公开(公告)号：EP2035326A1

公开(公告)日：2009-03-18

申请号：EP07728389.3

申请日：2007-04-23

Applicant: Robert Bosch GmbH

Inventor： BENZEL, Hubert ,  ARMBRUSTER, Simon ,  SCHELLING, Christoph ,  HOECHST, Arnim ,  FEYH, Ando

IPC: B81B3/00 ,  G01J5/10 ,  G01K7/01

CPC classification number: B81B3/0081 ,  B81B2201/0278 ,  B81B2203/0109 ,  B81B2207/015 ,  B81C2201/0109 ,  G01J5/06 ,  G01J5/20

Abstract: The invention relates to a sensor, especially for location-independent detection. Said sensor comprises a substrate (1), at least one microstructured sensor element (52) having an electrical property that varies with temperature, and at least one membrane (36.1) above a cavern (26, 74, 94), the sensor element (52) being arranged on the lower face of the at least one membrane (36.1), and the sensor element (52) being connected via leads (60, 62; 98-1, 98-2, 100-1, 100-2) which extend in, on or below the membrane (36.1). According to the invention, especially a plurality of sensor elements (52) can be configured as diode pixels in a monocrystalline layer that is formed by epitaxial growth. In the membrane (36.1), suspension springs (70) can be configured that receive the individual sensor elements (52) in an elastic and insulating manner.

公开(公告)号：EP1460035A4

公开(公告)日：2009-01-07

申请号：EP02805882

申请日：2002-12-16

Applicant: SONY CORP

Inventor： IKEDA KOICHI

IPC: G02B26/02 ,  B81B3/00 ,  B81C1/00 ,  G02B5/18 ,  G02B26/08

CPC classification number: B81C1/0015 ,  B81B2201/045 ,  B81B2203/04 ,  B81C2201/0109 ,  B81C2201/0173 ,  B81C2203/0109 ,  G02B26/0841

Abstract: An electrostatic MEMS element for flattening a drive side electrode surface and improving its performance as well as for improving degree of design freedom in a manufacturing process. A manufacturing method of the electrostatic MEMS element is also disclosed. Moreover, a GLV device using the MEMS element and a laser display using the GLV device are also disclosed. The electrostatic MEMS element includes a substrate side electrode and a beam having a drive side electrode driven by an electrostatic attracting force or electrostatic repulsive force functioning between the substrate side electrode and the drive side electrode. The substrate side electrode is formed in a conductive semiconductor region having impurities in the semiconductor substrate so as to constitute an electrostatic drive MEMS element.

公开(公告)号：EP1904398A2

公开(公告)日：2008-04-02

申请号：EP06765888.0

申请日：2006-06-27

Applicant: Philips Intellectual Property & Standards GmbH ,  Koninklijke Philips Electronics N.V.

Inventor： DUEMLING, Martin ,  POHLMANN, Hauke ,  LANGEREIS, Geert ,  DEKKER, Ronald

IPC: B81C1/00

CPC classification number: B81C1/00182 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81C1/00047 ,  B81C2201/0109

Abstract: The device (100) comprises a substrate (10) of a semiconductor material with a first and an opposite second surface (1,2) and a microelectromechanical (MEMS) element (50) which is provided with a fixed and a movable electrode (52, 51) that is present in a cavity (30). One of the electrodes (51,52) is defined in the substrate (10). The movable electrode (51) is movable towards and from the fixed electrode (52) between a first gapped position and a second position. The cavity (30) is opened through holes (18) in the substrate (10) that are exposed on the second surface (2) of the substrate (10). The cavity (30) has a height that is defined by at least one post (15) in the substrate (10), which laterally substantially surrounds the cavity (15).

公开(公告)号：EP1454333B1

公开(公告)日：2007-09-12

申请号：EP02797085.4

申请日：2002-11-08

Applicant: WiSpry, Inc.

Inventor： CUNNINGHAM, Shawn, J. ,  DEREUS, Dana, R. ,  Sett, Subham ,  TATIC-LUCIC, Svetlana

IPC: B81B3/00 ,  B81B7/00 ,  H01H59/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A movable, trilayered microcomponent (108) suspended over a substrate (102) is provided and includes a first electrically conductive layer (116) patterned to define a movable electrode (114). The first metal layer (116) is separated from the substrate (102) by a gap. The microcomponent (108) further includes a dielectric layer formed (112) on the first metal layer (116) and having an end fixed with respect to the substrate (102). Furthermore, the microcomponent (102) includes a second electrically conductive layer (120) formed on the dielectric layer (112) and patterned to define an electrode interconnect (124) for electrically communicating with the movable electrode (114).

公开(公告)号：EP1803022A1

公开(公告)日：2007-07-04

申请号：EP05802111.4

申请日：2005-08-30

Applicant: IDC, LLC

Inventor： MILES, Mark W. ,  BATEY, John ,  CHUI, Clarence ,  KOTHARI, Manish ,  TUNG, Ming-Hau

IPC: G02B26/00

CPC classification number: B81B3/0086 ,  B81C2201/0109 ,  B81C2201/014 ,  B81C2201/053 ,  G02B26/001

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

公开(公告)号：EP1752415A2

公开(公告)日：2007-02-14

申请号：EP06016572.7

申请日：2006-08-08

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Izumi, Konami ,  Yamaguchi, Mayumi ,  Tateishi, Fuminori

IPC: B81B3/00

CPC classification number: B81C1/0015 ,  B81B2203/0118 ,  B81C1/00404 ,  B81C2201/0109

Abstract: To provide a method of easily forming a three-dimensional structure typified by a cantilever by using a thin film formed over an insulating surface, and provide a microelectromechanical system formed by such a method. A three-dimensional structure typified by a cantilever is formed by using a mask having a nonuniform thickness. Specifically, a microstructure is manufactured by processing a structural layer formed over a sacrificial layer by using a mask having a nonuniform thickness and then removing the sacrificial layer. The sacrificial layer can be formed by using a silicon layer or a metal layer.

Abstract translation: 提供一种通过使用形成在绝缘表面上的薄膜来容易地形成以悬臂为代表的三维结构的方法，并且提供通过这种方法形成的微机电系统。 通过使用具有不均匀厚度的掩模形成由悬臂代表的三维结构。 具体地，通过使用具有不均匀厚度的掩模，然后去除牺牲层，通过加工在牺牲层上形成的结构层来制造微结构。 牺牲层可以通过使用硅层或金属层形成。

公开(公告)号：EP1663850A1

公开(公告)日：2006-06-07

申请号：EP04773454.6

申请日：2004-09-21

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： OKA, Naomasa, c/o Matsushita Electric Works, Ltd. ,  HARADA, Hiroshi, Matsushita Electric Works, Ltd. ,  OGIHARA, Jun, c/o Matsushita Electric Works, Ltd. ,  FUKSHIMA, Hiroshi, Matsushita Electric Works, Ltd. ,  NOGE, Hiroshi, c/o Matsushita Electric Works, Ltd. ,  SUZUKI, Yuji, c/o Matsushita Electric Works, Ltd. ,  KAWANO, Kiyohiko, Matsushita Electric Works, Ltd. ,  YOSHIHARA, Takaaki, Matsushita Electric Works, Ltd ,  SUZUMURA, Masahiko, Matsushita Electric Works, Ltd

IPC: B81B3/00 ,  G02B26/08 ,  B81C1/00

CPC classification number: G02B26/0816 ,  B81B3/0086 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C2201/0109 ,  B81C2201/019 ,  G02B6/3516 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/355 ,  G02B6/357 ,  G02B6/3584 ,  H02N1/008

Abstract: A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower substrate. The upper substrate is selectively etched in its top layer to form therein a plurality of posts which project commonly from a bottom layer of the upper substrate. The posts include the fixed components to be fixed to the lower substrate and the movable components which are resiliently supported only to one or more of the fixed components to be movable relative to the fixed components. The lower substrate is formed in its top surface with at least one recess. The upper substrate is then bonded to the top of the lower substrate upside down in such a manner as to place the fixed components directly on the lower substrate and to place the movable components upwardly of the recess. Finally, the bottom layer of the upper substrate is removed to release the movable components from the bottom layer for floating the movable components above the recess and allowing them to move relative to the lower substrate, while keeping the fixed components fixed to the top of the lower substrate.

公开(公告)号：EP1184335B1

公开(公告)日：2006-02-01

申请号：EP01117577.5

申请日：2001-07-20

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Bruchhaus, Rainer, Dr. ,  Kolb, Stefan ,  Pitzer, Dana ,  Primig, Robert ,  Schreiter, Matthias ,  Winkler, Bernhard

IPC: B81B3/00

CPC classification number: B81C1/00246 ,  B81B7/0006 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/097 ,  B81C2201/0109 ,  B81C2201/0163 ,  B81C2201/017 ,  B81C2203/0778

公开(公告)号：EP1594799A2

公开(公告)日：2005-11-16

申请号：EP03815817.6

申请日：2003-09-25

Applicant: ROBERT BOSCH GMBH

Inventor： METZGER, Lars ,  FISCHER, Frank

IPC: B81B3/00

CPC classification number: B81C1/00047 ,  B81B2203/0127 ,  B81C1/0069 ,  B81C2201/0109

Abstract: The invention relates to a method for producing a micromechanical device and to corresponding micromechanical device consisting of a substrate material (10), a membrane (20) and a hollow space (30) formed in the region of membrane (21) between said substrate and membrane. According to said invention holes (40) are embodied first and foremost in the membrane (20) during a first etching stage and afterwards, the hollow space is produced during a second etching stage.

公开(公告)号：EP1593164A2

公开(公告)日：2005-11-09

申请号：EP04710662.0

申请日：2004-02-12

Applicant: Nantero, Inc.

Inventor： JAIPRAKASH, Venkatachalam, C. ,  WARD, Jonathan, W. ,  RUECKES, Thomas ,  SEGAL, Brent, M.

IPC: H01L29/84 ,  B82B1/00

CPC classification number: G11C23/00 ,  B81B2201/016 ,  B81B2203/0127 ,  B81C1/00142 ,  B81C2201/0109 ,  B82Y10/00 ,  G11C13/025 ,  G11C14/00 ,  G11C2213/16 ,  G11C2213/77 ,  G11C2213/81 ,  H01H1/0094

Abstract: Electro-mechanical switches and memory cells using vertically-disposed nanofabric articles and methods of making the same are described. An electro-mechanical device, includes a structure having a major horizontal surface and a channel formed therein. A conductive trace is in the channel; and a nanotube article vertically suspended in the channel, in spaced relation to a vertical wall of the channel. The article is electro-mechanically deflectable in a horizontal direction toward the conductive trace. Under certain embodiments, the vertically suspended extent of the nanotube article is defined by a thin film process. Under certain embodiments, the vertically suspended extent of the nanotube article is about 50 nanometers or less. Under certain embodiments, the nanotube article is clamped with a conducting material disposed in porous spaces between some nanotubes of the nanotube article. Under certain embodiments, the nanotube article is formed from a porous nanofabric. Under certain embodiments, the nanotube article is electromechanically deflectable into contact with the conductive trace and the contact is either a volatile state or non-volatile state depending on the device construction. Under certain embodiments, the vertically oriented device is arranged into various forms of three-trace devices. Under certain embodiments, the channel may be used for multiple independent devices, or for devices that share a common electrode.