公开(公告)号：EP1541654B1

公开(公告)日：2012-02-29

申请号：EP02765410.2

申请日：2002-09-04

Applicant: Namics Corporation ,  Suganuma, Katsuaki

Inventor： KOMAGATA, Michinori,c/o NAMICS CORPORATION ,  SHIRAI, Yukio,c/o NAMICS CORPORATION ,  SUZUKI, Kenichi,c/o NAMICS CORPORATION ,  SUGANUMA, Katsuaki

IPC: C09J9/02 ,  C09J11/04 ,  H01B1/22

CPC classification number: H01B1/22 ,  C08K3/08 ,  C09J9/02 ,  C09J2205/102 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: A conductive adhesive containing conductive particles and resin, and a circuit bonded with this adhesive. This conductive adhesive is characterized in that 30wt% or more of the conductive particles consists substantially of silver and tin, and in that the molar ratio between silver and tin that are the metal components of the conductive adhesive is in the range of 77. 5:22.5 to 0:100.

公开(公告)号：EP2397524A1

公开(公告)日：2011-12-21

申请号：EP10741312.2

申请日：2010-02-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： ONOUE, Tomoaki ,  HIRAYAMA, Masaaki ,  ABURATANI, Yoshiki

IPC: C08L101/12 ,  C08K3/04 ,  C08K7/18 ,  C08K9/02 ,  C09J5/00 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01R11/01

CPC classification number: H05K3/321 ,  H01R4/00 ,  H01R4/04 ,  H01R4/58 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0323 ,  Y10T428/25

Abstract: To provide a conductive resin composition with which high conduction reliability can be ensured, a method for manufacturing, using the composition, an electronic component having high bonding reliability, a bonding method and a bonding structure by which objects to be bonded can be bonded to each other with certainty, and a highly reliable electronic component having the bonding structure.
A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or hard spherical carbon formed by coating the surface of a spherical base carbon particle with pitch-derived fine carbon pieces, is used.
The conductive resin composition is suppled to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.

Abstract translation: 为了提供具有高导通可靠性的导电性树脂组合物，可以确保，对于制造方法，使用该组合物的电子部件具有高接合可靠性，粘合方法以及通过哪些对象待结合可以键合到每个的接合结构 其他与确定性，以及具有该接合结构的高度可靠的电子部件。 的导电性树脂组合物，其包括（a）可固化的树脂和（b）硬质球形碳由球状碳颗粒的表面与由球状碳的表面涂层而形成细碳颗粒和/或硬质球形碳涂敷形成 粒子用沥青衍生的碳细片，被使用。 导电性树脂组合物suppled到一个空间中的至少两个工程分别具有的区域的区域之间，以电连接到海誓山盟，并同时施加的区域之间的压力的导电性树脂组合物固化。

公开(公告)号：EP2303492A1

公开(公告)日：2011-04-06

申请号：EP09769796.5

申请日：2009-06-23

Applicant: Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd.

Inventor： MAGDASSI, Shlomo ,  GROUCHKO, Michael ,  KAMYSHNY, Alexander

IPC: B22F1/02 ,  B22F9/24

CPC classification number: B22F1/0022 ,  B01J13/02 ,  B22F1/0018 ,  B22F1/02 ,  B22F1/025 ,  B22F9/18 ,  B22F9/24 ,  B22F2001/0092 ,  B22F2301/10 ,  B22F2998/00 ,  B82Y30/00 ,  C09D11/30 ,  C09D11/322 ,  C09D11/52 ,  H05K1/097 ,  H05K2201/0218 ,  Y10T428/24901

Abstract: A composition including a plurality of multi-metallic nanoparticles each consisting essentially of a core comprising at least one first metal (Me1) and a continuous shell comprising atoms of at least one second metal (Me2). Optionally, the continuous shell of Me2 atoms protects the Me1 atoms from oxidation at all temperatures less than 150°C.

公开(公告)号：EP2219424A1

公开(公告)日：2010-08-18

申请号：EP10158080.1

申请日：2008-08-19

Applicant: Shocking Technologies Inc

Inventor： Kosowsky, Lex ,  Fleming, Robert ,  Wu, Junjun

IPC: H05K1/02 ,  H01C7/10

CPC classification number: H01C7/1013 ,  B82Y10/00 ,  H01C7/105 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0218 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0738 ,  H05K2203/105

Abstract: Embodiments described herein provide for a composition of voltage switchable dielectric (VSD) material that includes a concentration of modified high-aspect ratio (HAR) particles. In an embodiment, at least a portion of the concentration includes HAR particles are surface-modified to provide core-shell HAR particles. As an alternative or addition, a portion of the concentration includes HAR particles that are surface-modified to have activated surfaces.

Abstract translation: 本文描述的实施例提供了包括经改进的高纵横比（HAR）颗粒浓度的可变压电介质（VSD）材料的组成。 在一个实施方案中，浓度的至少一部分包括HAR颗粒被表面改性以提供核 - 壳HAR颗粒。 作为替代或添加，浓度的一部分包括被表面改性以具有活化表面的HAR颗粒。

公开(公告)号：EP2191043A1

公开(公告)日：2010-06-02

申请号：EP08798196.5

申请日：2008-08-19

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  WU, Junjun

IPC: C25B9/00 ,  G06F19/00

CPC classification number: H01C7/1013 ,  B82Y10/00 ,  H01C7/105 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0218 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0738 ,  H05K2203/105

Abstract: Embodiments described herein provide for a composition of voltage switchable dielectric (VSD) material that includes a concentration of modified high-aspect ratio (HAR) particles. In an embodiment, at least a portion of the concentration includes HAR particles are surface-modified to provide core-shell HAR particles. As an alternative or addition, a portion of the concentration includes HAR particles that are surface-modified to have activated surfaces.

公开(公告)号：EP1808265A4

公开(公告)日：2009-10-21

申请号：EP05805313

申请日：2005-10-27

Applicant: PANASONIC CORP

Inventor： MAEDA TADASHI ,  SAKAI TADAHIKO

IPC: B23K35/362 ,  B23K35/02 ,  B23K35/28 ,  B23K35/30 ,  B23K35/36 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

公开(公告)号：EP1837119A1

公开(公告)日：2007-09-26

申请号：EP05814212.6

申请日：2005-12-06

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： TAKAOKA, Hidekiyo c/o Murata Manufact. Co., LTD., ,  NAKANO, Kosuke c/o Murata Manufacturing Co., LTD.

IPC: B23K35/22 ,  H05K3/34

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

Abstract: In solder paste of the present invention, a first metal powder, a second metal powder, and a third metal powder are dispersed in a flux or a thermosetting resin. The first metal powder includes a first metal material such as Cu, Ag, Au, or Pd that serves as a base metal. In the first metal powder, a second metal material such as Sn or In that has a melting point lower than that of the first metal material is coated on the surface of the first metal material. The second metal powder is made of a metal material such as Sn or In that has a melting point lower than that of the first metal material. The third metal powder such as a Cu, Ag, Au, or Pd powder has an average particle diameter smaller than that of the first metal material and can form compounds with the second metal material and the second metal powder. Accordingly, the likelihood of unreacted components remaining after a heat treatment can be suppressed. Accordingly, even when a reflow treatment is repeated a plurality of times, a decrease in the bonding strength of solder bonding can be prevented.

Abstract translation: 在本发明的焊膏中，将第一金属粉末，第二金属粉末和第三金属粉末分散在助熔剂或热固性树脂中。 第一金属粉末包括用作贱金属的第一金属材料，例如Cu，Ag，Au或Pd。 在第一金属粉末中，在第一金属材料的表面上涂布熔点低于第一金属材料的Sn或In的第二金属材料。 第二金属粉末由熔点低于第一金属材料的Sn或In等金属材料制成。 第三金属粉末如Cu，Ag，Au或Pd粉末的平均粒径小于第一金属材料的平均粒径，并可与第二金属材料和第二金属粉末形成化合物。 因此，可以抑制热处理后残留的未反应成分的可能性。 因此，即使重复多次回流处理，也可以防止焊接接合的接合强度的降低。

公开(公告)号：EP1813654A1

公开(公告)日：2007-08-01

申请号：EP07001889.0

申请日：2007-01-29

Applicant: Yang, Yung-Shu

Inventor： Yang, Yung-Shu

IPC: C09D11/00 ,  C09D11/10 ,  H01B1/22 ,  H05K1/09

CPC classification number: H05K1/095 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H05K2201/0218

Abstract: The present invention provides a radiation curable conductive ink and a manufacturing method for conductive substrate using the conductive ink, wherein components of the radiation curable conductive ink contain at least conductive powder having a covering layer and a photosensitive binder. The radiation curable conductive ink is printed on surface of a substrate using a screen printing method, and a chemical crosslinking reaction is achieved by irradiating the conductive ink with ultraviolet ray, visible light or electron beam, thereby forming a conductive substrate. The conductive substrate is particularly applicable for use in laminate type electronic devices, including radio frequency identification (RFID) antenna, printed-circuit boards, smart cards (non-contact chip cards) components, smart labels, printed electronics, anti-electromagnetic interference (EMI) and anti-electrostatic materials.

Abstract translation: 本发明提供一种可辐射固化的导电油墨和使用该导电油墨的导电基材的制造方法，其中该可辐射固化的导电油墨的组分至少含有具有覆盖层和感光性粘合剂的导电粉末。 使用丝网印刷方法将可辐射固化导电油墨印刷在基板的表面上，并且通过用紫外线，可见光或电子束照射导电油墨从而形成导电基板来实现化学交联反应。 导电基板特别适用于层叠型电子设备，包括射频识别（RFID）天线，印刷电路板，智能卡（非接触式芯片卡）部件，智能标签，印刷电子部件，抗电磁干扰（ EMI）和抗静电材料。

公开(公告)号：EP1796106A1

公开(公告)日：2007-06-13

申请号：EP05776769.1

申请日：2005-09-01

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： ISHIDA, Hiroya

IPC: H01B5/00 ,  H01B5/16 ,  H01B13/00 ,  H01R11/01

CPC classification number: C23C18/1635 ,  C23C18/1651 ,  C23C18/1683 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  H01R13/03 ,  H05K3/323 ,  H05K2201/0218 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: It is the object of the present invention to provide a conductive particle which has excellent adhesion between a base particle and a conductive layer, a conductive layer being resistant to breaking, impact resistance being improved, and an anisotropic conductive material using the conductive particle.
The prevent invention is a conductive particle, which comprises a base particle and a conductive layer formed on a surface of said base particle, said conductive layer having a non-crystal nickel plating layer in contact with the surface of said base particle and a crystal nickel plating layer, and a proportion of a nickel crystal grain aggregate oriented in a nickel (111) plane derived from an integrated intensity ratio in X-ray diffraction measurement being 80% or more.

Abstract translation: 本发明的目的是提供一种导电颗粒，其具有优异的基体颗粒和导电层之间的粘合性，耐断裂性，耐冲击性得到改善的导电层以及使用该导电颗粒的各向异性导电材料。 防止发明是导电性粒子，其包含基体粒子和形成在所述基础粒子的表面上的导电层，所述导电层具有与所述基础粒子的表面接触的非结晶镍镀层和结晶镍 并且在X射线衍射测定中，从镍（111）面取向的镍晶粒聚集体的积分强度比的比例为80％以上。

公开(公告)号：EP1051265A4

公开(公告)日：2004-04-07

申请号：EP99905459

申请日：1999-01-29

Applicant: HENKEL LOCTITE CORP

Inventor： MCARDLE CIARAN B ,  BARNES RORY B

IPC: B05D5/12 ,  B05D3/06 ,  B05D3/14 ,  B05D7/00 ,  B05D7/04 ,  C08F2/46 ,  C08F2/48 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F1/00 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/32

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.