方法，该微结构包含该材料与贵金属层(8)，此方法包括在结构上形成具有氧化还原电位比该材料低之牺牲性金属层(12)，该牺牲性金属层(12)系电连接至该贵金属层(8)。

公开(公告)号：WO2017058335A1

公开(公告)日：2017-04-06

申请号：PCT/US2016/041954

申请日：2016-07-13

Applicant: GENERAL ELECTRIC COMPANY

Inventor： BREWER, Joleyn, Eileen ,  KEIMEL, Christopher, Fred ,  AIMI, Marco, Francesco ,  MINNICK, Andrew, James ,  RUFFALO, Renner, Stephen

IPC: B81B3/00

CPC classification number: B81B3/0027 ,  B81B3/0075 ,  B81B7/0003 ,  B81B7/008 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2201/0228 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/053 ,  B81B2207/015 ,  B81B2207/115 ,  B81C1/00134 ,  B81C1/0015 ,  B81C1/00158 ,  B81C1/00182 ,  B81C1/00373 ,  B81C2201/0107 ,  G01L9/0042 ,  G01L9/0044

Abstract: A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.

Abstract translation: 一种用于微电子机械系统（MEMS）装置的系统和方法，其包括形成在基板上的基板和独立悬挂的电镀金属MEMS结构。 独立悬挂的电镀金属MEMS结构包括机械耦合到基底的金属机械元件和机械耦合到机械元件并与之机电连接的种子层，种子层包括难熔金属和耐火材料中的至少一种 金属合金，其中机械元件的厚度基本上大于种子层的厚度，使得独立和悬浮的电镀金属MEMS结构的机械和电学性质由机械元件的材料特性限定。

公开(公告)号：WO2016167848A1

公开(公告)日：2016-10-20

申请号：PCT/US2016/012133

申请日：2016-01-05

Applicant: THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY ,  MEYER, David, J. ,  DOWNEY, Brian, P.

Inventor： MEYER, David, J. ,  DOWNEY, Brian, P.

IPC: B81C1/00 ,  B81B7/00 ,  B81B7/02 ,  H01L27/04

CPC classification number: B81C1/00539 ,  B81C1/00936 ,  B81C2201/0107 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0177

Abstract: A process for fabricating a suspended microelectromechanical system (MEMS) structure comprising epitaxial semiconductor functional layers that are partially or completely suspended over a substrate. A sacrificial release layer and a functional device layer are formed on a substrate. The functional device layer is etched to form windows in the functional device layer defining an outline of a suspended MEMS device to be formed from the functional device layer. The sacrificial release layer is then etched with a selective release etchant to remove the sacrificial release layer underneath the functional layer in the area defined by the windows to form the suspended MEMS structure.

Abstract translation: 一种用于制造悬浮微机电系统（MEMS）结构的方法，其包括部分或完全悬浮在衬底上的外延半导体功能层。 在基板上形成牺牲剥离层和功能元件层。 功能器件层被蚀刻以在功能器件层中形成窗口，其限定要由功能器件层形成的悬置的MEMS器件的轮廓。 然后用选择性释放蚀刻剂蚀刻牺牲剥离层，以去除由窗口限定的区域中的功能层下方的牺牲剥离层，以形成悬浮的MEMS结构。

公开(公告)号：WO2013036394A2

公开(公告)日：2013-03-14

申请号：PCT/US2012052524

申请日：2012-08-27

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  STEPHANOU PHILIP JASON ,  LONDERGAN ANA RANGELOVA ,  GOUSEV EVGENI PETROVICH ,  SHENOY RAVINDRA VAMAN

Inventor： STEPHANOU PHILIP JASON ,  LONDERGAN ANA RANGELOVA ,  GOUSEV EVGENI PETROVICH ,  SHENOY RAVINDRA VAMAN

IPC: B81C1/00

CPC classification number: B81C1/0038 ,  B81B2203/0392 ,  B81C2201/0107 ,  B81C2201/0188 ,  B81C2201/038 ,  C23C18/1653 ,  C25D5/10 ,  C25D5/18 ,  C25D5/48 ,  C25D7/00 ,  Y10T428/12493 ,  Y10T428/24612

Abstract: This disclosure provides implementations of high surface area stacked layered metallic structures, devices, apparatus, systems, and related methods. A plurality of stacked layers on a substrate may be manufactured from a plating bath including a first metal and a second metal. A modulated plating current can deposit alternate first metal layers and alloy layers, the alloy layers including the first metal and the second metal. Gaps between the alloy layers can be formed by selectively etching some portions of the first metal layers to define a stacked layered structure. Stacked layered structures may be useful in applications to form capacitors, inductors, catalytic reactors, heat transfer tubes, non-linear springs, filters, batteries, and heavy metal purifiers.

Abstract translation: 本公开提供了高表面积堆叠分层金属结构，器件，装置，系统和相关方法的实现。 基板上的多个堆叠层可以由包含第一金属和第二金属的电镀槽制造。 调制的电镀电流可沉积交替的第一金属层和合金层，合金层包括第一金属和第二金属。 可以通过选择性地蚀刻第一金属层的一些部分以限定堆叠的分层结构来形成合金层之间的间隙。 堆叠分层结构可用于形成电容器，电感器，催化反应器，传热管，非线性弹簧，过滤器，电池和重金属净化器的应用。