公开(公告)号：WO03031321A3

公开(公告)日：2003-10-09

申请号：PCT/US0222782

申请日：2002-07-17

Applicant: INNOVATIVE TECH LICENSING LLC

Inventor： DE NATALE JEFFREY F

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  G02B6/35

CPC classification number: G02B6/3518 ,  B81B3/0083 ,  B81B2201/042 ,  B81C1/00214 ,  B81C2201/053 ,  G02B6/3584

Abstract: A new hybrid method of fabricating optical micro electro mechanical system (MEMS) devices is disclosed that uses both bulk and surface micromachining techniques, and a new optical MEMS device is also disclosed that is fabricated using the new method. The method includes the step of mounting a handle layer to one or more layers of MEMS structural material (12). Layers of structural and sacrificial material are then built up on the MEMS structural material using surface micromachining techniques (14). Drive electronics are mounted to the layers of structural and sacrificial material (17). The handle layer is removed (18) to reveal the MEMS structural layer and the sacrificial material within the various layers is dissolved (20). The new method is particularly applicable to fabricating optical MEMS devices, with the handle layer (54) being adjacent to a Si mirror layer (52). The surface micromachining layers form electrode (66) and spring structures (67, 68). Drive electronics (92) are then mounted on the layers of structural material, so that a bias can be applied to the MEMS structures. The handle layer (54) is removed from the mirror layer (52) to reveal the mirror's reflective surface, and the sacrificial material (64) is dissolved away, freeing the MEMS structures to operate. For optical or other MEMS arrays, a linking framework (70) can be included to attach the MEMS devices.

Abstract translation: 公开了一种制造光学微机电系统（MEMS）器件的新型混合方法，其使用了体积和表面微加工技术，并且还公开了使用新方法制造的新的光学MEMS器件。 该方法包括将手柄层安装到一个或多个MEMS结构材料层（12）的步骤。 然后使用表面微加工技术在MEMS结构材料上构建结构和牺牲材料层（14）。 驱动电子装置安装到结构和牺牲材料层（17）上。 去除手柄层（18）以露出MEMS结构层，并且各层内的牺牲材料被溶解（20）。 该新方法特别适用于制造光学MEMS器件，其中手柄层（54）与Si镜面层（52）相邻。 表面微加工层形成电极（66）和弹簧结构（67,68）。 然后将驱动电子器件（92）安装在结构材料层上，使得可以将偏置施加到MEMS结构。 将手柄层（54）从镜面层（52）移除以露出反射镜的反射表面，并且牺牲材料（64）被溶解掉，释放MEMS结构的操作。 对于光学或其他MEMS阵列，可以包括连接框架（70）以附接MEMS器件。

公开(公告)号：WO2002076879A1

公开(公告)日：2002-10-03

申请号：PCT/DK2002/000214

申请日：2002-03-27

Applicant: DANISH ELECTRONICS LIGHT & ACOUSTICS (DELTA) ,  LISBY, Torben ,  BRANEBJERG, Jens, A.

Inventor： LISBY, Torben ,  BRANEBJERG, Jens, A.

IPC: B81B3/00

CPC classification number: G02B6/4226 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/123 ,  B81C1/0019 ,  B81C2201/017 ,  B81C2201/053 ,  B81C2203/0136 ,  G02B6/3502 ,  G02B6/3584

Abstract: A method for producing a unitary flexible microelement from a supporting wafer is provided. The unitary flexible microelement defines a supporting body having a solid region and a flexible region consisting of a thin part of the supporting wafer. The method comprises the following steps: defining thickness of the flexible region and growing an upper insulating layer to the upper surface covering the predefined area and growing a lower insulating layer to the lower surface covering the solid region. The method comprises defining a conductive layer on the predefined area of the upper surface, depositing a final insulating layer on the upper surface covering the conductive layer and depositing a metallic protective layer on the upper surface covering the insulating layer. Furthermore, the method comprises etching the lower surface until the etching reaches the thickness of the flexible region, and deepositing a conductive layer on the lower surface to establish a coaxial conductor.

Abstract translation: 提供了从支撑晶片生产单一柔性微量元件的方法。 单一柔性微元件限定了具有固体区域和由支撑晶片的薄部分组成的柔性区域的支撑体。 该方法包括以下步骤：限定柔性区域的厚度并且将上绝缘层生长到覆盖预定区域的上表面，并将下绝缘层生长到覆盖固体区域的下表面。 该方法包括在上表面的预定区域上限定导电层，在覆盖导电层的上表面上沉积最终绝缘层，并在覆盖绝缘层的上表面上沉积金属保护层。 此外，该方法包括蚀刻下表面，直到蚀刻达到柔性区域的厚度，并且在下表面上沉积导电层以建立同轴导体。

公开(公告)号：WO0136321A9

公开(公告)日：2002-07-04

申请号：PCT/US0031749

申请日：2000-11-17

Applicant: UNIV CALIFORNIA

Inventor： HANSFORD DEREK ,  FERRARI MAURO

IPC: B82B3/00 ,  B01D67/00 ,  B01D69/02 ,  B01D71/02 ,  B81B3/00 ,  B81C1/00 ,  B01D63/00 ,  B82B1/00

CPC classification number: B81C1/00158 ,  B01D67/0058 ,  B01D67/0062 ,  B01D67/0072 ,  B01D69/02 ,  B01D71/02 ,  B01D71/022 ,  B01D2325/02 ,  B01D2325/04 ,  B01D2325/08 ,  B81B2201/06 ,  B81B2201/10 ,  B81C2201/0109 ,  B81C2201/014 ,  B81C2201/053

Abstract: A method of forming a membrane with nanometer scale pores includes forming a sacrificial etch stop layer on a substrate. A base layer is constructed on the sacrificial etch stop layer. Micrometer scale pores are formed within the base layer. A sacrificial base layer is built on the base layer. The sacrificial base layer is removed from selected regions of the base layer to define nanometer scale pores within the base layer. The resultant membrane has sub-fifty nanometer pores formed within it.

Abstract translation: 形成具有纳米尺度孔隙的膜的方法包括在基底上形成牺牲蚀刻停止层。 在牺牲蚀刻停止层上构建基层。 在基层内形成微米级的孔。 牺牲基层建在基层上。 牺牲基层从基层的选定区域去除，以在基层内限定纳米尺度的孔。 所得的膜在其内形成有小于50纳米的孔。

公开(公告)号：WO01058803A2

公开(公告)日：2001-08-16

申请号：PCT/DE2000/004673

申请日：2000-12-28

IPC: B81B3/00 ,  B81C1/00 ,  B81C3/00 ,  G01P15/08 ,  G01P15/125 ,  H01L29/84

CPC classification number: B81C1/00801 ,  B81B2203/0136 ,  B81B2203/0315 ,  B81C2201/0109 ,  B81C2201/053 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814

Abstract: The invention relates to a method for producing a micromechanical component (100) that comprises at least one cavity (110) and one functional element (12) at least partially disposed in said cavity (110) and/or one functional layer (13a, 13b, 13c) at least partially disposed therein. The invention further relates to a micromechanical component (100) produced according to the inventive method. The aim of the invention is to reduce the production costs for such a micromechanical component. To this end, the functional element (12) and/or the functional layer (13a, 13b, 13c) is provided with a first protective layer (41; 71) at least in a zone that adjoins a first sacrificial coating (52) that temporarily occupies the space of the cavity (22) subsequently formed in one or more etching steps. The material of the first protective layer (41) is selected in such a manner that at least one etching method and/or etching agent etching or dissolving the first sacrificial coating (52) does substantially not corrode the first protective layer (41; 71) or corrodes it only at a reduced etching rate in relation to the first sacrificial coating (52).

Abstract translation: 本发明涉及一种用于制造微机械部件（100）的方法，设置有至少一个腔（110）和一个至少在所述腔内部分（110）的功能元件（12）和/或至少部分地设置在其中功能层（13A， 13B，13C），以及根据根据有关独立权利要求的前序部分的方法（100）制备的微机械部件。 以降低制造成本，功能元件（12）和/或所述功能层（13A，13B，13C）是相邻于第一牺牲层（52）的区域中的至少该暂时形成在下面的一个或多个蚀刻步骤的空间 空腔（22）占据，其中第一保护层（41; 71）提供（图4;图7），其中，所述第一保护层（41）的材料被选择为使得至少一个第一牺牲层（52）或腐蚀性 。解析度蚀刻和/或蚀刻介质，所述第一保护层（41; 71）基本上仅与相对于所述第一牺牲层（52）蚀刻速度降低的接合或没有。

公开(公告)号：WO00012987A2

公开(公告)日：2000-03-09

申请号：PCT/DE1999/002698

申请日：1999-08-27

IPC: G01P15/125 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C3/00 ,  G01L9/00 ,  G01L9/12 ,  H01L29/84 ,  G01P15/08 ,  H04R7/10

CPC classification number: G01L9/0042 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00896 ,  B81C2201/053 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed is a method for the production of a micromechanical component, comprising the production of a micromechanical component with sensor holes, wherein at least one component protective layer and/or spacer coating is applied on the component before separating the wafer into chips, wherein the component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer. The invention also relates to a micromechanical component produced according to the method disclosed in the invention and to the use of said components in microphones, pressure sensors or acceleration sensors.

Abstract translation: 描述了一种用于在设备上制造微机械部件，其包括产生具有传感器孔的微机械部件的，对芯片的至少一个组件的保护层和/或间隔涂层切割晶片的方法，其中所述成分的保护层至少包含平行于晶片表面和之前施加 垂直于开口的晶片表面的壁的方向密封地覆盖，并且涂层距离至少垂直于密封地覆盖所述开口的晶片表面的壁的方向。 本发明还通过本发明，微机械部件，其在麦克风，压力传感器或加速度传感器的使用方法涉及一种制造。

公开(公告)号：WO98053483A1

公开(公告)日：1998-11-26

申请号：PCT/FR1998/000998

申请日：1998-05-19

IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  H01L21/00

CPC classification number: B81C1/0015 ,  B81B2201/0235 ,  B81C2201/053 ,  G01P15/0802 ,  G01P15/125

Abstract: The invention concerns the production of machined silicon micro-sensors, in particular accelerometers for assistance to navigation in aircraft, and pressure sensors. In order to improve the production of certain active parts of the sensor, and particularly of a beam (32) forming a resonator, whereof the width and thickness characteristics should be well controlled, the method consists in: producing, by micro-machining the silicon on a first plate (30), a beam with thickness equal to the required final thickness, said beam being coated on its top surface with a mask defining the required final width; assembling the plate (30) with another (10); oxidising the two surfaces of the beam to coat them with a thin protective layer; removing, by vertical directional etching, said thin protective layer on the top surface without removing the mask already there; working on the silicon in the zone exposed by the previous operation, using vertical directional etching on the top surface, until all the part of the beam not protected by the mask is eliminated thereby producing the beam with the required width.

Abstract translation: 本发明涉及加工硅微传感器的生产，特别是用于辅助飞行器导航的加速度计和压力传感器。 为了改善传感器的某些有效部件的生产，特别是形成谐振器的梁（32）的生产，其宽度和厚度特性应被良好地控制，该方法包括：通过微加工硅 在第一板（30）上具有厚度等于所需最终厚度的梁，所述梁在其顶表面上涂覆有限定所需最终宽度的掩模; 将板（30）与另一个（10）组装; 氧化梁的两个表面以用薄的保护层涂覆它们; 通过垂直方向蚀刻去除上表面上的薄保护层，而不去除已经存在的掩模; 在上一次操作暴露的区域中的硅上工作，在顶表面上使用垂直方向蚀刻，直到不被掩模保护的光束的所有部分被消除，从而产生具有所需宽度的光束。

公开(公告)号：WO1998011611A1

公开(公告)日：1998-03-19

申请号：PCT/CA1997000584

申请日：1997-08-15

Applicant: INSTITUT NATIONAL D'OPTIQUE

Inventor： INSTITUT NATIONAL D'OPTIQUE ,  JEROMINEK, Hubert ,  RENAUD, Martin ,  SWART, Nicholas, R.

IPC: H01L31/0352

CPC classification number: B81C1/00142 ,  B81B2203/0315 ,  B81C2201/053 ,  G01J5/20

Abstract: The microbridge structure comprises a substrate layer provided with two first electrical contacts, a microstructure provided with two second electrical contacts, and a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer. The micro support extends along a vertical axis. The micro support has a central upper cavity extending along the vertical axis within the micro support. The micro support has a lower end connected to the substrate layer and an upper end connected to the microstructure for supporting the microstructure with respect to the substrate layer. The micro support is a multilayer micro support comprising two conductive paths and a layer made of dielectric material. The conductive paths and the layer of the micro support extend from the upper end to the lower end thereof. The two conductive paths connect respectively the two first contacts to the two second contacts. The present invention is also concerned with a method for forming a microstructure suspended by a micro support.

Abstract translation: 微桥结构包括设置有两个第一电触点的基底层，设置有两个第二电触点的微结构，以及用于将微结构悬置在基底层上方且距离基底层预定距离的微支撑。 微支架沿垂直轴线延伸。 微支架具有在微支架内沿着垂直轴延伸的中心上腔。 微支撑件具有连接到基底层的下端，并且连接到微结构的上端相对于基底层支撑微结构。 微载体是包含两个导电路径和由电介质材料制成的层的多层微载体。 导电路径和微支架的层从其上端延伸到下端。 两个导电路径将两个第一触点分别连接到两个第二触点。 本发明还涉及一种形成由微型载体悬挂的微结构的方法。

公开(公告)号：KR20180033542A

公开(公告)日：2018-04-03

申请号：KR20187005065

申请日：2016-05-25

IPC: B81C1/00

CPC classification number: B81C1/00896 ,  B81B2201/0264 ,  B81C2201/053 ,  H01L2224/73204

Abstract: 본발명은, 마이크로전자부품어셈블리를위한제조방법및 상응하는마이크로전자부품어셈블리에관한것이다. 본발명에따른제조방법은, 제1 표면및 상기제1 표면에마주놓인제2 표면그리고하나이상의측면을갖는센서가제공되는단계를포함하며, 이경우제1 표면이적어도국부적으로검출면을갖는다. 그다음단계에서는, 센서의제1 표면에희생재료가도포되며, 이경우검출면은적어도국부적으로희생재료에의해덮이고, 이희생재료는센서의측면까지연장된다. 또한, 실장면을갖는캐리어가제공된다. 그다음에, 센서가캐리어에전기적으로연결되며, 이때센서의제1 표면과캐리어의실장면이서로간격을두고마주놓인다. 이어서희생재료가제거되는데, 이때검출면에서적어도부분적으로희생재료가제거된다.

公开(公告)号：KR101174937B1

公开(公告)日：2012-08-17

申请号：KR1020077016574

申请日：2005-12-14

Applicant: 엔엑스피 유에스에이, 인코포레이티드

Inventor： 맥도날드,윌리엄,지. ,  후퍼,스티븐,알. ,  세일리언,아르빈드,에스.

IPC: H01L21/00

CPC classification number: B81C1/00309 ,  B81C2201/053

Abstract: 센서(100)를제조하는방법이제공된다. 상기방법은자체상에적어도하나의감지엘리먼트가탑재되는웨이퍼상에사전결정된제1 두께로희생재료(330) - 상기희생층은적어도일부가상기적어도하나의감지엘리먼트상에피착됨 - 를피착하는단계와, 상기웨이퍼위와피착된상기희생재료주변에사전결정된상기제1 두께보다작은사전결정된제2 두께로인캡슐런트층(332)을형성하는단계와, 상기희생재료를제거하는단계를포함한다. 또한, 전술한방법에의해제조되는센서용장치가제공된다.

公开(公告)号：KR1020120047818A

公开(公告)日：2012-05-14

申请号：KR1020110111454

申请日：2011-10-28

Applicant: 엔엑스피 유에스에이, 인코포레이티드

Inventor： 카린,리사에이치. ,  커스트,데이비드더블유. ,  리우,리안준 ,  리우,웨이 ,  몬테즈,루벤비. ,  스타이믈,로버트에프.

IPC: B81C1/00 ,  B81B3/00 ,  G01C19/56

CPC classification number: B81C1/00801 ,  B81B2207/07 ,  B81C2201/053

Abstract: PURPOSE: A micro electronic mechanical system(MEMS) device manufacturing method is provided to protect the rest part of a metal layer by using a protective layer while forming a movable portion for a MEMS device by etching a sacrificial layer. CONSTITUTION: A micro electronic mechanical system device manufacturing method is as follows. A sacrificial layer(34) is formed on a substrate(12). A metal layer(42) is formed on the sacrificial layer. A protective layer(44) is formed on the metal layer. A structure having the rest part of the protective layer formed on the rest part of the metal layer is formed by etching the protective and metal layers. The sacrificial layer is etched. A movable portion of a MEMS is formed.

Abstract translation: 目的：提供微电子机械系统（MEMS）器件制造方法，通过使用保护层来保护金属层的其余部分，同时通过蚀刻牺牲层来形成用于MEMS器件的可移动部分。 构成：微电子机械系统装置的制造方法如下。 牺牲层（34）形成在衬底（12）上。 在牺牲层上形成金属层（42）。 在金属层上形成保护层（44）。 通过蚀刻保护层和金属层，形成具有形成在金属层的其余部分上的保护层的其余部分的结构。 牺牲层被蚀刻。 形成MEMS的可动部分。