Micro-miniature structure fabrication
    211.
    发明公开
    Micro-miniature structure fabrication 失效
    微型结构制造

    公开(公告)号:EP0592094A2

    公开(公告)日:1994-04-13

    申请号:EP93306702.7

    申请日:1993-08-24

    Abstract: In the fabrication of a free-standing miniaturized structure in a range of about 10 to 20 µm thick, a method based on a sacrificial system includes the steps of selecting a substrate material, depositing on the substrate material a sacrificial layer 58 of material and patterning the sacrificial layer to define a shape. A photoresist layer 62 of material is deposited on the sacrificial layer and patterned by contrast-enhanced photolithography to form a photoresist mould. Upon the mould there is plated a metallic layer 68 of material. The electroplated structure conforms to the resist profile and can have a thickness many times that of conventional polysilicon microstructures. The photoresist mould and the sacrificial layer are thereafter dissolved using etchants to form a free standing metallic structure in a range of about 10 to 20 µm thick, with vertical to lateral aspect ratios of 9:1 to 10:1 or more.

    Abstract translation: 在制造约10至20μm厚的自立式小型化结构中,基于牺牲系统的方法包括以下步骤:选择衬底材料,在衬底材料上沉积材料的牺牲层58并图案化 牺牲层来定义一个形状。 将材料的光致抗蚀剂层62沉积在牺牲层上并且通过对比增强的光刻来图案化以形成光刻胶模具。 在模具上镀上一层金属材料层68。 电镀结构符合抗蚀剂轮廓并且可以具有传统多晶硅微结构的多倍。 之后使用蚀刻剂溶解光致抗蚀剂模具和牺牲层以形成约10至20μm厚的独立式金属结构,垂直横向长宽比为9:1至10:1或更大。

    Method for manufacturing micro-mechanical part
    219.
    发明专利
    Method for manufacturing micro-mechanical part 有权
    制造微机械部件的方法

    公开(公告)号:JP2010019844A

    公开(公告)日:2010-01-28

    申请号:JP2009163498

    申请日:2009-07-10

    Abstract: PROBLEM TO BE SOLVED: To provide a method capable of pre-assembling simply and surely a part which makes it avoid to touch a functional portion of the part, so as to establish a state in which the part can be mounted any time in a device such as a timepiece without touching the part. SOLUTION: The invention relates to the method for manufacturing of the mechanical part including a step providing a substrate 53 made of micro-machinable material, and a step etching, with help of photo-lithography, a pattern that includes the mechanical part over the entire substrate 53. Furthermore, the method includes a step assembling a clip 91 on the mechanical part so that the mechanical part is ready to be mounted without being touched the portion made of micro-machinable material, and a step releasing the mechanical part from the substrate 53 so as to mount the mechanical part in the device such as a timepiece movement. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种能够简单且可靠地预先组装一部分的方法,其使得避免接触部件的功能部分,从而建立可以随时安装部件的状态 在诸如钟表的装置中,而不接触该部件。 解决方案:本发明涉及机械部件的制造方法,包括提供由微加工材料制成的基板53的步骤,以及借助于光刻法的步骤蚀刻包括机械部件的图案 此外,该方法包括将夹子91组装在机械部件上的步骤,使得机械部件准备好安装而不会被微机械加工材料制成的部分接触,并且将机械部件 从基板53将机械部件安装在装置中,例如钟表运动。 版权所有(C)2010,JPO&INPIT

    Manufacturing method of single-layered or multilayered metal structure in liga technique and structure obtained thereby
    220.
    发明专利
    Manufacturing method of single-layered or multilayered metal structure in liga technique and structure obtained thereby 有权
    LIGA技术中单层或多层金属结构的制造方法及其获得的结构

    公开(公告)号:JP2007247067A

    公开(公告)日:2007-09-27

    申请号:JP2007067204

    申请日:2007-03-15

    Inventor: SAUCY CLEMENT

    Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a single-layered or multilayered metal structure using a LIGA technique. SOLUTION: In this method, a photoresist layer is placed on a flat metal substrate, a photoresist mold is prepared by irradiation, electron bombardment or ion bombardment, a metal or alloy is electroplated in the mold, the electrocast metal structure is separated from the substrate, the photoresist is cut off from the metal structure, and the metal substrate is used as an agent involved in formation of at least one surface of the metal structure other than a surface formed by the flat surface of the substrate. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:提供使用LIGA技术制造单层或多层金属结构的方法。 解决方案:在该方法中,将光致抗蚀剂层放置在平坦的金属基板上,通过照射,电子轰击或离子轰击制备光致抗蚀剂模具,将金属或合金电镀在模具中,将电铸金属结构分离 从基板切断光致抗蚀剂与金属结构的切断,金属基板被用作形成金属结构的至少一个表面而不是由基板的平坦表面形成的表面的试剂。 版权所有(C)2007,JPO&INPIT

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